[Fab15 HVM] - Dry Etch Process Equipment Engineer — Hiroshima - Fab 15, Japan. Apply via Workday.
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[Fab15 HVM] - Dry Etch Process Equipment Engineer — Hiroshima - Fab 15, Japan. Apply via Workday.
[Fab15 HVM] - Dry Etch Process Equipment Engineer — Hiroshima - Fab 15, Japan. Apply via Workday.
[Fab15 HVM] - Dry Etch Process Equipment Engineer — Hiroshima - Fab 15, Japan. Apply via Workday.
[Fab15 HVM] - Dry Etch Process Equipment Engineer — Hiroshima - Fab 15, Japan. Apply via Workday.
[Fab15 HVM] - Dry Etch Process Equipment Engineer — Hiroshima - Fab 15, Japan. Apply via Workday.
[Fab15 HVM] - Dry Etch Process Equipment Engineer — Hiroshima - Fab 15, Japan. Apply via Workday.
[Fab15 HVM] - Dry Etch Process Equipment Engineer — Hiroshima - Fab 15, Japan. Apply via Workday.
Job Details: Job Description: Note: This role requires regular onsite presence to perform essential job responsibilities. This position drives technology development and enablement for both high-volume manufacturing and future process technologies. Responsibilities include providing process integration and equipment solutions, conducting feasibility studies to meet device performance requirements, and leading the design and development of advanced manufacturing processes. The role involves material selection, parameter optimization, metrology, equipment engineering, and system design to enable new product architectures and functional requirements. The successful candidate will lead pathfinding activities that support process and hardware development for next-generation manufacturing technologies and will contribute to technology roadmaps that enable future product innovation. The role also includes identifying and implementing equipment and process improvements to enhance manufacturing efficiency, optimize production output, and improve operational performance. Qualifications: Minimum Qualifications Master's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related STEM field, with 6+ years of semiconductor industry experience , primarily in dry etch process development. Bachelor's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related STEM field, with 9+ years of semiconductor industry experience , primarily in dry etch process development. 3+ years of experience collaborating with equipment suppliers (e.g., Lam Research, TEL, Applied Materials, Hit
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Position Overview: As a Staff/Principal Equipment Engineer within PROCT ADT, you will provide technical leadership to improve equipment performance, capability, and global manufacturing outcomes. You will lead complex, multi-site initiatives to resolve equipment challenges, enable technology node readiness, and drive yield and defectivity improvements. This role requires deep expertise, strong ownership, and the ability to influence across teams and suppliers to deliver measurable impact in cost, performance, and scalability. Responsibilities Lead global ownership of equipment performance across toolsets, driving improvements in stability, availability, matching, and efficiency. Direct complex, multi-fab root cause analysis for equipment-driven yield, defectivity, and reliability issues using data-driven and physics-based approaches. Provide technical leadership in tool hardware and chamber behavior to expand process capability and improve performance limits. Partner with Technology Development, integration, and process teams to enable node readiness, volume ramp, and disciplined change control. Influence equipment supplier strategy by leading technical engagements, driving design improvements, and aligning roadmaps to business needs. Drive global standardization through development, validation, and deployment of Best Known Methods (BKMs) across sites. Lead initiatives to improve cost of ownership, reduce variation,
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is advancing a historic $15 billion investment in semiconductor manufacturing in Boise, Idaho, with DRAM production planned for the second half of the decade. As a global leader in memory and storage solutions, Micron is investing more than $150 billion worldwide over the next decade to expand groundbreaking manufacturing capabilities and drive innovation across the semiconductor industry. Join the Boise expansion team and help build the future of semiconductor manufacturing. You will work alongside experienced engineers to develop advanced processes, solve complex manufacturing challenges, and support the production of technologies that power everything from artificial intelligence to next-generation computing systems. As a Dry Etch Process Engineer, you will contribute to the development, optimization, and sustainment of semiconductor manufacturing processes. You will gain hands-on experience in a brand new fabrication environment, working with multi-functional teams to improve yield, quality, reliability, and productivity. This is an excellent opportunity to apply engineering fundamentals, develop technical expertise, and grow your career in semiconductor manufacturing. Responsibilities Support the development and optimization of dry etch processes to improve product performance, yield, and manufacturing efficiency. Analyze process and manufacturing data to identify trends, solve issues, and implement corrective actions. Partner with process integration, equipment,
Staff Engineer, Advanced Development Process and Equipment, Dry Etch — Hiroshima - Fab 15, Japan. Apply via Workday.
Job Details: Job Description: This is a central requisition for all Ocotillo Technology Fabrication (OTF) functional areas. Successful candidates will be aligned to the areas that match best with factory needs. Join Intel and build a better tomorrow. Intel is in the midst of an exciting transformation, with a vision to create and extend computing technology to connect and enrich the lives of every person on Earth. Our high-volume manufacturing facility in Chandler, Arizona is looking for amazing talent. Join and help us create the next generation of technologies that will shape the future for decades to come. The Ocotillo Technology Fabrication (OTF) Module Engineer role is multifaceted. The ideal candidate will have a passion for instrumentation and equipment with the goal of developing a robust manufacturable process module. This is a central requisition for all functional areas: Litho, Wet Etch, Dry Etch, Diffusion, Implant, Planar and Thin Films. Successful candidates will be aligned to the areas that match best with factory needs. As an OTF Module Engineer you will play an important role in the OTF engineering team. You will be responsible for owning all aspects of one or more of the factory's 300mm toolsets. Your sustaining responsibilities will include the safety and cleanliness of your area and ensuring Copy Exactly for your toolset. You will also be expected to review the relevant control charts and tool output daily and ensure your toolset and layers remain excursion free. You will be responsible for delivering Model of Record (MOR) availability and achieving 100 percent matching for all relevant operations. For new technology start-ups, you will be responsible for tool installations, conversions, and qualifications; and sustained matching performance. You will be expected to drive continuous improvement in the he
Job Details: Job Description: This is a central requisition for all Ocotillo Technology Fabrication (OTF) functional areas. Successful candidates will be aligned to the areas that match best with factory needs. Join Intel and build a better tomorrow. Intel is in the midst of an exciting transformation, with a vision to create and extend computing technology to connect and enrich the lives of every person on Earth. Our high-volume manufacturing facility in Chandler, Arizona is looking for amazing talent. Join and help us create the next generation of technologies that will shape the future for decades to come. The Ocotillo Technology Fabrication (OTF) Module Engineer role is multifaceted. The ideal candidate will have a passion for instrumentation and equipment with the goal of developing a robust manufacturable process module. This is a central requisition for all functional areas: Litho, Wet Etch, Dry Etch, Diffusion, Implant, Planar and Thin Films. Successful candidates will be aligned to the areas that match best with factory needs. As an OTF Module Engineer you will play an important role in the OTF engineering team. You will be responsible for owning all aspects of one or more of the factory's 300mm toolsets. Your sustaining responsibilities will include the safety and cleanliness of your area and ensuring Copy Exactly for your toolset. You will also be expected to review the relevant control charts and tool output daily and ensure your toolset and layers remain excursion free. You will be responsible for delivering Model of Record (MOR) availability and achieving 100 percent matching for all relevant operations. For new technology start-ups, you will be responsible for tool installations, conversions, and qualifications; and sustained matching performance. You will be expected to drive continuous improvement in the health and matching of your to
Intern – Dry Etch Process and Equipment — Fab 10N/X, Singapore. Apply via Workday.
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