Mechanical Modeling Engineer

About the Team: OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. Role Overview We are seeking a Package Reliability Engineer to lead reliability engineering for advanced packages used in high-performance AI and computing systems. The primary focus of this role is to assess package level mechanical and thermal reliability risks and apply thermal and mechanical modeling to optimize package design, material selection, and assembly processes. The engineer will also develop reliability test plans with external partners, identify failure mechanisms, perform root-cause analysis, and recommend practical corrective actions. In this role, you will assess package reliability risks from early architecture development through product qualification and high-volume manufacturing. You will work closely with package design, silicon design, system engineering, manufacturing, and ASIC partners to predict package behavior, develop qualification strategies, resolve reliability issues, and improve overall package robustness and lifetime. In this role you will: Lead reliability test plan and assessments for advanced HPC packages, including risk identification, potential failure-mechanism analysis, root-cause investigation, mitigation planning, and corrective-action development. Drive reliability-focused package design optimization based on thermo-mechanical modeling to improve package reliability, power integrity, thermal performance, mechanical robustness, and platform scalability. Develop, validate, and apply package reliability models and lifetime-prediction

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Packaging Modeling Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for thermal modeling and simulation of various packaging solutions from silicon redistribution layers to IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Thermal modeling and simulation of packaging hardware to understand how heat flows from silicon test chips through various heat spreader hardware - Manage the overall integration of the packaging hardware and enable co-design between relevant stakeholders - Work closely with mechanical designers to define heat spreaders for optimal performance - Deliver and disseminate design milestones to stakeholders - Communicate designs in presentations and relevant documentation - Stay current with the latest developments in packaging technology and design techniques by attending conferences and rea

Systems Engineer (Modeling & Simulation) (Associate or Mid-Level) Company: The Boeing Company Boeing Defense & Security (BDS) is looking for an Associate or Mid-Level Systems Engineer (Modeling & Simulation) (Level 2 or 3) to join our multi-disciplined engineering team in Albuquerque, New Mexico designing and developing advanced concepts on a DOD propriety program . This position will join a multi-disciplined team of engineers and scientists to develop and test advanced concepts for the Department of Defense. Work could include such things as image processing and analysis, radiometry, modeling and simulation, evaluation of field data to anchor models, and wherever the data may lead throughout the program. The ideal candidate will have strong MATLAB or Mathematic skills, an interest in data analysis; modeling and simulation; and some knowledge of optics and electro-optics. Position Responsibilities: Assists in developing and validating requirements for various electro-optical systems and components Uses data analysis results and output of mod/sim tools to assist in the development and validation of requirements for electro-optical systems, mechanical systems, interconnects and structures Works with engineering teams to collect and analyze data used to anchor models Performs complicated trade studies, modeling, simulation and other forms of analysis to predict component, interconnects and system performance and to optimize design around established requirements Defines and conducts critical analyses of various kinds to validate performance of designs to requirements Defines and conducts tests to validate performance of designs to requirements and anchor models to fi

About the Team OpenAI’s Hardware organization develops silicon and system-level solutions designed for the unique demands of advanced AI workloads. The team is responsible for building the next generation of AI-native silicon while working closely with software and research partners to co-design hardware tightly integrated with AI models. In addition to delivering production-grade silicon for OpenAI’s supercomputing infrastructure, the team also creates custom design tools and methodologies that accelerate innovation and enable hardware optimized specifically for AI. About the Role We are looking for an experienced Mechanical Engineer with 7+ years of experience in design of IT hardware from chip/package to system levels. You’ll work alongside experts in thermal, mechanical, electrical, software, and systems engineering to support the design, analysis, and validation of mechanical and thermal systems that ensure the reliability, efficiency, and longevity of mission-critical hardware. This position requires strong analytical skills, hands-on testing experience, and the ability to work in a fast-paced, cross-disciplinary environment. This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance to new employees. In this role, you will: Lead mechanical design for AI supercomputer product in the data center application Collaborate with the cross functional team to design and optimize thermal solutions for data center hardware, including chips, power modules, and system-level cooling architectures Collaborate with cross-functional teams to integrate thermal management strategies into hardware design, from concept to mass production Design and validate mechanical systems, including chassis, enclosures, cooling systems, and high-power connections, ensuring alignment with performance and reliability standards. Perform 3D modeling, FEA, tolerance analysis, and prototyping, ensuring manufacturability and a

About Graphcore Graphcore is a global leader in artificial intelligence computing systems. We design advanced semiconductors and data center hardware that deliver the specialized processing power needed to advance AI while improving the efficiency required for broad adoption. As part of SoftBank Group, Graphcore belongs to a family of companies developing some of the world’s most transformative technologies. Our new AI Engineering Campus in Austin will play a central role in building the future of AI computing. The Opportunity As a Mechanical Engineering Intern, you will contribute to the mechanical design and thermal validation of advanced AI hardware. Working alongside experienced mechanical and thermal engineers, you will gain hands-on experience with 3D computer-aided design (CAD), laboratory setup, test development, prototype evaluation, and engineering documentation. Type: 12-week summer internship Timing: May - August (exact dates to be confirmed) Commitment: Full-time What You’ll Do Contribute to mechanical design activities using Creo or comparable 3D CAD software, including part modeling, assemblies, drawings, and design updates under the guidance of experienced engineers. Work with the thermal engineering team to develop test procedures and help set up laboratory capabilities for evaluating AI hardware. Support thermal and mechanical testing using appropriate laboratory equipment; collect, organize, and analyze test data. Assist the mechanical and thermal design teams with prototype evaluation, troubleshooting, design verification, and documentation of findings. Collaborate with cross-functional engineering partners, communicate progress and issues clearly, and follow applicable laboratory and safety procedures. What You’ll Bring Current enrollment in a bachelor's, master's, or doctoral program in mechanical engineering or a related discipline during the internship. Students in other disciplines with relevant mechanical engineering exper

Role Overview We are seeking a Staff Simulation Engineer to build an end-to-end aerial autonomy simulation stack at DoorDash Labs. This is a highly technical, hands-on leadership role focused on defining and implementing the simulation architecture that underpins autonomy development, validation, CI/CD testing, and pilot training. You will operate as the technical authority for simulation: owning core architecture decisions, developing key components yourself, and setting engineering standards. You will build and mentor a small, high-caliber simulation team while remaining deeply involved in implementation and system design. This role is ideal for someone who has built simulation systems from first principles, understands simulator internals deeply, and is excited to create a world-class platform from scratch. Key Responsibilities Architect and implement an end-to-end simulation stack for aerial autonomy at DoorDash Labs.. Develop high-fidelity simulation capabilities, including: Flight dynamics modeling Contact modeling and constraint handling Sensor and perception simulation Autonomy software-in-the-loop (SITL) integration Design and implement scalable simulation infrastructure to support: Regression testing in CI/CD pipelines Continuous validation of flight autonomy and autopilot software stack Mission-level testing and scenario generation Build cloud-deployed simulation systems to enable large-scale parallel testing and pilot training. Partner closely with autonomy, controls, and aircraft teams to ensure simulation fidelity and validation alignment. Establish technical direction, architecture standards, and performance benchmarks for simulation. Mentor and grow a small team of simulation engineers while remaining deeply hands-on. Required Qualifications Master’s or PhD in Computer Science, Electrical Engineering, Mechanical Engineering, Robotics, Aerospace Engineering, or a related field. 10+ years of experience in robotics or physics-based simulation. Deep expe