Dry Etch Principal Engineer Mts Lead Jobs

Dry Etch Principal Engineer/ MTS Lead, Process Development, Advance NAND — Fab 10N/X, Singapore. Apply via Workday.

Dry Etch MTS/Principal Engineer, Process Development SG, Advanced NAND — Fab 10N/X, Singapore. Apply via Workday.

Dry Etch MTS/Principal Engineer, Process Development SG, Advanced NAND — Fab 10N/X, Singapore. Apply via Workday.

Principal Engineer / MTS – NAND Process Pathfinding – Dry Etch — Fab 10N/X, Singapore. Apply via Workday.

Dry Etch Staff/Principal Engineer - Advanced NAND — Fab 10N/X, Singapore. Apply via Workday.

Dry Etch Principal Process Development Engineer — Boise, ID - Main Site. Apply via Workday.

Dry Etch MDE Principal Lead Engineer — Boise, ID - Main Site. Apply via Workday.

Principal Engineer - Dry Etch, Operations Central Teams - Advanced Development Team — Hiroshima - Fab 15, Japan. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Position Overview: As a Staff/Principal Equipment Engineer within PROCT ADT, you will provide technical leadership to improve equipment performance, capability, and global manufacturing outcomes. You will lead complex, multi-site initiatives to resolve equipment challenges, enable technology node readiness, and drive yield and defectivity improvements. This role requires deep expertise, strong ownership, and the ability to influence across teams and suppliers to deliver measurable impact in cost, performance, and scalability. Responsibilities Lead global ownership of equipment performance across toolsets, driving improvements in stability, availability, matching, and efficiency. Direct complex, multi-fab root cause analysis for equipment-driven yield, defectivity, and reliability issues using data-driven and physics-based approaches. Provide technical leadership in tool hardware and chamber behavior to expand process capability and improve performance limits. Partner with Technology Development, integration, and process teams to enable node readiness, volume ramp, and disciplined change control. Influence equipment supplier strategy by leading technical engagements, driving design improvements, and aligning roadmaps to business needs. Drive global standardization through development, validation, and deployment of Best Known Methods (BKMs) across sites. Lead initiatives to improve cost of ownership, reduce variation,

Principal Engineer – NAND Process Pathfinding – Dry Etch — Fab 10N/X, Singapore. Apply via Workday.

PRINCIPAL ENGINEER – FE OCT CPEE HVM DRY ETCH — Taichung - Fab 16, Taiwan. Apply via Workday.

PRINCIPAL ENGINEER – FE OCT CPEE HVM DRY ETCH — 2 Locations. Apply via Workday.

Principal Engineer – Process Development, Dry Etch, NAND — Fab 10N/X, Singapore. Apply via Workday.

Staff/Principal Engineer, Operations Central Team Dry Etch Tool Installation Qualification — Hiroshima - Fab 15, Japan. Apply via Workday.

Principal Engineer, Frontend Organizations Central Team, Dry Etch Process — Hiroshima - Fab 15, Japan. Apply via Workday.