Title: AI Application Packaging Engineer Location: Andheri (East), Mumbai Reports to: Service Director ABOUT BLENHEIM CHALCOT: As part of the Blenheim Chalcot portfolio, we benefit from the expertise, infrastructure, and scale of the leading global venture builder. With over 25 years of experience creating and growing SaaS businesses powered by Generative AI, Blenheim Chalcot has built 60+ ventures across sectors such as financial services, education, health, and marketing. Our global ecosystem—including Scale Space in London, the Rajasthan Royals in Mumbai, and a go-to-market base in Austin—enables us to access world-class talent, tools, and support to accelerate our growth and build a market-leading business. THE ROLE: We’re looking for an AI-first ITS Engineer with strong Application Packaging expertise to join our growing team at Agilisys. In this role, you’ll work across Application Packaging, Endpoint Management, Cloud Deployment, and Automation, helping modernise IT operations through AI-driven and scalable solutions. This is an opportunity to work in a fast-paced environment where automation, innovation, and operational efficiency are at the core of what we do. ABOUT YOU: Must-Have's 5+ years of hands-on experience with SCCM and/or Microsoft Intune for application packaging, deployment, and endpoint management. Strong experience with PowerShell scripting and a good understanding of Windows Registry, File System internals, and deployment workflows. Experience managing application packaging, deployment, patching, and remediation processes in enterprise environments. Exposure to vulnerability management and patch lifecycle activities using tools such as WSUS, Active Directory, or endpoint security solutions. An AI-first mindset with interest or experience leveraging Generative AI tools to improve efficiency across packaging, testing, deployment, troubleshooting, and operational tasks. Hands-on experience using automation or AI-assisted tools
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Packaging Module Development Engineer Manager Manager Manager Specialist in India
15 active opportunities · Updated September 2026
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Explore current packaging module development engineer manager manager manager specialist jobs across India. Filter by work mode, employment type, experience, department, date posted and distance.
Mechanical Simulation Engineer – Advanced Packaging — Hyderabad - Phoenix Aquila, India. Apply via Workday.
Sr Engineer, Advanced Packaging Design Enablement Engineering (APDEE) — Hyderabad - Phoenix Aquila, India. Apply via Workday.
Sr Engineer, Advanced Packaging Design Enablement Engineering (APDEE) — Hyderabad - Phoenix Aquila, India. Apply via Workday.
Material Packaging Courier tracking Material Delivery Goods ya packages ko timely aur efficiently deliver karo. Traffic rules ka dhyan rakho aur vehicle safety ensure karo.
From $2.7K/yr
ELECTRICAL ENGINEER 1 TO 2 YEARS EXPERIENCE REQUIRED PACKAGING SUPERVISOR 0 TO 1 YEARS EXPERIENCE REQUIRED HELPER HARD WORKING REQUIRED CANDIDATE HR MANAGER 2 TO 4 YEARS EXPERIENCE REQUIRED ADMIN ASSISTANT 1 TO 2 YEARS EXPERIENCE REQUIRED ACCOUNTANT 1 TO 2 YEARS EXPERIENCE REQUIRED COMPUTER OPERATOR 1 TO 2 YEARS EXPERIENCE REQUIRED BILLING ASSISTANT 1 TO 2 YEARS EXPERIENCE REQUIRED BUSINESS DEVELOPMENT MANAGER 1 TO 2 YEARS EXPERIENCE REQUIRED ALL PROCESS DONE IN 45 DAYS
From $2.7K/yr
URGENT ELECTRICAL ENGINEER 1 TO 2 YEARS EXPERIENCE REQUIRED URGENT PACKAGING SUPERVISOR 0 TO 1 YEARS EXPERIENCE REQUIRED URGENT HELPER HARD WORKING REQUIRED CANDIDATE URGENT HR MANAGER 2 TO 4 YEARS EXPERIENCE REQUIRED URGENT ADMIN ASSISTANT 1 TO 2 YEARS EXPERIENCE REQUIRED URGENT ACCOUNTANT 1 TO 2 YEARS EXPERIENCE REQUIRED URGENT COMPUTER OPERATOR 1 TO 2 YEARS EXPERIENCE REQUIRED URGENT BILLING ASSISTANT 1 TO 2 YEARS EXPERIENCE REQUIRED URGENTBUSINESS DEVELOPMENT MANAGER 1 TO 2 YEARS EXPERIENCE URGENT REQUIRED ALL PROCESS DONE IN 45 DAYS
From $2.7K/yr
SINGAPORE REQUIRED COMPANY SPONSERED VISA DEPERNDS ON CANDIDATES SKILLS WORK PERMIT, S- PASS OR E PERMIT LOW COST VISA CANDIDATES SHOULD PAY ONLY 27000 RS BALANCE IS DEDUCTION YOUR SALARY. ELECTRICAL ENGINEER 1 TO 2 YEARS EXPERIENCE REQUIRED PACKAGING SUPERVISOR 0 TO 1 YEARS EXPERIENCE REQUIRED HELPER HARD WORKING REQUIRED CANDIDATE HR MANAGER 2 TO 4 YEARS EXPERIENCE REQUIRED ADMIN ASSISTANT 1 TO 2 YEARS EXPERIENCE REQUIRED ACCOUNTANT 1 TO 2 YEARS EXPERIENCE REQUIRED COMPUTER OPERATOR 1 TO 2 YEARS EXPERIENCE REQUIRED BILLING ASSISTANT 1 TO 2 YEARS EXPERIENCE REQUIRED BUSINESS DEVELOPMENT MANAGER 1 TO 2 YEARS EXPERIENCE REQUIRED ALL PROCESS DONE IN 45 DAYS
Graphcore is a globally recognised leader in Artificial Intelligence computing systems. The company designs advanced semiconductors and data centre hardware that provide the specialised processing power needed to drive AI innovation, while delivering the efficiency required to support its broader adoption. As part of the SoftBank Group, Graphcore is a member of an elite family of companies responsible for some of the world’s most transformative technologies. We are opening a new AI Engineering Campus in Bengaluru which will play a central role in Graphcore's work building the future of AI computing. The physical design team sits within the wider silicon design team which includes RTL, verification and DFT. Our work also involves strong links with architecture, packaging and product engineering. We are responsible for working with those teams to create high-quality RTL and building the final chip layout (e.g. GDSII) ensuring a signoff-quality design is delivered to the Foundry (e.g. TSMC). We are looking to hire high-quality silicon physical design engineers to join our team. The successful candidate will support the team with achieving our goals and creating the right engineering solutions. We are a collaborative team and good communication is essential, as is the ability to adapt and learn. For the successful candidate we offer an open, honest and collaborative environment working on leading-edge designs at the most advanced nodes. Our engineers are not siloed, and they are trusted and encouraged to ta ke ownership of their designs and problem solutions. You will be part of a team that looks for improvements to everything we do: our designs, our flows, our methodologies, our infrastructure. Responsibilities and Duties Applicants will be expected to contribute technically to the development of Graphcore's next generation of AI superchips, focusing on achieving robust, high-performance and power-efficient designs
Silicon Physical Design Engineer Multiple roles across different levels Graphcore is a globally recognised leader in Artificial Intelligence computing systems. The company designs advanced semiconductors and data centre hardware that provide the specialised processing power needed to drive AI innovation, while delivering the efficiency required to support its broader adoption. As part of the SoftBank Group, Graphcore is a member of an elite family of companies responsible for some of the world’s most transformative technologies. We are opening a new AI Engineering Campus in Bengaluru which will play a central role in Graphcore's work building the future of AI computing. The physical design team sits within the wider silicon design team which includes RTL, verification and DFT. Our work also involves strong links with architecture, packaging and product engineering. We are responsible for working with those teams to create high-quality RTL and building the final chip layout (e.g. GDSII) ensuring a signoff-quality design is delivered to the Foundry (e.g. TSMC). We are looking to hire high-quality silicon physical design engineers to join our team. The successful candidate will support the team with achieving our goals and creating the right engineering solutions. We are a collaborative team and good communication is essential, as is the ability to adapt and learn. For the successful candidate we offer an open, honest and collaborative environment working on leading-edge designs at the most advanced nodes. Our engineers are not siloed, and they are trusted and encouraged to ta ke ownership of their designs and problem solutions. You will be part of a team that looks for improvements to everything we do: our designs, our flows, our methodologies, our infrastructure. Responsibilities and Duties Applicants will be expected to contribute technically to the development of Graphcore's next generation of AI superchips, fo
From $2.5K/yr
HELLO FRIENDS SINGAPORE 'S PAS Valid for 2 (Years) and Extendable. JOBS: S.NO COMPANY SALARY 1. Waiter/Waitress Fine Dining Restaurant 2,000 SGD 2. Supervisor Hotel 2,200 SGD 3. Cook Restaurant 2,400 SGD 4. Dishwasher/Cleaner Restaurant 1,850 SGD 5. Nurse Changi Hospital 2,800 SGD 6. Cashier NTUC 2,250 SGD 7. Electrician Wiring/AC Electric Company 2,250 SGD 8. Driver Logistics Company 2,350 SGD 9. House Keeping Hotel 2,050 SGD 10. Admin (Office) Good Forwarding Co 2,800 SGD 11. Accountant Ladies Brand Co 2,800 SGD 12. HR Executive Ladies Brand Co 2,550 SGD 13. Salesman Shop 2,150 SGD 14. Food Packaging Food Manufacturing Co 2,000 SGD 15. Fruit Packing Fruit Packing Co 2,000 SGD 16. Computer Operator Ladies Brand Co 2,450 SGD 17. Customer Service Shopping Centre 2,450 SGD 18. Supervisor/Store Keeper Restaurant 1,800 SGD BENEFITS - FOOD AND ACCOMMODATION PROVIDED BY COMPANY MEDICAL PROVIDED BY COMPANY TRAVELLING ALLOWANCES BY COMPANY DRESS CODE PROVIDED BY COMPANY VISA IS EXTENDED AFTER COMPLETED YOUR CONTRACT PERIOD ALL PROCESSING TIME 30 WORKING DAYS ( 50 DAYS ) AFTER APPLIED POSITION 12 WORKING DAYS GET IPA ( IN PRINCIPLE OF APPROVAL ISSUED BY SINGAPORE IMMIGRATION )
From $1.7K/yr
Job description Join GENIC as a General Worker in our dynamic manufacturing and logistics team based in Woodlands, Singapore. This is a fantastic opportunity to build a stable career in a collaborative environment with ample opportunities for growth and skill development.As a key member of our operations, you will contribute to the smooth functioning of our production and logistics processes. We offer a competitive salary, job security, and a supportive work culture that values teamwork and continuous learning.If you are a motivated individual looking for a full-time permanent role in the manufacturing and logistics sector, we encourage you to apply and take the next step in your career with GENIC.Key Responsibilities:Assist in the assembly, packaging, and preparation of products for shipment.Operate basic machinery and equipment under supervision.Maintain a clean and organized workspace to ensure safety and efficiency.Follow standard operating procedures (SOPs) for quality control and compliance.Load and unload materials from delivery trucks and storage areas.Perform basic inventory checks and report discrepancies.Collaborate with team members to meet daily production targets.Adhere to workplace safety guidelines and participate in training programs.Technical Requirements:Minimum secondary education or equivalent.Ability to perform physical tasks, including lifting and standing for extended periods.Basic understanding of manufacturing or logistics processes is a plus.Good communication skills and ability to work in a team.Willingness to learn and follow instructions accurately.No prior experience required; on-the-job training will be provided.Punctuality and reliability in attending work shifts.Basic computer skills for inventory or data entry tasks
From $25K/yr
Position: Assistant Professor Printing Technology Department: Printing Technology Location: College Campus Key Responsibilities Deliver lectures and practical sessions in Printing Technology subjects. Prepare lesson plans, study materials, laboratory manuals, and assessments. Guide students in academic projects, internships, seminars, and industrial training. Conduct laboratory sessions and ensure the proper maintenance of printing equipment and laboratories. Evaluate student performance through assignments, practicals, and examinations. Participate in curriculum development, accreditation activities, and departmental administration. Encourage research, innovation, and collaboration with the printing and packaging industry. Perform academic and administrative responsibilities assigned by the Head of Department. Eligibility Qualification: B.E./B.Tech and M.E./M.Tech in Printing Technology or a relevant specialization (Ph.D. preferred)
About Us: Sauce Labs is the world’s largest full-lifecycle, test automation platform, and the company behind Selenium. Trusted by 80% of the world’s top ten largest financial institutions and over 300,000 enterprise users, Sauce Labs provides the only AI platform capable of turning business intent into autonomous testing and quality assurance. With a proprietary dataset of 8.7 billion test runs, Sauce Labs empowers the Fortune 2000 to bridge the gap between AI-driven code generation and enterprise-grade software quality. Learn more at saucelabs.com . Location: This is a hybrid role based out of our Gurugram office. To balance collaboration and flexibility, we work from the office 3 days a week (Tuesday - Thursday) and from home the remaining days (Monday & Friday). The Role: As a Senior Product Manager at Sauce Labs, you will be responsible for driving the vision, strategy, and execution of key products within our portfolio. This role will be leading developer-tooling for AI-native product portfolio , working closely with teams and customers across multiple regions. You will lead cross-functional teams to deliver best-in-class solutions that meet customer needs and support the company's overall strategy. You’ll be a key decision-maker in shaping product direction from new concepts to aligning pricing packaging, partners approach, and will mentor and guide other product managers. Responsibilities: Product Vision & Strategy: Define and communicate the product vision and long-term strategy to stakeholders and team members. Lead market and competitive analysis to identify opportunities for innovation and growth. Align product strategy with overall business goals, ensuring product efforts drive revenue and customer satisfaction. Be able to lead overall ROI analysis for new product initiatives including pricing and packaging Experience working with partners and 3rd party developer ecosystem Product Roadmap Ownership: Develop and manage the product roadmap, balanci
Instawork is on a mission to create meaningful economic opportunities for skilled hourly professionals in communities around the globe. Our AI-powered labor marketplace helps local businesses scale, and enables global technology companies to push the frontiers of robotics and AI. Backed by world-class investors like Benchmark, Spark Capital, Craft Ventures, Greylock, Y Combinator, and others, we’re looking for exceptional talent to reimagine the way the world works. Senior Mechanical Engineer — Robotics Hardware Location - Bangalore Instawork Robotics Labs is building Instacore, our proprietary five-camera and IMU wearable capture rig. Hundreds of units operate across India every day, collecting real-world data used to train frontier Physical AI models. We are looking for a senior, mechanically focused engineer to own the complete hardware lifecycle for Instacore and future hardware products. This person will independently lead design, prototyping, manufacturing, testing, deployment, logistics, maintenance, and continuous improvement. What you’ll do - Own the mechanical design and development of Instacore and other robotics hardware from initial requirements through production and field deployment. - Create detailed CAD models, assemblies, engineering drawings, bills of materials, and manufacturing documentation. - Rapidly prototype and validate designs using 3D printing, machining, fabrication, and off-the-shelf components. - Design durable mounts, enclosures, fixtures, wearable components, packaging, and protective systems. - Own design for manufacturability, assembly, serviceability, reliability, and cost. - Improve cable routing, connector retention, strain relief, thermal management, ingress protection, and resistance to vibration and impact. - Design packaging and logistics processes that prevent damage during storage and transit. - Establish verification, stress-testing, quality-control, and acceptance-testing procedures. - Investigate field failures, d
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