ASIC Verification Engineer - GPU

At NVIDIA, we push the boundaries of computing innovation. Our ASIC Verification Engineers focus on developing the world’s top SoCs and GPUs. Joining us as a Senior ASIC Verification Engineer - GPU means working on modern technology powering consumer graphics and AI applications. This position is ideal for those passionate about technology and eager to impact computing’s future. What you'll be doing: As a key member of our ASIC Verification team, you will verify the design and implementation of the industry's leading GPUs. You will be responsible for verifying the ASIC build, architecture, golden models, and micro-architecture using advanced verification methodologies such as UVM or equivalent. Understand the design and implementation of your unit/cluster/chip, define the verification scope, develop the verification infrastructure, and verify the correctness of the design. Collaborate with architects, designers, and pre- and post-silicon verification teams to accomplish your task. What we need to see: Bachelor's Degree in EE, CS, or CE or equivalent experience. 5+ years of relevant experience. Experience in verification using random stimulus along with functional coverage and assertion-based verification methodologies. Experience with design and verification tools (VCS or equivalent simulation tools, debug tools like Verdi, Indago, GDB). Expertise in System Verilog or similar HVL. Strong debugging and analytical skills. Perl and C/C++ programming language experience desirable. Strong communication skills and the ability & desire to work as a great teammate are huge pluses. Experience in crafting test bench environments for unit and system level verification. #LI-Hybrid Your base salary will be det

NVIDIA has been transforming computer graphics, PC gaming, and accelerated computing for more than 25 years. It’s a unique legacy of innovation that’s fueled by great technology—and amazing people. Today, we’re tapping into the unlimited potential of AI to define the next era of computing. An era in which our GPU acts as the brains of computers, robots, and self-driving cars that can understand the world. Doing what’s never been done before takes vision, innovation, and the world’s best talent. As an NVIDIAN, you’ll be immersed in a diverse, supportive environment where everyone is inspired to do their best work. Come join the team and see how you can make a lasting impact on the world. NVIDIA is seeking best-in-class ASIC Verification Engineers to verify the design and implementation of the world’s leading inference accelerator. This position offers the opportunity to have real impact in a dynamic, technology-focused company impacting product lines ranging from consumer graphics to self-driving cars and the growing field of artificial intelligence. We have crafted a team of outstanding people around the globe. Their mission is to push the frontiers of what is possible today and define the platform for the future of computing. In this position, you will help to build the high-performance processor elements that implement programmable compute and graphics functionality. What you'll be doing: As a key member of our ASIC Verification team, you will verify the design and implementation of inference accelerator You will be responsible for verification of the ASIC design, architecture, reference models and micro-architecture using advanced verification methodologies Understand the design and implementation of your unit, define the verification scope, develop the verification infrastructure and verify the correctness of the design Collaborate with architects, designers, and pre and post silicon verifi

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum IC Substrate Package Layout Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for design of large form factor IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Design of IC substrates using Siemens Xpedition IC package design software - Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Deliver and disseminate design milestones to stakeholders - Design validation and verification; including DRC and LVS - Advanced packaging design integration (2.5D and 3D) with IC substrate - Tapeout of designs with substrate suppliers in collaboration with Intel substrate teams - Communicate designs in presentations and relevant documentation - Stay curre

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role We are seeking a highly skilled Physical Design Engineer with deep expertise in physical design and methodology. This individual contributor role sits within our physical design team and is central to delivering power, performance, and area (PPA) optimized datapath and interconnect solutions for next-generation AI accelerators. You’ll work closely with RTL designers to define and execute on physical design strategies. You will develop tools, flows and methodologies to increase team productivity. Your work will directly impact silicon’s performance and cost efficiency, as well as the team’s execution velocity and quality. In this role, you will: Develop, build and own tools, flows and methodologies for physical implementation Own physical implementation of floorplan blocks from floorplanning to final signoff Collaborate with RTL designers to drive optimal block implementation solutions Analyze and optimize design for timing, power, and area trade-offs, working in collaboration with EDA vendors and ASIC partners Qualifications: BS w/ 4+ or MS with 2+ years or PhD with 0-1 year(s) of relevant industry experience in physical design and methodology development Demonstrated success in taping out complex silicon designs Hands-on experience with block physical implementation and PPA convergence Strong coding experience with python, bazel, TCL Strong experience building physical design tools, flows and methodologies Strong understanding of microarchitecture, RTL design,

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role We are looking for an embedded engineer to help build firmware and associated modeling software for OpenAI’s in house AI accelerator. This role involves designing and developing drivers and functional models for a large array of HW components, writing high throughput and low latency firmware code, investigating bring-up and production issues. Responsibilities Design and implement drivers for hardware peripherals, including those related to AI chips. Design and implement functional software models to simulate SoC uncore logic and enable FW testing against the model Design and implement low-latency and high throughput embedded SW to manage HW resources. Work with adjacent software and hardware teams to implement requirements, debug issues and shape future generations of the hardware. Collaborate with vendors to integrate their technologies within our systems. Bring up and debug firmware/driver on new platforms. Come up with processes and debug issues raised in the field. Set up monitoring, integration testing and diagnostics tools. Qualifications 5+ years of experience working in embedded SW space. Ability to thrive in ambiguity and learn new technologies. Strong programming skills in C/C++ and/or Rust. Experience developing high throughput, low latency and multi-threaded code. Experience working with real time operating systems (RTOS). Experience developing hardware drivers and working with hardware Experience with HW/SW co-design Knowledge of common embedded pr

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. Role Overview We are seeking an experienced ASIC Package Signal Integrity / Power Integrity Engineer to drive electrical architecture, modeling, optimization, and validation for the most advanced AI/HPC silicon and package design. This role focuses on high-speed SerDes and memory channel architecture, advanced 2.5D/3D package SI/PI, substrate to package co-design, power-delivery-network optimization, electromagnetic modeling, and simulation-to-measurement correlation. The ideal candidate has strong hands-on experience with high-speed channel and PDN analysis across ASIC packages, interposers, substrates, and power-delivery structures, and can translate simulation results into practical design requirements for interposers and package substrate design optimization. The engineer will work closely with ASIC, package, system, mechanical, thermal, power, and silicon validation teams from early architecture and feasibility studies through production bring-up. In this role you will Own SI/PI architecture and analysis for advanced AI ASIC packages from early feasibility studies through production. Develop and optimize high-speed electrical channels for 200G/400G SerDes, PCIe, HBM, DDR, and chiplet/die-to-die interfaces. Perform package, interposer and substrate modeling using 2D/3D electromagnetic solvers. Define and optimize package stack-ups, transmission-line structures, via transitions, breakout structures, return paths, ground shielding, bump maps, and ball maps based on SI/PI re