Job Details: Job Description: The Role and Impact: We are seeking a Manufacturing Quality and Reliability Engineer to join the Foundry QnR team at our Penang site, supporting Intel's advanced packaging programs (EMIB, Foveros). This role spans silicon processing and wafer-level assembly (WLA) flows, and key interfaces with packaging substrates and 2.5D EMIB technology. You will help ensure that products and processes meet rigorous quality and reliability standards from wafer fabrication through packaging and assembly. The position directly influences manufacturing performance, yield, reliability, and customer satisfaction by driving robust quality control, disciplined excursion management, and continuous process improvement. You will also have the opportunity to represent Quality and Reliability in development forums, Silicon and Advanced Packaging factory operations, and Substrate suppliers. Key Responsibilities Apply Advanced Packaging expertise to assess inline process health, excursion impact, yield risk, defect mechanisms, and downstream packaging implications. Collaborate with cross-functional teams to drive effective root cause analysis, systemic corrective and prevention actions using 8D and related problem-solving methodologies. Partner with fab manufacturing, substrates assembly, test, process engineering, and quality teams to strengthen early excursion detection, process controls, in-line screens, and outgoing quality. Drive quality control improvements devising incoming/ outgoing quality controls, using statistical process control, defect pareto analysis, control plans, audit learnings, and excursion prevention indicators across fab, substrate manufacturing, and assembly manufacturing steps. Support manufacturing excursion management, including MRB facilitation, cont

Job Details: Job Description: The Role and Impact Are you ready to make a significant contribution to cutting-edge semiconductor designs? As a DFT Design Engineer, you will play a critical role in shaping the testability, debuggability and reliability of complex SoC (System-on-Chip) designs. You will work closely with cross-functional teams, influencing designs from concept to production, and ensuring our products meet the highest quality standards. In this role, you will develop innovative DFT/DFD methodologies, optimize workflow with AI, and enhance post silicon efficiency. Your work will directly impact Intel's ability to deliver world-class semiconductor solutions that advance technology across industries. Key Responsibilities : Develop and implement advanced DFT methodologies for complex SoC designs to maximize test coverage and efficiency. Collaborate with design, verification, and manufacturing teams to define and optimize post silicon strategies and requirements. Integrate DFT/DFD features into RTL and ensure verification of design for testability requirements. Collaborate with post-silicon teams to debug and validate DFT features. Stay current with emerging trends, AI adoption and technologies in DFT/DFD to ensure best practices are incorporated into workflows. Qualifications: Minimum Qualifications : Bachelor's degree in Electrical Engineering, Computer Engineering, or a related field. 5+ years of experience in DFT, SoC design, or related semiconductor design areas. Expertise in RTL design using hardware description languages like Verilog, VHDL, or SystemVerilog. Preferred Qualifications : Familiar with AI application. Familiarity w

Job Details: Job Description: The Role and Impact Join Intel as a Module Engineer, where you will play a pivotal role in enhancing the production of advanced integrated circuits. In this position, you will own and optimize high-volume manufacturing equipment and processes, ensuring precision and minimizing defects. Your contributions will directly impact manufacturing efficiency, quality, and scalability, enabling Intel to maintain its leadership in semiconductor innovation. Business Group The role is part of Intel's Assembly Test Manufacturing (ATM) division, which serves as the backbone of Intel's back-end manufacturing operations. ATM supports Intel's diverse portfolio of products across key business segments, including client, server, automotive, and connectivity. The group focuses on advanced packaging and manufacturing technologies to deliver competitive solutions, aligning with Intel's IDM 2.0 strategy to drive innovation and global leadership. Key Responsibilities Own and optimize high-volume manufacturing equipment and processes to achieve production efficiency, quality, and cost goals. Conduct tests and measurements to control critical dimensions and minimize defectivity in production lines. Recommend and implement modifications to improve operational efficiencies, manufacturing techniques, and output performance. Expand high-volume manufacturing capacity to demonstrate technology capabilities and ensure seamless transfer to global manufacturing sites. Execute equipment maintenance, repair activities, and continuous improvement initiatives aligned with safety, quality, productivity, and yield metrics. Develop systems for excursion prevention and identify discrepant material or activities within equipment and processes. Manage equipm