Dram Process Integration Engineer in United States

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are transforming how the world uses information to enrich life for all. Within our DRAM organization, we develop next-generation memory technologies in an industry-leading 300mm R&D environment, bringing together expertise across process development, design, modeling, characterization, reliability, and manufacturing. Our team works collaboratively to advance memory scaling while improving performance and manufacturability. As a Process Integration Engineer, you will help enable state-of-the-art DRAM technologies and solve complex integration, device, yield, and circuit challenges. You will work closely with cross-functional engineering teams to optimize process flows, improve yield and margin, and translate technical data into solutions that enable future generations of memory technology. Responsibilities: Lead technology integration activities to enable manufacturability of advanced DRAM technologies Partner with process development, product engineering, design, yield, mask, and probe teams to resolve yield, performance, reliability, and margin challenges Design and implement R&D fab experiments and optimize process flows to meet product and technology requirements Analyze inline, defect, parametric

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is advancing a historic $15 billion investment in semiconductor manufacturing in Boise, Idaho, with DRAM production planned for the second half of the decade. As a global leader in memory and storage solutions, Micron is investing more than $150 billion worldwide over the next decade to expand groundbreaking manufacturing capabilities and drive innovation across the semiconductor industry. Join the Boise expansion team and help build the future of semiconductor manufacturing. You will work alongside experienced engineers to develop advanced processes, solve complex manufacturing challenges, and support the production of technologies that power everything from artificial intelligence to next-generation computing systems. As a Dry Etch Process Engineer, you will contribute to the development, optimization, and sustainment of semiconductor manufacturing processes. You will gain hands-on experience in a brand new fabrication environment, working with multi-functional teams to improve yield, quality, reliability, and productivity. This is an excellent opportunity to apply engineering fundamentals, develop technical expertise, and grow your career in semiconductor manufacturing. Responsibilities Support the development and optimization of dry etch processes to improve product performance, yield, and manufacturing efficiency. Analyze process and manufacturing data to identify trends, solve issues, and implement corrective actions. Partner with process integration, equipment,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are at the heart of advanced DRAM node development, driving innovations from concept to high-volume production. Our team partners closely across Technology Development, Design, Quality, and Manufacturing to bring innovative memory technologies to life. If you’re excited about translating breakthrough ideas into real-world impact, you’ll find this work both challenging and rewarding. As a High Volume Manufacturing (HVM) Node Development Product Engineer, you will play a central role in introducing new DRAM nodes into production at the ID1 fab. This role connects development to manufacturing—owning yield ramp, cost efficiency, and quality improvements. You’ll collaborate cross-functionally to solve complex problems, improve product performance, and ensure successful technology transfer at scale. Responsibilities: Lead new node startup, qualification, yield ramp, and production readiness Guide development teams on process integration using deep technical insight Analyze yield data and electrical failures to drive measurable improvements Partner with Design, TD, Quality, and Test teams to resolve yield and performance issues Use statistical tools and lab analysis to identify root causes and optimize processes Minimum Qualifications: Bachelor’s degree in Electrical Engineering, Computer Engineering, or related field Familiarity with DRAM architecture, operation, testing, and process integration Understanding of CMOS fundamentals and

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Manufacturing Development Engineering (MDE) Shift Engineer in Photolithography , you will play a critical role in enabling 24/7 process development for next-generation DRAM technologies. Operating on a 12-hour rotating shift schedule , you will be the primary engineering decision-maker for off-hours development activities, ensuring uninterrupted execution of process development experiments and technology learning. Unlike traditional manufacturing shift engineering roles, this position operates in a highly dynamic development environment where process conditions, specifications, and experimental flows regularly evolve. You will apply sound engineering judgment to disposition development wafers, address process and equipment challenges, and balance development objectives with execution needs. In addition, you will use advanced analytics, automation, and AI-enabled solutions to accelerate learning cycles, improve decision quality, and support Micron's AI-driven digital manufacturing strategy. Responsibilities Serve as the primary off-hours technical authority for development activities by dispositioning wafers, releasing or holding tools, responding to process deviations, addressing execution risks, and maintaining development momentum. Partner with Photolithography Process Development, Process Integration, Equipment Development, Manufacturing, and Shift Operations teams to resolve process and equipment issues, remove output constraints, and support experimental processing. Apply Statistical Process Co

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Manufacturing Development Engineering (MDE) Shift Engineer in Films, Metals, and Implant, you will play a critical role in supporting 24/7 process development for next-generation DRAM technologies. Operating on a 12-hour rotating shift schedule , you will serve as the primary off-hours technical resource for development activities, helping ensure uninterrupted execution of development experiments and rapid technology learning. This position operates in a dynamic development environment where process conditions, specifications, and experimental flows frequently evolve. You will apply sound engineering judgment to disposition development wafers, respond to process and equipment challenges, support experimental execution, and balance development priorities with operational requirements. You will also apply advanced analytics, automation, and AI-enabled technologies to improve engineering decisions, increase learning velocity, and support Micron's digital manufacturing initiatives. Responsibilities Serve as the primary off-hours technical resource for development activities, making decisions on wafer disposition, tool release, process deviations, execution risks, and development priorities. Partner with Films, Metals, and Implant Process Development, Process Integration, Equipment Development, Manufacturing, and Shift Operations teams to resolve process and equipment issues, remove output constraints, and support experimental processing. Apply Statistical Process Control (SPC), E3, Fault Detection (FD)

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a global leader in innovative memory and storage solutions that accelerate the transformation of information into intelligence. As part of Micron’s historic investment in Boise, Idaho, we are building the future of semiconductor manufacturing with a new leading-edge DRAM fab and expanded manufacturing capabilities. About the Role As a Process Quality Engineer, you will drive the strategic direction of front-end wafer quality across the local site and Micron's global organization. You will support the development and execution of strategies that enable future technology requirements while ensuring robust contamination control across the fab environment. You will actively monitor, assess, and reduce airborne and surface contamination risks to protect wafer quality, yield, and reliability. Working closely with process, facilities, equipment, and integration teams, you will investigate contamination-related issues, implement corrective actions, and prevent recurrence. You will also evaluate contamination risks associated with new materials, processes, and technologies, ensuring effective controls are in place to support successful technology development and manufacturing. Additional responsibilities include, but are not limited to: Responsibilities may include (but not limited to) Support the development and execution of contamination control progr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Product Engineer in Node Development group, you will be part of a forward-thinking team of engineers that solves complex problems to develop industry leading DRAM! You will engage on new technology at design start and be part of a team responsible for delivering technology to enable the full product portfolio, initial device qualification and production ramp. This will be accomplished through innovation and by cross-functional engagement with partner groups; Design, Test, Technology Development, Marketing, Manufacturing and Quality Assurance departments to co-optimize product and process. While you may not exhibit all of the characteristics/skills listed below today, we are highly interested in a teammate who is motivated to grow in technical breadth and depth. Suppose you are open to learning while being a valued member of a team of world-class engineers. In that case, we are determined to help build upon your existing foundation, while focusing on your individual and collaborative skills in this exciting and outstanding opportunity. Responsibilities Include: Enable new process node startup, qualification, yield, and ramp Collaborate with internal engineering groups; Design, Technology Development, Design for Test, and Quality teams to understand yield issues and priorities. Provide direction to development teams using thorough knowledge for process integration Develop and key metrics for feedback on a new technology Support design verification and validation using CAD tools and simulation

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Boise site is undergoing a historic $15 billion investment in semiconductor manufacturing, with DRAM production planned for the second half of the decade. As part of Micron’s global $150 billion expansion, our High Volume Manufacturing team drives innovation and operational excellence to deliver world-class memory solutions. As an ID1 High Volume Manufacturing Process Engineer Intern , you will work on process optimization, yield improvement, and cost reduction initiatives. This role involves collaborating with equipment teams, operations leaders, and multi-functional collaborators to ensure area critical metrics are met and wafer output is optimized. Responsibilities Finish the required safety training and adhere to safety policies and laws. Ensure proper tool documentation and update reaction mechanisms as needed. Supervise and resolve issues impacting yield, excursions, defects, or output loss. Apply SPC, FDC, and 8D methodologies to optimize processes and improve tool availability. Analyze data using engineering knowledge and visualization tools to make critical process decisions. Perform project work to optimize wafer processing and increase wafer outs. Update or create procedures to align with area and global practices. Minimum Qualifications Current student in an engineering or related degree program; graduation date not before September 2027. Understanding of SPC and Design of Experiments. Prof

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Design Technology Co-Optimization (DTCO) team works at the intersection of process technology, standard cell architecture, and design implementation to optimize power, performance, and area (PPA) for advanced memory products. The team collaborates closely with standard cell library, RTL, and physical design engineers to evaluate design tradeoffs and develop methodologies that improve silicon outcomes. As a DTCO Intern, you will gain hands-on experience assessing and optimizing PPA at the standard cell and logic block level. You will use industry-standard place-and-route tools and AI-enabled automation techniques to implement, benchmark, and optimize logic blocks while developing practical skills in physical design, timing closure, and design analysis. Responsibilities Implement standard cell logic blocks using industry-standard physical design tools, including floorplanning, placement, clock tree synthesis (CTS), routing, and optimization activities focused on PPA assessment. Analyze and benchmark power, performance, and area across standard cell libraries and logic block configurations, identifying opportunities for improvement. Perform static timing analysis (STA), investigate setup and hold timing violations, and support timing closure activities. Execute physical verification checks, including DRC, LVS, and IR-drop analysis, and assist with resolving design issues. Leverage Generative AI, AI Assistants, and Agentic AI solutions to automate data collection, reporting, comparison, and w

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) team at Micron is shaping the future of memory and storage technologies that fuel the AI era. We collaborate with global R&D groups, suppliers, and manufacturing teams to turn bold ideas into production-ready solutions. We innovate fast, learn continuously, and work as one team! This position is intended to be part of Micron's Technical Leadership Program (TLP). This is a career path for individuals seeking to advance as technical leaders and industry innovators. TLP members are expected to influence, lead, and mentor others. Position Overview: We are seeking an experienced organizational leader who will l ead and influence methodology improvements, including best practices in process development, data-driven decision-making, and application of AI/advanced analytics to drive innovation. In this role, you will drive strategic process development for Micron’s most advanced memory products, including HBM, 3DS DRAM, and emerging 3D architectures. You will guide end‑to‑end technology execution, partner across organizations, and influence both internal roadmaps and the external ecosystem. This is a high-impact role for someone who thrives at the intersection of innovation, complexity, and collaboration. Responsibilities: Own advanced packaging process technologies across wafer‑level and die‑level modules from pathfinding through manufacturing readiness Develop

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Realtime Defect Analysis (RDA) Yield Technology team supports advanced DRAM research and development by identifying, analyzing, and reducing manufacturing defects that impact yield and product performance. The team partners closely with engineers across R&D and High Volume Manufacturing to improve process stability, accelerate learning cycles, and drive continuous improvement through data-driven decision making. As an RDA Yield Technology Intern, you will gain hands-on experience with innovative semiconductor processing, defect inspection systems, and advanced analytical techniques. You will contribute to projects focused on experimentation, defect detection, data analysis, and process optimization while collaborating with multi-functional engineering teams. This role is ideal for individuals who are passionate about problem solving, root-cause investigation, and leverausingology to improve manufacturing performance. Responsibilities Analyze experimental process flows and defect inspection data to identify anomalies, investigate root causes, and support corrective actions. Partner with R&D and manufacturing teams to improve yield performance through defect detection, process monitoring, and continuous improvement initiatives. Leverage Artificial Intelligence (AI) and data analytics tools to accelerate defect detection, identify yield-impacting trends, automate routine analysis workflows, and generate actionable insights. Use inline defect signals, statistical analys

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that encourage and transform technology. With plans to invest more than $150 billion globally over the next decade in groundbreaking manufacturing, we are looking for hardworking people to join our Boise expansion team and give to the growth and innovation of the semiconductor industry. ID1 High Volume Manufacturing Equipment Engineer is responsible for monitoring, sustaining, and improving the equipment while working in partnership with process team members and area engineers. In this position you will supervise tool performance, schedule and perform preventative maintenance on assigned tool sets, and use mechanical, electronic and PC/software skills to solve and repair equipment issues. They are also required to assist with equipment installations, engineering tests, build and modify equipment procedures, increase tool uptime through systematic problem solving and quality workmanship, and thoroughly document all maintenance. This is a hands-on equipment focused role with time spent in the fabrication facility. Responsibilities: Safely identify, handle, and work with chemicals and associated hazards in the work area. Recognize and respond appropriately to safety alarms and events, including EES, fire alarms, MDA, and ERT notifications. <l

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an Intern Product Yield Enhancement (PYE) Engineer at Micron Technology Inc., you will assist in taking next generation DRAM devices from design to mass production! PYE Engineers are crucial partners between Research and Development, Manufacturing, Product Engineering and Global Quality teams. Our goal is to offer hands-on and substantial engineering projects that allow interns to gain valuable experience with memory systems and the product life cycle while adding impact to Micron’s business. Our intern programs help prepare engineers for future roles and offer an extraordinary experience that supplements your academic experience! The PYE Engineering role is critical to Micron as it serves the company's charter to be the most cost-effective producer of DRAM memory while delivering the quality and reliability that customers expect from the Micron brand. This position is for a 3-month internship. Responsibilities: Your job duties will include detailed DRAM electrical and physical failure analysis. Identify defects introduced by the semiconductor fabrication process. You will data mine using statistical analysis, AI assisted engineering tools, and automation workflows. Find the root cause of failure mechanisms, communicating results with Management, Product, Process and Test Engineering teams. Complete 3-month internship. Minimum Qualifications: Must be pursuing a minimum of a bachelor’s degree in Electrical Engineering, Computer Engineering,

NVIDIA is now looking for a Senior Memory System Engineer to join our ASIC Memory Subsystem team! As a Senior Systems Engineer at NVIDIA, you'll join a group of hardworking engineers to develop and architect innovative Memory Solution for Tegra SoCs. In this position, you'll make a real impact in a multifaceted, technology-focused company. You will work with memory controller/PHY and Platform / System architect, Firmware, SI/PI, Memory suppliers to design and architect cutting edge, high speed and lower power memory technology for NVIDIA CPUs and SOCs. What You Will Be Doing: Analyze future DDR/LPDDR/HBM technologies to determine optimum performance, power, function and RAS in memory for Next generation SOC and Systems. Collaborate with ASIC Architects, Designers, Software and Firmware SW/FW teams to drive memory technology and associated requirements for memory controllers. Define Memory module, Package, and PCB layouts appropriate to the system workloads Debug and bring up memory evaluation / validation and failure issues on memory technology. Collaborate with DRAM suppliers and industry partners on to develop memory and memory related component technology. What We need to see: Bachelor's degree or master’s degree in Electrical Engineering, Computer Engineering (CE), or a related field (or equivalent experience) 10 years of proven track record in DRAM design, module design, or memory sub system design. Deep understanding and strong fundamental of memory design, features, ECC algorithm, SI and PI (Training algorithm) in DDR, LPDDR, and HBM. Strong understanding of memory sub system level interaction with Cache, Memory controller and PHY. Experience in the design, bring-up and validation for memory failure analysis Experience with Python, C/C

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology’s DRAM and Emerging Memory Group (DEG) is a distributed team of engineers and innovators focused on advancing next-generation memory technologies. For more than 43 years, Micron has been a leader in semiconductor innovation, delivering solutions that power applications ranging from artificial intelligence and high-performance computing to immersive digital experiences. The team is committed to innovation, integrity, sustainability, and meaningful community impact while driving the future of memory technology. As an HBM Memory Design Engineer, you will design, analyze, and optimize digital, analog, and memory circuits used in High Bandwidth Memory (HBM) products. You will collaborate with global design, verification, and product teams to develop high-performance DRAM solutions that meet manufacturability, reliability, and performance objectives. This role provides the opportunity to contribute to innovative memory technologies supporting AI, HPC, and data-centric applications. As part of Micron’s AI-Enabled workforce transformation, you will leverage AI-Assisted tools and data-driven methodologies to improve engineering productivity, accelerate design analysis, enhance decision-making, and drive innovation throughout the product development lifecycle. Responsibilities Design, analyze, and optimize memory, logic, and analog circuits for HBM products, including support for layout, validation, and tape-out activities. Perform circuit verification, parasitic modeling, and design simulations