Lead Design and Analysis Engineer (Electrical Systems Design)

Senior Low Observables (LO) Mission Systems Integration Engineer Company: The Boeing Company The Senior LO Mission Systems Integration Engineer will lead design, integration, analysis, test, and production activities for low observable materials, structures, apertures, sensors, and radomes for mission systems. The role requires strong technical leadership, independent execution of complex tasks, advanced use of computational electromagnetic (CEM) solvers, and the ability to produce and defend technical results with minimal oversight. Key Responsibilities Lead design, modeling, and analysis efforts for LO materials, coatings, structures, and integrated mission systems to meet signature reduction and performance requirements. Independently apply CEM solvers (e.g., FEKO, HFSS, CST, WIPL‑D, xFDTD, or equivalent) to model antennas, apertures, radomes, and LO treatments; perform design optimization and trade studies. Drive integration of LO treatments with mechanical, thermal, and sensor/antenna system constraints; identify and mitigate producibility, testability, and sustainment risks. Plan, execute, and oversee laboratory and field tests (anechoic chamber measurements, antenna/radome characterization, RCS measurements); lead data collection, reduction, and validation activities. Develop and validate predictive models, reconcile simulations with measurements, perform uncertainty quantification, and provide actionable recommendations to engineering and program leadership. Produce high-quality technical documentation: test plans, test reports, technical memoranda, design reviews, and customer briefings. Mentor and provide technical oversight to junior engineers and technicians; ensure adherence to engineering processes, qual

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is seeking a senior High Speed Interconnect / Signal Integrity Engineer to design and validate high-bandwidth links for large-scale AI systems. You will define, model, and qualify interconnect solutions across copper and optical technologies for next-generation AI inference and training clusters. This role is on-site in Santa Clara, CA, Austin, TX, or Toronto, Canada. We welcome candidates at various experience levels. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting Who You Are An experienced electrical engineer with a Bachelor’s or Master’s in Electrical Engineering. 5+ years working on high-speed communications (100G–1.6T), including signal integrity, channels, and links. Comfortable building and owning link and channel budgets and making clear tradeoffs between reach, loss, BER, and margin. Hands-on with SI tools and lab equipment such as Keysight ADS, VNAs, TDRs, BERTs, and protocol analyzers. Familiar with cable specification and testing, as well as accelerated life testing, mating life, and failure analysis. Able to collaborate across hardware, systems, and manufacturing teams; manufacturing/DFM/DTM experience is a plus. What We Need Define and specify high-speed interconnect architectures

About the Team Our Robotics team is focused on unlocking general-purpose robotics and pushing towards AGI-level intelligence in dynamic, real-world settings. Working across the entire model stack, we integrate cutting-edge hardware and software to explore a broad range of robotic form factors. We strive to seamlessly blend high-level AI capabilities with the constraints of physical systems to improve people's lives. About the Role We are seeking a lead thermal simulation engineer to help accelerate the design and development of next-generation robotic systems through modeling, simulation, and analysis. You will work closely with mechanical, electrical, controls, and robotics engineers to evaluate designs before hardware is built, identify risks early, and guide critical architecture decisions. This role spans structural and thermal analysis and design across robotic subsystems including actuators, mechanisms, structures, electronics, and integrated systems. You will develop simulation workflows that improve engineering velocity, increase confidence in design decisions, and help us build more capable, reliable, and manufacturable robotic platforms. This role is based in San Francisco, CA. This role will be expected to be in office 4 days per week and offer relocation assistance to new employees. In this role, you will: Perform thermal simulations to assess heat generation, cooling strategies, thermal interfaces, and system-level thermal performance Partner with mechanical, electrical, and controls engineers to influence design decisions early in development Build simulation models to evaluate robotic actuators, transmissions, mechanisms, structures, soft goods, and integrated assemblies Correlate simulation results with physical testing and develop methodologies to improve model accuracy Support architecture trade studies by evaluating design concepts before hardware is built Develop simulation workflows, standards, and best practices that scale across the robotics o

About the Team OpenAI’s Hardware organization develops silicon and system-level solutions designed for the unique demands of advanced AI workloads. The team is responsible for building the next generation of AI-native silicon while working closely with software and research partners to co-design hardware tightly integrated with AI models. In addition to delivering production-grade silicon for OpenAI’s supercomputing infrastructure, the team also creates custom design tools and methodologies that accelerate innovation and enable hardware optimized specifically for AI. About the Role We are looking for an experienced Mechanical Engineer with 7+ years of experience in design of IT hardware from chip/package to system levels. You’ll work alongside experts in thermal, mechanical, electrical, software, and systems engineering to support the design, analysis, and validation of mechanical and thermal systems that ensure the reliability, efficiency, and longevity of mission-critical hardware. This position requires strong analytical skills, hands-on testing experience, and the ability to work in a fast-paced, cross-disciplinary environment. This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance to new employees. In this role, you will: Lead mechanical design for AI supercomputer product in the data center application Collaborate with the cross functional team to design and optimize thermal solutions for data center hardware, including chips, power modules, and system-level cooling architectures Collaborate with cross-functional teams to integrate thermal management strategies into hardware design, from concept to mass production Design and validate mechanical systems, including chassis, enclosures, cooling systems, and high-power connections, ensuring alignment with performance and reliability standards. Perform 3D modeling, FEA, tolerance analysis, and prototyping, ensuring manufacturability and a

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Staff Engineer in Micron’s HBM Product Engineering Component Validation team, you will be an individual contributor responsible for the validation of advanced High Bandwidth Memory (HBM) products. You will use proven knowledge in dynamic random-access memory and high-bandwidth memory architecture to compose validation coverage, implement and analyze validation runs, lead product debug and failure analysis toward a zero-escape validation goal across test modes and product achievements. You will also adopt AI-enabled ways of working, using enterprise AI tools to accelerate your engineering tasks and improve efficiency, work within Micron’s global validation organization and collaborate with groups at different locations. Responsibilities: Translate DRAM/HBM develop intent and architecture into effective verification scope and test cases. Contribute to validation of new and high-risk product features, working with Design Validation, and Systems Engineering. Review design specifications, schematics, and datasheets, provide design feedback and represent the Product Engineering perspective in Design and Verification reviews. Read, analyze, and debug circuit blueprints to detect design-related failure mechanisms, and recommend approaches for verification and fault diagnosis. Perform root-cause analysis and examination of electrical failures (debug) of validation findings, distinguishing developed marginality from process and test-related issues. Apply automation and modern tooling (including

Radiation Environmental Test Engineer (Mid-Level or Senior) Company: The Boeing Company Boeing Missile & Weapons Systems is seeking a Radiation Environmental Test Engineer (Mid-Level or Senior) to lead radiation and environmental test efforts supporting ICBM modernization at the Little Mountain Test Facility in Hill Air Force Base, UT. This hands-on role combines test design, execution, data analysis, and facility/test-stand maintenance. The position supports ongoing modernization efforts to enhance current test capabilities and new developing capabilities—identifying, designing, managing, and integration of new test stands, diagnostics, and data systems to meet evolving mission requirements. Position Responsibilities: Lead and execute complex radiation and environmental test machine design and facility integration Identify interface requirements, CDRLs, configuration control documentation, and change orders Design, specify, and integrate test hardware, sub-assemblies, fixtures, and instrumentation Assist in configuring, validating, and operating data acquisition systems and custom software (LabVIEW) for diagnostics and event capture Support pulse power and flash X-ray systems: theory, operation, diagnostics, and data capture Perform technical evaluation of subcontractors Basic Qualifications (Required Skills and Experience): Bachelor of Science degree in Engineering (with a focus in Electrical, Mechanical or Aeronautical), Computer Science, Data Science, Mathematics, Physics, Chemistry or non-US equivalent qualifications directly related to the work statement Level 3: 5+ years of related work experience and a bachelor’s degree or an equivalent combination of related work