Mechanical Modeling Engineer in United States

About the Team: OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. Role Overview We are seeking a Package Reliability Engineer to lead reliability engineering for advanced packages used in high-performance AI and computing systems. The primary focus of this role is to assess package level mechanical and thermal reliability risks and apply thermal and mechanical modeling to optimize package design, material selection, and assembly processes. The engineer will also develop reliability test plans with external partners, identify failure mechanisms, perform root-cause analysis, and recommend practical corrective actions. In this role, you will assess package reliability risks from early architecture development through product qualification and high-volume manufacturing. You will work closely with package design, silicon design, system engineering, manufacturing, and ASIC partners to predict package behavior, develop qualification strategies, resolve reliability issues, and improve overall package robustness and lifetime. In this role you will: Lead reliability test plan and assessments for advanced HPC packages, including risk identification, potential failure-mechanism analysis, root-cause investigation, mitigation planning, and corrective-action development. Drive reliability-focused package design optimization based on thermo-mechanical modeling to improve package reliability, power integrity, thermal performance, mechanical robustness, and platform scalability. Develop, validate, and apply package reliability models and lifetime-prediction

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Packaging Modeling Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for thermal modeling and simulation of various packaging solutions from silicon redistribution layers to IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Thermal modeling and simulation of packaging hardware to understand how heat flows from silicon test chips through various heat spreader hardware - Manage the overall integration of the packaging hardware and enable co-design between relevant stakeholders - Work closely with mechanical designers to define heat spreaders for optimal performance - Deliver and disseminate design milestones to stakeholders - Communicate designs in presentations and relevant documentation - Stay current with the latest developments in packaging technology and design techniques by attending conferences and rea

Systems Engineer (Modeling & Simulation) (Associate or Mid-Level) Company: The Boeing Company Boeing Defense & Security (BDS) is looking for an Associate or Mid-Level Systems Engineer (Modeling & Simulation) (Level 2 or 3) to join our multi-disciplined engineering team in Albuquerque, New Mexico designing and developing advanced concepts on a DOD propriety program . This position will join a multi-disciplined team of engineers and scientists to develop and test advanced concepts for the Department of Defense. Work could include such things as image processing and analysis, radiometry, modeling and simulation, evaluation of field data to anchor models, and wherever the data may lead throughout the program. The ideal candidate will have strong MATLAB or Mathematic skills, an interest in data analysis; modeling and simulation; and some knowledge of optics and electro-optics. Position Responsibilities: Assists in developing and validating requirements for various electro-optical systems and components Uses data analysis results and output of mod/sim tools to assist in the development and validation of requirements for electro-optical systems, mechanical systems, interconnects and structures Works with engineering teams to collect and analyze data used to anchor models Performs complicated trade studies, modeling, simulation and other forms of analysis to predict component, interconnects and system performance and to optimize design around established requirements Defines and conducts critical analyses of various kinds to validate performance of designs to requirements Defines and conducts tests to validate performance of designs to requirements and anchor models to fi

About Graphcore Graphcore is a global leader in artificial intelligence computing systems. We design advanced semiconductors and data center hardware that deliver the specialized processing power needed to advance AI while improving the efficiency required for broad adoption. As part of SoftBank Group, Graphcore belongs to a family of companies developing some of the world’s most transformative technologies. Our new AI Engineering Campus in Austin will play a central role in building the future of AI computing. The Opportunity As a Mechanical Engineering Intern, you will contribute to the mechanical design and thermal validation of advanced AI hardware. Working alongside experienced mechanical and thermal engineers, you will gain hands-on experience with 3D computer-aided design (CAD), laboratory setup, test development, prototype evaluation, and engineering documentation. Type: 12-week summer internship Timing: May - August (exact dates to be confirmed) Commitment: Full-time What You’ll Do Contribute to mechanical design activities using Creo or comparable 3D CAD software, including part modeling, assemblies, drawings, and design updates under the guidance of experienced engineers. Work with the thermal engineering team to develop test procedures and help set up laboratory capabilities for evaluating AI hardware. Support thermal and mechanical testing using appropriate laboratory equipment; collect, organize, and analyze test data. Assist the mechanical and thermal design teams with prototype evaluation, troubleshooting, design verification, and documentation of findings. Collaborate with cross-functional engineering partners, communicate progress and issues clearly, and follow applicable laboratory and safety procedures. What You’ll Bring Current enrollment in a bachelor's, master's, or doctoral program in mechanical engineering or a related discipline during the internship. Students in other disciplines with relevant mechanical engineering exper

About the Team OpenAI’s Hardware organization develops silicon and system-level solutions designed for the unique demands of advanced AI workloads. The team is responsible for building the next generation of AI-native silicon while working closely with software and research partners to co-design hardware tightly integrated with AI models. In addition to delivering production-grade silicon for OpenAI’s supercomputing infrastructure, the team also creates custom design tools and methodologies that accelerate innovation and enable hardware optimized specifically for AI. About the Role We are looking for an experienced Mechanical Engineer with 7+ years of experience in design of IT hardware from chip/package to system levels. You’ll work alongside experts in thermal, mechanical, electrical, software, and systems engineering to support the design, analysis, and validation of mechanical and thermal systems that ensure the reliability, efficiency, and longevity of mission-critical hardware. This position requires strong analytical skills, hands-on testing experience, and the ability to work in a fast-paced, cross-disciplinary environment. This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance to new employees. In this role, you will: Lead mechanical design for AI supercomputer product in the data center application Collaborate with the cross functional team to design and optimize thermal solutions for data center hardware, including chips, power modules, and system-level cooling architectures Collaborate with cross-functional teams to integrate thermal management strategies into hardware design, from concept to mass production Design and validate mechanical systems, including chassis, enclosures, cooling systems, and high-power connections, ensuring alignment with performance and reliability standards. Perform 3D modeling, FEA, tolerance analysis, and prototyping, ensuring manufacturability and a

Interactive Design Engineer - HPIQ Description - About The Role As a Product Design Engineer at HP IQ, you’ll work at the intersection of creativity, engineering, and design to develop groundbreaking devices that redefine how people interact with technology. You’ll collaborate closely with industrial designers, hardware engineers, and interaction designers to transform ideas into functional prototypes and production-ready designs. From 3D CAD modeling and hands-on prototyping to engineering analysis and design validation, you’ll help solve complex mechanical challenges and drive designs from early concepts toward production. You’ll have the opportunity to take ownership of meaningful engineering work while learning from an experienced, multidisciplinary team and contributing to products that push the boundaries of what’s possible. What You Might Do Design mechanical parts, components, and assemblies for new consumer devices using 3D CAD (NX) Create detailed 2D engineering drawings, define specifications and tolerances, and work closely with overseas vendor partners to ensure accuracy and quality Design and run experiments, applying engineering analysis and test results to guide design decisions Evaluate materials, manufacturing processes, and design tradeoffs to develop robust and scalable solutions Work cross-functionally with hardware, software, industrial design, and other engineering teams to bring concepts from ideation through development Conceptualize, design, and build prototypes that quickly validate ideas Participate in design reviews, clearly communicating design decisions, technical analysis, and tradeoffs to both technical and non-technical audiences Build, test, troubleshoot, and iterate prototypes to identify issues and improve product performance, reliability, a

Product Design Engineer - HPIQ Description - About The Role As a Product Design Engineer at HP IQ, you’ll work at the intersection of creativity, engineering, and design to develop groundbreaking devices that redefine how people interact with technology. You’ll collaborate closely with industrial designers, hardware engineers, and interaction designers to transform ideas into functional prototypes and production-ready designs. From 3D CAD modeling and hands-on prototyping to engineering analysis and design validation, you’ll help solve complex mechanical challenges and drive designs from early concepts toward production. You’ll have the opportunity to take ownership of meaningful engineering work while learning from an experienced, multidisciplinary team and contributing to products that push the boundaries of what’s possible. What You Might Do Design mechanical parts, components, and assemblies for new consumer devices using 3D CAD (NX) Create detailed 2D engineering drawings, define specifications and tolerances, and work closely with overseas vendor partners to ensure accuracy and quality Design and run experiments, applying engineering analysis and test results to guide design decisions Evaluate materials, manufacturing processes, and design tradeoffs to develop robust and scalable solutions Work cross-functionally with hardware, software, industrial design, and other engineering teams to bring concepts from ideation through development Conceptualize, design, and build prototypes that quickly validate ideas Participate in design reviews, clearly communicating design decisions, technical analysis, and tradeoffs to both technical and

Senior Low Observables (LO) Mission Systems Integration Engineer Company: The Boeing Company The Senior LO Mission Systems Integration Engineer will lead design, integration, analysis, test, and production activities for low observable materials, structures, apertures, sensors, and radomes for mission systems. The role requires strong technical leadership, independent execution of complex tasks, advanced use of computational electromagnetic (CEM) solvers, and the ability to produce and defend technical results with minimal oversight. Key Responsibilities Lead design, modeling, and analysis efforts for LO materials, coatings, structures, and integrated mission systems to meet signature reduction and performance requirements. Independently apply CEM solvers (e.g., FEKO, HFSS, CST, WIPL‑D, xFDTD, or equivalent) to model antennas, apertures, radomes, and LO treatments; perform design optimization and trade studies. Drive integration of LO treatments with mechanical, thermal, and sensor/antenna system constraints; identify and mitigate producibility, testability, and sustainment risks. Plan, execute, and oversee laboratory and field tests (anechoic chamber measurements, antenna/radome characterization, RCS measurements); lead data collection, reduction, and validation activities. Develop and validate predictive models, reconcile simulations with measurements, perform uncertainty quantification, and provide actionable recommendations to engineering and program leadership. Produce high-quality technical documentation: test plans, test reports, technical memoranda, design reviews, and customer briefings. Mentor and provide technical oversight to junior engineers and technicians; ensure adherence to engineering processes, qual

About the Team Our Robotics team is focused on unlocking general-purpose robotics and pushing towards AGI-level intelligence in dynamic, real-world settings. Working across the entire model stack, we integrate cutting-edge hardware and software to explore a broad range of robotic form factors. We strive to seamlessly blend high-level AI capabilities with the constraints of physical systems to improve people's lives. About the Role We are seeking a lead thermal simulation engineer to help accelerate the design and development of next-generation robotic systems through modeling, simulation, and analysis. You will work closely with mechanical, electrical, controls, and robotics engineers to evaluate designs before hardware is built, identify risks early, and guide critical architecture decisions. This role spans structural and thermal analysis and design across robotic subsystems including actuators, mechanisms, structures, electronics, and integrated systems. You will develop simulation workflows that improve engineering velocity, increase confidence in design decisions, and help us build more capable, reliable, and manufacturable robotic platforms. This role is based in San Francisco, CA. This role will be expected to be in office 4 days per week and offer relocation assistance to new employees. In this role, you will: Perform thermal simulations to assess heat generation, cooling strategies, thermal interfaces, and system-level thermal performance Partner with mechanical, electrical, and controls engineers to influence design decisions early in development Build simulation models to evaluate robotic actuators, transmissions, mechanisms, structures, soft goods, and integrated assemblies Correlate simulation results with physical testing and develop methodologies to improve model accuracy Support architecture trade studies by evaluating design concepts before hardware is built Develop simulation workflows, standards, and best practices that scale across the robotics o

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. Role Overview We are seeking an experienced ASIC Package Signal Integrity / Power Integrity Engineer to drive electrical architecture, modeling, optimization, and validation for the most advanced AI/HPC silicon and package design. This role focuses on high-speed SerDes and memory channel architecture, advanced 2.5D/3D package SI/PI, substrate to package co-design, power-delivery-network optimization, electromagnetic modeling, and simulation-to-measurement correlation. The ideal candidate has strong hands-on experience with high-speed channel and PDN analysis across ASIC packages, interposers, substrates, and power-delivery structures, and can translate simulation results into practical design requirements for interposers and package substrate design optimization. The engineer will work closely with ASIC, package, system, mechanical, thermal, power, and silicon validation teams from early architecture and feasibility studies through production bring-up. In this role you will Own SI/PI architecture and analysis for advanced AI ASIC packages from early feasibility studies through production. Develop and optimize high-speed electrical channels for 200G/400G SerDes, PCIe, HBM, DDR, and chiplet/die-to-die interfaces. Perform package, interposer and substrate modeling using 2D/3D electromagnetic solvers. Define and optimize package stack-ups, transmission-line structures, via transitions, breakout structures, return paths, ground shielding, bump maps, and ball maps based on SI/PI re

Experienced Electro-Optical Infrared Design, Assembly, Integration, and Test Engineer Company: The Boeing Company Boeing Defense, Space and Security (BDS) is looking for an Experienced Electro-Optical Infrared Design, Assembly, Integration, and Test Engineer (Level 3) to join our team in Huntington Beach or El Segundo, California. This position will be joining a team of engineers, analysts and staff within the Space and Missile Systems (SMS) and Boeing Technology and Innovation (BTI) Mission Systems organizations in the development, assembly, integration, and test of a constellation of satellites. The SMS and BTI organizations develop and capture technology for designing disruptive Mission Systems solutions. Focused on visible and infrared spectrum Electro-Optics Infrared (EO/IR) sensors operating in Space and Air domains, our growing team is leaping ahead of our competition with an exceptional mix of mission architectures, sensor designs, and algorithms for advanced image and data processing. Position Responsibilities: Develops and validates requirements for various communication, sensor, electronic warfare and other electromagnetic systems and components Develops and validates electromagnetic requirements for electrical\electronic systems, mechanical systems, interconnects and structures Develops architectures to integrate systems and components into higher level systems and platforms Performs trade studies, modeling, simulation and other forms of analysis to predict component, interconnects and system performance and to optimize design around established requirements Defines and conducts tests to validate performance of designs to requirements Manages appropriate aspe

About the Team OpenAI’s Industrial Compute team is building and productizing infrastructure capabilities that help organizations deploy and operate advanced AI systems at scale. The team works across AI hardware, systems engineering, physical infrastructure, and customer delivery to turn emerging technologies into reliable, repeatable infrastructure solutions. Our work sits at the intersection of technical strategy, product development, engineering, and deployment. We partner closely with customers and internal engineering teams to solve complex infrastructure challenges spanning compute, power, cooling, controls, and facility efficiency. About the Role We are seeking a senior, hands-on Data Center Infrastructure Architect to develop and optimize the physical infrastructure required for large-scale AI deployments. This is a broad technical role spanning data center architecture, electrical and mechanical systems, high-density compute, controls, telemetry, and digital modeling. You will use simulation, operational data, and digital-twin approaches to evaluate infrastructure designs, identify system-level constraints, and improve efficiency, reliability, cost, and speed of deployment. The ideal candidate can move fluidly between first-principles analysis, facility and equipment design, computational modeling, engineering review, and real-world implementation. You should be comfortable working across disciplines rather than operating solely within electrical, mechanical, or software boundaries. Key Responsibilities Define system-level architectures for high-density AI data centers across power, cooling, IT equipment, controls, and facility infrastructure. Develop digital twins and other computational models that represent the behavior of data center systems under changing workloads, environmental conditions, equipment configurations, and failure scenarios. Use design and operational data to identify constraints, improve PUE and related efficiency metrics, and optimize

JLL empowers you to shape a brighter way . Our people at JLL are shaping the future of real estate for a better world by combining world class services, advisory and technology for our clients. We are committed to hiring the best, most talented people and empowering them to thrive, grow meaningful careers and to find a place where they belong. Whether you’ve got deep experience in commercial real estate, skilled trades or technology, or you’re looking to apply your relevant experience to a new industry, join our team as we help shape a brighter way forward. Position Overview The Facilities Mechanical Engineer is a hands-on technical professional responsible for maintaining, troubleshooting, and optimizing building mechanical systems while supporting capital project development. This role combines engineering expertise with direct field work, requiring both technical knowledge and practical application skills. Essential Responsibilities : Building Systems Management Maintain and optimize industrial Boilers, Chillers, HVAC, plumbing, mechanical, and fire life safety (FLS) systems across assigned facilities Perform preventive and corrective maintenance on building mechanical equipment Troubleshoot system failures and implement effective solutions to minimize downtime Conduct regular inspections and assessments of mechanical syst

We anticipate the application window for this opening will close on - 30 Sep 2026 Careers that change lives start here. Medtronic is a global leader in healthcare technology with a Mission to alleviate pain, restore health, and extend life. Our 95,000 employees work across more than 150 countries to put patients first — developing innovative medical technologies that improve the lives of 72&#43; million patients each year. Your unique talents will help shape the future of healthcare while building a career grounded in purpose, growth, and impact. A Day in the Life The Acute Care & Monitoring (ACM) business develops technologies that help clinicians monitor, assess, and manage patients across the continuum of care. Within ACM, the Test Engineering function supports product development, verification, reliability, and manufacturing readiness through the design and execution of test methods, fixtures, and equipment used to evaluate product performance and system functionality. This team partners closely with systems, mechanical, electrical, software, quality, and manufacturing engineering teams to support the development and sustainment of medical technologies. This position is based in Lafayette, Colorado and is an onsite role. Travel up to 10% may be required to support testing activities, cross-functional collaboration, and business needs. As a Mechanical R&D Engineer II, you will support system-level, reliability, mechanical, and electrical testing activities for Acute Care & Monitoring products. This role combines hands-on laboratory testing, fixture development, data analysis, and cross-functional collaboration to evaluate product performance, investigate issues, and support verification activities throughout the product lifecycle. Primary Responsibilities <li

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our team is at the forefront of developing next-generation memory and AI computing platforms. We are core contributors to the design, validation, and mass production of advanced systems using emerging memory technologies, ASICs, FPGAs, high-speed digital interfaces, mixed-signal and analog circuitry, and complex power delivery architectures! We are seeking a highly experienced Mechanical & Thermal Engineer to provide technical leadership and drive the mechanical and thermal architecture of ground breaking hardware platforms. This role offers the opportunity to influence product strategy, lead critical engineering decisions, and collaborate across global multidisciplinary teams to enable world-class computing solutions. The ideal candidate brings deep expertise in thermal, mechanical, and heat mitigation solutions for memory product. They demonstrate strong analytical and problem-solving skills. They have a proven record of delivering products from concept through high-volume manufacturing! Performs design and development engineering assignments related to hardware products and systems including development of new products or updates to existing products. Work may encompass one or more areas of engineering including electronic design, mechanical design, or other related fields. Duties may include research, evaluation, development, and application of new processes and methods into products. May be responsible for establishing and conducting testing routines, developing or implementing project plans, budgets, and schedules, and documentation