Thin Films Module Development Engineer Jobs

Thin Films Module Development Engineer — Oregon, Hillsboro. Apply via Workday.

Job Details: Job Description: The Thin Films Senior Process Engineer will support PVD, CVD, and ALD technologies for dielectric and metal thin-film deposition in a high-volume manufacturing environment. Key Responsibilities Apply advanced expertise in thin-film deposition processes to drive continuous improvement in process performance, sustainment, and technology development. Collaborate with upstream and downstream partners to deliver manufacturing improvements through strong cross-functional engagement and stakeholder management. Own manufacturing processes and/or equipment, ensuring achievement of key performance indicators (KPIs) including safety, quality, cost, productivity, defect reduction, and yield improvement. Develop and execute strategic plans for complex projects, coordinating timelines and dependencies across multiple teams and initiatives. Support manufacturing capacity expansion and technology transfer activities to enable successful ramp-to-volume production. Partner with equipment vendors and cross-functional stakeholders to troubleshoot technical challenges, improve tool performance, and enhance operational efficiency. Lead process development initiatives that support current and next-generation high-volume manufacturing technologies. Design and optimize excursion prevention and detection systems to strengthen process control and minimize manufacturing risk. Lead equipment installation, conversion, qualification, and readiness activities during factory ramps, ensuring all tools are deployed safely, on schedule, and in compliance with quality and manufacturing standards. Drive root cause analysis and implement corrective actions to resolve process and equipment-related issues while improving overall manufacturing stability and performance. <p st

Job Details: Job Description: As a Material Analysis (MA) Technician, you will be part of a Technology Development (TD) and High-Volume Manufacturing (HVM) lab responsible for performing material analysis and failure analysis in support of Intel's silicon process development and high-volume production. You will work on developing imaging, composition analysis and sample preparation techniques, and best-known methods (BKMs) to improve lab analysis quality, efficiency and output. You will directly interface with TD and HVM fab customers and quality/reliability engineers to develop solutions to problems by utilizing lab capabilities. The scope may include wafer and unit level, front-end modules and back-end/far back-end modules. Responsibilities may include but not be limited to: • Conducting hands-on analysis by effectively utilizing lab techniques, from sample prep micro-cleaver, ion mill etcher, mechanical polish to SEM/EDX, Dual beam FIB, TEM techniques to characterize Si fabricated structures at nanometer scales and integrated circuit device to improve process, performance and reliability; and to identify physical failure mode toward the root-cause identification. • Conducting hands-on data collection with various lab equipment’s, and assisting engineers to implement materials characterization techniques to determine fundamental thin film material structure/properties and to collaborate with process development engineers across functional areas and organizations to improve process performance and reliability. • Supporting and sustaining lab equipment. Ensuring that lab analytical capabilities needed to support advanced transistor and interconnect technology and/or product development are in place. Cooperating with other lab areas beyond local MA/FA (Failure Analysis) labs to achieve

Job Details: Job Description: This is a central requisition for all Ocotillo Technology Fabrication (OTF) functional areas. Successful candidates will be aligned to the areas that match best with factory needs. Join Intel and build a better tomorrow. Intel is in the midst of an exciting transformation, with a vision to create and extend computing technology to connect and enrich the lives of every person on Earth. Our high-volume manufacturing facility in Chandler, Arizona is looking for amazing talent. Join and help us create the next generation of technologies that will shape the future for decades to come. The Ocotillo Technology Fabrication (OTF) Module Engineer role is multifaceted. The ideal candidate will have a passion for instrumentation and equipment with the goal of developing a robust manufacturable process module. This is a central requisition for all functional areas: Litho, Wet Etch, Dry Etch, Diffusion, Implant, Planar and Thin Films. Successful candidates will be aligned to the areas that match best with factory needs. As an OTF Module Engineer you will play an important role in the OTF engineering team. You will be responsible for owning all aspects of one or more of the factory's 300mm toolsets. Your sustaining responsibilities will include the safety and cleanliness of your area and ensuring Copy Exactly for your toolset. You will also be expected to review the relevant control charts and tool output daily and ensure your toolset and layers remain excursion free. You will be responsible for delivering Model of Record (MOR) availability and achieving 100 percent matching for all relevant operations. For new technology start-ups, you will be responsible for tool installations, conversions, and qualifications; and sustained matching performance. You will be expected to drive continuous improvement in the he

Job Details: Job Description: This is a central requisition for all Ocotillo Technology Fabrication (OTF) functional areas. Successful candidates will be aligned to the areas that match best with factory needs. Join Intel and build a better tomorrow. Intel is in the midst of an exciting transformation, with a vision to create and extend computing technology to connect and enrich the lives of every person on Earth. Our high-volume manufacturing facility in Chandler, Arizona is looking for amazing talent. Join and help us create the next generation of technologies that will shape the future for decades to come. The Ocotillo Technology Fabrication (OTF) Module Engineer role is multifaceted. The ideal candidate will have a passion for instrumentation and equipment with the goal of developing a robust manufacturable process module. This is a central requisition for all functional areas: Litho, Wet Etch, Dry Etch, Diffusion, Implant, Planar and Thin Films. Successful candidates will be aligned to the areas that match best with factory needs. As an OTF Module Engineer you will play an important role in the OTF engineering team. You will be responsible for owning all aspects of one or more of the factory's 300mm toolsets. Your sustaining responsibilities will include the safety and cleanliness of your area and ensuring Copy Exactly for your toolset. You will also be expected to review the relevant control charts and tool output daily and ensure your toolset and layers remain excursion free. You will be responsible for delivering Model of Record (MOR) availability and achieving 100 percent matching for all relevant operations. For new technology start-ups, you will be responsible for tool installations, conversions, and qualifications; and sustained matching performance. You will be expected to drive continuous improvement in the health and matching of your to

Thin Films Process Development Engineer — Boise, ID - Main Site. Apply via Workday.

Sr Thin Films Equipment Technician — Manassas, VA - Fab 6. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Thin Films Equipment Engineering team at Micron develops and enhances advanced semiconductor manufacturing equipment in a fast-paced research and development environment. The team works closely with Process Engineering, Facilities Engineering, and equipment suppliers to enable next-generation memory technologies and achieve world-class equipment performance. Through innovation, collaboration, and data-driven decision-making, the team plays a critical role in advancing semiconductor technology development. As a Thin Films Equipment Engineering Intern, you will gain hands-on experience working with groundbreaking semiconductor equipment and processes. You will support engineering projects focused on equipment optimization, data analysis, and technology development while collaborating with multi-functional teams. This role provides exposure to semiconductor manufacturing, experimental design, and the application of advanced analytics to solve complex engineering challenges. Responsibilities Collect, analyze, and interpret equipment and process data to find opportunities for performance optimization and continuous improvement. Support structured engineering experiments, document findings, and communicate results through technical reports and presentations. Collaborate with Equipment Engineering, Process Engineering, Facilities Engineering, and equipment suppliers to address technology-development challenges and improve equipment performance. Develop an understanding of equipment hardware,

SMTS Diffusion & Thin Films — 2 Locations. Apply via Workday.

Experienced- R&D Thin Films Process Development Engineer Advanced DRAM (Evergreen) — Boise, ID - Main Site. Apply via Workday.

R&D Thin Films Process Development Engineer Advanced DRAM — Boise, ID - Main Site. Apply via Workday.

Principal Engineer / MTS – NAND Process Pathfinding - Thin Films — Fab 10N/X, Singapore. Apply via Workday.

SMTS / DMTS – NAND Process Pathfinding - Thin Films & Materials — Fab 10N/X, Singapore. Apply via Workday.

Principal Engineer, NAND Advanced Thin Films Process Development — Fab 10N/X, Singapore. Apply via Workday.

Senior Engineer – Process Development, Thin Films (CVD/Diffusion) NAND — Fab 10N/X, Singapore. Apply via Workday.