Dram Device And Process Modeling Engineer in United States

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Overlay Strategy, Roadmap & Technical Leadership Own the overlay roadmap including bond overlay technologies. Serve as the technical authority for overlay, defining overlay specifications, error budgets, mark strategies, technical signoff criteria, and scaling requirements for future technology nodes. Develop innovative overlay solutions that enable advanced bonding while meeting performance, yield, manufacturability, and scaling objectives. Drive advancement of overlay metrology, automation, process control, modeling, and analytics capabilities in partnership with Process and Metrology teams. Apply advanced analytics, Artificial Intelligence, simulation, and experimental methodologies to accelerate learning, identify root causes, and improve overlay performance. Technology Development & Problem Solving Lead simulation and experimental process development activities, balancing modeling with hands-on characterization and technology development. Develop and maintain overlay error budgets, validation plans, experiments, and technical assessments that connect process behavior to device and integration requirements. Solve complex overlay challenges involving alignment, distortion, deformation, process interactions, and bonded wafers. Translate technical findings into actionable process improvements, technology decisions, and roadmap recommendations. <

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are transforming how the world uses information to enrich life for all. Within our DRAM organization, we develop next-generation memory technologies in an industry-leading 300mm R&D environment, bringing together expertise across process development, design, modeling, characterization, reliability, and manufacturing. Our team works collaboratively to advance memory scaling while improving performance and manufacturability. As a Process Integration Engineer, you will help enable state-of-the-art DRAM technologies and solve complex integration, device, yield, and circuit challenges. You will work closely with cross-functional engineering teams to optimize process flows, improve yield and margin, and translate technical data into solutions that enable future generations of memory technology. Responsibilities: Lead technology integration activities to enable manufacturability of advanced DRAM technologies Partner with process development, product engineering, design, yield, mask, and probe teams to resolve yield, performance, reliability, and margin challenges Design and implement R&D fab experiments and optimize process flows to meet product and technology requirements Analyze inline, defect, parametric

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in artificial intelligence possible! We do it all while committing to integrity, sustainability, and giving back to our communities, because doing so can fuel the very innovation we are pursuing. As a process integration engineer in the DRAM organization, you will be part of a team of world-class engineers who are working in an industry leading 300mm R&D facility on technology which enables future memory scaling. You will focus on the performance and manufacturability of Micron’s cutting-edge next-generation memories. Areas of concentration will include integration and circuit issues specific to DRAM technology. In addition to a broad basis of process integration knowledge, this position will require a strong background in semiconductor device physics. Role interacts significantly with the process development, simulation, modeling, characterization, and reliability groups. Responsibilities include, but not limited to: Lead technology integration activities in enabling manufacturability of state-of-the-art DRAM technology Engage with numerous cross-functional teams including process development, product engineering, design, yield improvement, advanced mask and probe to arrive at solutions to

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron has an opening for a Photolithography Engineer (Level 2 or 3) at our Boise, Idaho facility. This position is part of Micron’s Technology Development organization, where advanced ideas become manufacturable technologies. Our team works at the leading edge of memory innovation, partnering across design, integration, manufacturing, and equipment suppliers to enable the next generation of semiconductor devices. This is where curiosity, experimentation, and impact come together. As a Photolithography Engineer, you will play a key role in developing and integrating lithography processes that directly shape future memory technologies. You will work hands-on with tools, materials, layouts, and data, while leveraging Artificial Intelligence and other software, collaborating with global partners to move innovations from R&D into high-volume manufacturing. This role offers broad technical exposure and the opportunity to influence device performance, yield, and cost at scale. Responsibilities: Develop and integrate photolithography unit processes for advanced memory technologies Perform material evaluations, reticle, and layout development, OPC, overlay optimization, and process window analysis Drive yield improvement, failure analysis, and device performance optimization Partner with equipment vendors to evaluate tools and improve process capability Document processes, communicate results, and support technology transfer to manufacturing Leverage Artifi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Product Engineer in Node Development group, you will be part of a forward-thinking team of engineers that solves complex problems to develop industry leading DRAM! You will engage on new technology at design start and be part of a team responsible for delivering technology to enable the full product portfolio, initial device qualification and production ramp. This will be accomplished through innovation and by cross-functional engagement with partner groups; Design, Test, Technology Development, Marketing, Manufacturing and Quality Assurance departments to co-optimize product and process. While you may not exhibit all of the characteristics/skills listed below today, we are highly interested in a teammate who is motivated to grow in technical breadth and depth. Suppose you are open to learning while being a valued member of a team of world-class engineers. In that case, we are determined to help build upon your existing foundation, while focusing on your individual and collaborative skills in this exciting and outstanding opportunity. Responsibilities Include: Enable new process node startup, qualification, yield, and ramp Collaborate with internal engineering groups; Design, Technology Development, Design for Test, and Quality teams to understand yield issues and priorities. Provide direction to development teams using thorough knowledge for process integration Develop and key metrics for feedback on a new technology Support design verification and validation using CAD tools and simulation

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Metrology Overlay Process Development Engineer you will be primarily responsible for starting up, developing, and optimizing the overlay metrology processes used for DRAM photolithography process flows. Overlay metrology is a critical need within the semiconductor industry, and in this position your responsibilities will include, but are not limited to: · Driving the understanding of new metrology technology and measurement techniques to ensure that our overlay measurement capabilities meet the precision, accuracy, and throughput required to meet our device overlay roadmaps · Partnering with metrology equipment vendors on continuous improvement of software/hardware and development of overlay techniques to support lithography process characterization, process optimization, and process control · Optimizing and maintaining the calibration of metrology systems that support our technology development · Working closely with process development and process integration engineers to optimize measurements for multiple device process flows and layer stacks · Developing applications on next generation processes and technologies within Fab 4 and qualification for tech

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we are transforming how the world uses information to enrich life through innovative memory and storage solutions. The DRAM Thin Films Process Engineering team develops advanced materials and deposition processes that enable future memory scaling, improved device performance, and next-generation semiconductor technology. Our team works at the forefront of process development to support DRAM technologies that power artificial intelligence, cloud computing, and data-intensive applications. As a DRAM Thin Films Process Engineering Intern, you will work alongside experienced engineers on a high-impact summer project focused on semiconductor process development and optimization. This role provides hands-on experience with experimental design, process characterization, data analysis, and multi-functional collaboration. You will contribute to real engineering challenges and present your results to technical and leadership audiences at the conclusion of the internship. Responsibilities Research and develop innovative solutions that support next-generation memory technology and thin film process advancement. Develop, complete, and analyze experiments to improve thin films process performance, manufacturability, and product quality. Apply statistical analysis, data science techniques, and AI-enabled tools to identify process trends, optimize performance, and accelerate engineering decision-making. Partner with process, equipment, and integration engineering teams to solve complex technic

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Technical Strategy & Innovation Define and execute the technical roadmap for Advanced DRAM Films development. Provide technical leadership across Epi, device films, hardmask technologies, HAR deposition, and diffusion processes. Drive innovative process solutions that enable future technology nodes while meeting manufacturability, yield, reliability, and cost objectives. Partner with Process Integration and cross-functional teams to resolve critical technology challenges. Leverage Artificial Intelligence to enhance problem solving across technical and logistical spaces. Organizational Leadership & Team Development Lead, coach, and develop a growing organization of engineers, technical leads, and future managers. Foster a culture of technical excellence, innovation, accountability, collaboration, and ownership. Develop talent through mentoring, succession planning, talent management, and strategic hiring. Create an environment that accelerates learning, encourages technical curiosity, and enables career growth for engineers at all levels. Drive high levels of team member engagement by cultivating an inclusive, supportive, and high-performing culture where employees feel valued, empowered, and connected to Micron's mission and business objectives. Champion employee development, recognition, feedback, and wellbeing

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The TD Electrical Device Characterization team pushes the boundaries of Micron’s memory technology. We explore device behavior, uncover insights through data, and collaborate across engineering teams to enable next-generation products. We are a hands-on team that values curiosity, precision, technical rigor, and collaboration. In this role, you will drive electrical characterization for advanced memory technologies and partner with device, process, and product teams to turn measurements into actionable technical insights. Your work will help guide technology development and shape the performance and reliability of future NAND, DRAM, and emerging memory products. Responsibilities: Lead electrical characterization for advanced memory devices Develop measurement methods, algorithms, and scalable characterization standards Automate data pipelines and analysis using Python, JSL, C/C&#43;&#43;, and dashboard tools Architect test setups and manage wafer probe and ATE test flows Investigate device behavior, identify root causes, and communicate technical findings Minimum Qualifications: <span style="color:#6

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Staff Design Engineer is responsible for designing, simulating, and optimizing DRAM circuits while supporting the development of digital and analog circuitry used in advanced memory products. This role collaborates globally across design, verification, product engineering, test, probe, process integration, assembly, and marketing to ensure manufacturable, high‑quality, cost‑optimized solutions. The position drives innovation in future memory generations and contributes to silicon‑to‑system development in a dynamic engineering environment. Responsibilities Design digital, analog, and memory core circuits using CMOS logic and transistors, implementing device specifications from concept to solution. Utilize AI-Enabled tools to assist with schematic editing, data collection and layout floorplan. Create optimized floorplans for circuit placement, routing, power delivery, sense margins, array timing, and die size, including layout leadership. Conduct circuit simulations using FINESIM, HSPICE, and VERILOG; analyze power, performance, reliability, and parasitic impacts. Validate builds through reticle experiments, tape‑out revisions, and simulation‑to‑silicon correlation, identifying required schematic edits. Prepare and maintain design documentation while contributing to best‑known practices and departmental training. Collaborate with global build, verification, product engineering, test, probe, process integration, assembly, and marketing teams to ensure manufacturability and quality. <l

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an Intern Product Yield Enhancement (PYE) Engineer at Micron Technology Inc., you will assist in taking next generation DRAM devices from design to mass production! PYE Engineers are crucial partners between Research and Development, Manufacturing, Product Engineering and Global Quality teams. Our goal is to offer hands-on and substantial engineering projects that allow interns to gain valuable experience with memory systems and the product life cycle while adding impact to Micron’s business. Our intern programs help prepare engineers for future roles and offer an extraordinary experience that supplements your academic experience! The PYE Engineering role is critical to Micron as it serves the company's charter to be the most cost-effective producer of DRAM memory while delivering the quality and reliability that customers expect from the Micron brand. This position is for a 3-month internship. Responsibilities: Your job duties will include detailed DRAM electrical and physical failure analysis. Identify defects introduced by the semiconductor fabrication process. You will data mine using statistical analysis, AI assisted engineering tools, and automation workflows. Find the root cause of failure mechanisms, communicating results with Management, Product, Process and Test Engineering teams. Complete 3-month internship. Minimum Qualifications: Must be pursuing a minimum of a bachelor’s degree in Electrical Engineering, Computer Engineering,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Design Technology Co-Optimization (DTCO) team works at the intersection of process technology, standard cell architecture, and design implementation to optimize power, performance, and area (PPA) for advanced memory products. The team collaborates closely with standard cell library, RTL, and physical design engineers to evaluate design tradeoffs and develop methodologies that improve silicon outcomes. As a DTCO Intern, you will gain hands-on experience assessing and optimizing PPA at the standard cell and logic block level. You will use industry-standard place-and-route tools and AI-enabled automation techniques to implement, benchmark, and optimize logic blocks while developing practical skills in physical design, timing closure, and design analysis. Responsibilities Implement standard cell logic blocks using industry-standard physical design tools, including floorplanning, placement, clock tree synthesis (CTS), routing, and optimization activities focused on PPA assessment. Analyze and benchmark power, performance, and area across standard cell libraries and logic block configurations, identifying opportunities for improvement. Perform static timing analysis (STA), investigate setup and hold timing violations, and support timing closure activities. Execute physical verification checks, including DRC, LVS, and IR-drop analysis, and assist with resolving design issues. Leverage Generative AI, AI Assistants, and Agentic AI solutions to automate data collection, reporting, comparison, and w

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s DRAM Design Engineering Group (DDEG) is where innovation meets excellence. We are advancing memory and storage technologies through collaborative engineering and creative problem-solving. Our team works at the forefront of semiconductor design, developing solutions that shape the future of memory products in a fast-paced, learning-focused environment. As a Design Verification Engineer, you will help develop next-generation memory technologies by verifying and optimizing digital and analog circuit designs. In this role, you will work closely with global multi-functional teams across the product lifecycle to deliver high-quality, manufacturable memory solutions that meet performance, reliability, cost, and customer requirements. Your work will directly contribute to bringing advanced memory products from concept to production. Responsibilities: Verify circuit functionality, reliability, power, and compliance with product specifications Drive verification planning, coverage closure, circuit debug, and design improvements Perform circuit modeling and simulation using industry-standard tools Support silicon validation, reticle experiments, and tape-out activities Partner with engineering, manufacturing, and product teams to deliver manufacturable designs Minimum Qualifications: Bachelor’s degree in Electrical Engineering or a related field 4&#43; years of semiconductor design, verifi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s DRAM Product Architecture Group partners across fabs, test, module, and system teams worldwide to deliver high-performance memory products. We work across geographies and functions to solve complex technical challenges, drive product innovation, and enable industry-leading DRAM solutions. Our team values collaboration, continuous learning, and making a measurable impact through engineering excellence. As a New College Graduate DRAM Yield & Quality Engineer, you will play a key role in monitoring and improving the health of Micron’s server DRAM products. Working with experienced engineers and cross-functional teams around the globe, you will analyze product and manufacturing data, investigate technical issues, and contribute to strategies that improve yield, quality, and performance throughout the product lifecycle. This is a highly visible role with direct impact on customer success and product reliability. Responsibilities Analyze silicon parametric, test, and manufacturing data to identify trends, resolve product issues, and support root cause investigations. Contribute to yield and quality improvement initiatives across new product introduction (NPI), qualification, ramp, and high-volume manufacturing. Collaborate with fab, test, module, quality, and operations teams to drive execution of product health objectives. Develop and maintain automation solutions to improve engineering efficiency, data analysis, and reporting. Apply AI, Agentic AI, and Generative AI tools to en

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron Technology, we transform how the world uses information to enrich life for all. The Heterogeneous Integration Group (HIG) HBM Architecture team develops next-generation High-Bandwidth Memory (HBM) solutions that power AI, high-performance computing, cloud infrastructure, and advanced networking systems. The team works across architecture, design, verification, packaging, product engineering, and technology development to evaluate innovative memory architectures and deliver scalable, high-performance semiconductor solutions. As an HBM Design Architect, New College Graduate, you will contribute to the evaluation and development of future HBM and DRAM architectures. Working with experienced architects and engineering teams, you will analyze system and block-level design tradeoffs related to performance, power, area, thermal behavior, reliability, and manufacturability. This role provides an opportunity to leverage AI, Large Language Models (LLMs), and data-driven engineering methodologies to accelerate architecture exploration and improve decision-making. Responsibilities Analyze HBM and DRAM architectures using analytic