High Speed Ai Interconnect Signal Integrity Engineer in United States

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is seeking a senior High Speed Interconnect / Signal Integrity Engineer to design and validate high-bandwidth links for large-scale AI systems. You will define, model, and qualify interconnect solutions across copper and optical technologies for next-generation AI inference and training clusters. This role is on-site in Santa Clara, CA, Austin, TX, or Toronto, Canada. We welcome candidates at various experience levels. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting Who You Are An experienced electrical engineer with a Bachelor’s or Master’s in Electrical Engineering. 5+ years working on high-speed communications (100G–1.6T), including signal integrity, channels, and links. Comfortable building and owning link and channel budgets and making clear tradeoffs between reach, loss, BER, and margin. Hands-on with SI tools and lab equipment such as Keysight ADS, VNAs, TDRs, BERTs, and protocol analyzers. Familiar with cable specification and testing, as well as accelerated life testing, mating life, and failure analysis. Able to collaborate across hardware, systems, and manufacturing teams; manufacturing/DFM/DTM experience is a plus. What We Need Define and specify high-speed interconnect architectures

1671 About the Role We are seeking a Senior Signal Integrity Engineer to develop, validate, and optimize high-speed signaling solutions across blade- and rack-level architectures for advanced compute platforms. This role sits at the intersection of silicon, package, interconnect, board, and system design , with a strong emphasis on hands-on measurement, simulation correlation, and cross-functional technical communication. Key Responsibilities End-to-end signal integrity analysis for blade- and rack-level system architectures. Analyze and optimize high-speed and low-speed I/O interfaces, including PCIe Gen4/5/6, Ethernet, DDR, SerDes, SPI , I2C, etc . and related interconnects. Perform time-domain and frequency-domain simulations using tools such as Ansys HFSS, Keysight ADS, Cadence Sigrity, CST, SPICE , or similar. Support hands-on lab validation using VNA, TDR, BERT, and high-speed oscilloscopes . Correlate simulation results with lab measurements to identify margin gaps, debug issues, and improve design methodology. Collaborate with silicon, package, board, connector, cable, and system design teams to optimize I/O channel performance. Work with interconnect vendors and ODMs to guide board layout, stack-ups, routing rules, and system design decisions. Review schematics, layouts, simulation results, and validation data for blade, backplane, and rack-level hardware. Prepare and communicate clear validation reports, measurement summaries, debug findings, and technical recommendations to internal teams, vendors, and senior technical stakeholders. Required Qualifications Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field . Strong experience in signal integrity for high-speed digital systems. Hands-on measurement expertise using VNAs, TDRs, BERTs, and high-speed oscilloscopes . Experience measuring and analyzing S-parameters, impedance profiles, eye diagrams, jitter, timing margins, insertion loss, return loss, and cro

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role We’re looking for signal integrity (SI) system design engineers who have a deep expertise in the SI area, and hold strong system level design knowledge This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance to new employees. In this role, you will: Lead system signal integrity (SI) design for AI supercomputer product in the data center application. Collaborate with chip, package, boards, rack and system engineers, design partners to drive system SI design and develop innovative interconnect and high-speed technologies Identify and evaluate new technologies and methodologies to improve signal and power integrity in product design, and contribute to the development of new products and technology by providing expertise in signal integrity Perform simulation and modeling to identify and troubleshoot signal integrity issues Lead system interconnect design, bring up and qualification As the scope of the role and team grows, understand and influence roadmaps for hardware partners for our datacenter networks, racks, and buildings. You might thrive in this role if you: Have at least 10 years of industry experience, including experience design hardware system and SerDes testing for data center applications Have a strong bias toward action, and won’t take no for an answer. Have experience and good knowledge of system design experience in the SI areas, from chip, SerDes, board, rack level Have ex

About the Team OpenAI’s Hardware organization develops silicon and system-level solutions designed for the unique demands of advanced AI workloads. The team builds next-generation AI-native silicon and systems while working closely with software, research, and manufacturing partners to co-design hardware tightly integrated with AI models. In addition to delivering systems for OpenAI’s supercomputing infrastructure, the team develops the tools, methodologies, and strategic partnerships needed to accelerate hardware innovation. About the Role We’re seeking an experienced Hardware Strategic Sourcing Manager to own sourcing strategy and supplier partnerships for fiber and optical interconnect components across OpenAI’s next-generation AI infrastructure. Reporting to the Head of Partnerships & Strategic Sourcing, you will lead sourcing across fiber cable assemblies, internal optical harnesses, fiber shuffles, optical backplane assemblies, connectorized and standalone passive optical assemblies, fiber-array units (FAUs), fiber-to-chip and coupling interfaces, detachable connectors, optical routing, and assigned optical packaging, assembly, and test services. You will work closely with electrical engineering, optical engineering, systems engineering, mechanical and packaging engineering, quality, rack integration, data-center deployment,manufacturing, supply chain, finance, legal, and program management teams to translate demanding bandwidth, signal integrity, reliability, and scale requirements into resilient supplier partnerships and scalable commercial strategies. Your work will directly support the performance, reliability, manufacturability, and scale of the high-speed optical connectivity required for OpenAI’s next-generation AI systems. In this role, you will: Develop and execute a comprehensive sourcing strategy for fiber and optical interconnect components supporting high-bandwidth AI systems and infrastructure. Own sourcing across optical fiber cable assembli

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is seeking a Signal Integrity Engineer to join our growing team. The ideal candidate will have a wealth of exposure designing high speed interconnects, breakout design, material trade-offs and verification. A background in electrical engineering, electronics or relevant fields is required. Must love all things high speed! This role is hybrid, based out of Santa Clara, CA or Austin, TX or Toronto, ON. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are You have a Bachelor’s degree in Electrical Engineering (or equivalent) and 5+ years working in high-speed digital design with a focus in high-speed PCB or package design at 10Gbps and above (e.g. 100GbE, GDDR6, PCIe Gen5+). You’re comfortable working with high-speed performance metrics such as ICR, ERL, COM, NEXT, and FEXT as well as knowledge of high-speed connector technologies, including NPO, CPO, and emerging standards. You are proficient with PCB ECAD tools (ideally Cadence Allegro). You communicate clearly (written and verbal), think critically, and love solving complex signal integrity problems. You’re enthusiastic about all things high speed and enjoy collaborating acro

About the Team: OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. In this role you will: As a Hardware Test Engineer, you will work on Machine Learning/AI hardware system projects to craft the solutions for current and future data center deployments. You will bring a strong understanding of hardware system testing, excellent project management skills, and the ability to collaborate across multiple teams to ensure efficient lab operations. You will be responsible for designing, implementing, and executing comprehensive test plans that ensure the reliability, performance, and scalability of our supercomputing hardware systems. You will develop detailed test plans and methodologies tailored to hardware components, including processors, memory modules, custom accelerators and interconnects. You will collaborate with hardware design, manufacturing, firmware teams and vendors to identify, analyze, and resolve issues affecting hardware, power, thermal and high-speed interconnects. You will perform in-depth debugging on the hardware system Excellent analytical skills to diagnose hardware issues, troubleshoot problems, and propose solutions. Ability to interpret complex test data, identify trends, and draw meaningful conclusions. High-speed links, with a focus on SerDes (Serializer/Deserializer) technology to assess signal integrity, error rates, and overall link performance. You will collaborate with the lab manager to maintain the equipment and hardware systems, including oscilloscopes, thermal test chambers, liquid cooling systems, and other mea

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role OpenAI's Hardware organization builds supercompute platforms from silicon and boards to full rack-scale systems to power advanced AI workloads. This role owns end-to-end quality for high-speed interconnect hardware across the product lifecycle: early design influence, supplier/contract manufacturer readiness, qualification, ramp, and fleet quality in lab and data center environments. You will be the quality lead for advanced interconnect components and assemblies, including high-speed copper cables, cable cartridges, patch panels, backplane/cable-backplane solutions, high-speed connectors, and related electro-mechanical interfaces. You will partner closely with electrical, mechanical, SI/PI, systems, reliability, operations, and external vendors to prevent escapes and drive rapid, data-driven containment and corrective action. In this role you will: Own quality for advanced interconnect components and assemblies: high-speed connectors, high-speed copper cables, cable cartridges (e.g., cable cassette style assemblies), patch panels & optics, and backplane/cable-backplane interconnect solutions. Drive quality-by-design: participate in design reviews, DFM/DFx, tolerance stacks, material and plating selections, connector mating strategy, strain relief, and assembly methods to reduce variation and field failures. Define and track quality and reliability metrics (DPPM, yield, escapes, RMA/FRACAS trends, Cpk/Ppk where applicable) for interconnects across NPI and m

Every day, tens of millions of people come to Roblox to explore, create, play, learn, and connect with friends in 3D immersive digital experiences– all created by our global community of developers and creators. At Roblox, we’re building the tools and platform that empower our community to bring any experience that they can imagine to life. Our vision is to reimagine the way people come together, from anywhere in the world, and on any device. We’re on a mission to connect a billion people with optimism and civility, and looking for amazing talent to help us get there. A career at Roblox means you’ll be working to shape the future of human interaction, solving unique technical challenges at scale, and helping to create safer, more civil shared experiences for everyone. As a member of the Infrastructure Foundation Hardware Engineering team, you will play a key role in enabling our mission to deliver a reliable, high-performing, and cost-efficient infrastructure that powers the world’s play. In this specialized role, you will be the technical lead for our GPU and AI accelerator ecosystem. You will be responsible for the full lifecycle of GPU hardware, from initial architectural evaluation and firmware qualification to large-scale fleet integration and performance tuning. You will ensure that Roblox’s massive-scale rendering and ML workloads run on the most optimized and stable hardware possible. You Will: Architect & Prototype: Prototype next-generation GPU-accelerated hardware platforms, ensuring seamless integration between high-density compute nodes, high-speed interconnects (NVLink/PCIe Gen5/6), and system firmware. GPU Optimization: Drive the integration, performance testing, and debugging of GPUs in our fleet, focusing specifically on hardware-level optimizations, driver tuning, and thermal/power management. Validation & Certification: Develop and execute rigorous evaluation and stress-testing strategies for GPU-heavy server platforms to ensur

We are the GPU Communications Libraries and Networking team at NVIDIA. We deliver communication libraries like NCCL, NVSHMEM, UCX for Deep Learning and HPC. DL and HPC applications have a huge compute demand already and run on scales which go up to tens of thousands of GPUs. The GPUs are connected with high-speed interconnects (eg. NVLink, PCIe) within a node and with high-speed networking (eg. Infiniband, Ethernet) across the nodes. Communication performance between the GPUs has a direct impact on the end-to-end application performance; and the stakes are even higher at huge scales! We are looking for a technical leader to manage our NVSHMEM and UCX libraries. This is an outstanding opportunity to push the limits on the state-of-the-art and deliver platforms the world has never seen before. Are you ready for to contribute to the development of innovative technologies and help realize NVIDIA's vision? What you will be doing: Lead, mentor, and grow your library engineering team and be responsible for the planning and execution of projects as well as the quality, and performance of your libraries. This is a technical leadership role so you will participate in feature design and implementation. Interact with internal and external partners and researchers to understand their use cases and requirements. Collaborate with engineering teams, program and product management, and partners to define the product roadmap. Continuously review and identify improvement opportunities in established processes, infrastructure, and practices to ensure the teams are executing in the most efficient and transparent manner. What we need to see: 10+ overall years of experience in the software industry with specialization in HPC networking or system software. 4+ years of management experience. BS, MS, or Ph.D. in C

NVIDIA is leading groundbreaking developments in Artificial Intelligence, High Performance Computing and Visualization. The GPU -- our invention -- serves as the visual cortex of modern computers and is at the heart of our products and services. Our work opens up new universes to explore, enables groundbreaking creativity and discovery, and powers inventions that were once considered science fiction, including artificial intelligence to autonomous cars. We are the GPU Communications Libraries and Networking team at NVIDIA. We build communication libraries like NCCL, NVSHMEM, and UCX that are crucial for scaling Deep Learning and HPC. We're seeking a Senior Software Architect to help co-design next-gen data center platforms and scalable communications software. DL and HPC applications have a huge compute demands and already run at scales of up to tens of thousands of GPUs. GPUs are connected with high-speed interconnects (e.g. NVLink, PCIe) within a node and with high-speed networking (e.g. InfiniBand, Ethernet) across nodes. Efficient and fast communication between GPUs directly impacts end-to-end application performance. This impact continues to grow with the increasing scale of next generation systems. This is an outstanding opportunity to advance the state-of-the-art, break performance barriers, and deliver platforms the world has never seen before. Are you ready to build the new and innovative technologies that will help realize NVIDIA's vision? What you will be doing: Investigate opportunities to improve communication performance by identifying bottlenecks in today's systems. Design and implement new communication technologies to accelerate AI and HPC workloads. Explore innovative solutions in HW and SW for our next generation platforms as part of co-design efforts involving GPU, Networking, and SW architects. Build proofs-of-concept, conduct experiments,

NVIDIA is leading the way in groundbreaking developments in Artificial Intelligence, High Performance Computing and Visualization. The GPU, our invention, serves as the visual cortex of modern computers and is at the heart of our products and services. Our work opens up new universes to explore, enables amazing creativity and discovery, and powers what were once science fiction inventions from artificial intelligence to autonomous cars. We are the GPU Communications Libraries and Networking team at NVIDIA. We deliver libraries like NCCL, NVSHMEM, UCX for Deep Learning and HPC. We are looking for a motivated Performance engineer to influence the roadmap of our communication libraries. The DL and HPC applications of today have a huge compute demand and run on scales which go up to tens of thousands of GPUs. The GPUs are connected with high-speed interconnects (eg. NVLink, PCIe) within a node and with high-speed networking (eg. Infiniband, Ethernet) across the nodes. Communication performance between the GPUs has a direct impact on the end-to-end application performance; and the stakes are even higher at huge scales! This is an outstanding opportunity for someone with HPC and performance background to advance the state of the art in this space. Are you ready for to contribute to the development of innovative technologies and help realize NVIDIA's vision? What you will be doing: Conduct in-depth performance characterization and analysis on large multi-GPU and multi-node clusters. Study the interaction of our libraries with all HW (GPU, CPU, Networking) and SW components in the stack Evaluate proof-of-concepts, conduct trade-off analysis when multiple solutions are available Triage and root-cause performance issues reported by our customers Collect a lot of performance data; build tools and infrastructure to visualize and analyze the information <li

About the Team OpenAI's Strategic Sourcing team helps the company scale responsibly, efficiently, and at speed. We partner with leaders across Engineering, Research, IT, Systems, Finance, Legal, and other teams to shape commercial strategies, negotiate critical agreements, and build resilient supplier ecosystems. Our work connects technical strategy, commercial judgment, financial discipline, and execution in support of OpenAI's mission. About the Role OpenAI is seeking a Strategic Technology Negotiations Lead to personally lead some of the company's most complex and consequential technology negotiations. This is not a people manager role. It is a senior strategic IC operator role for an expert negotiator who wants to remain close to the work and personally drive high-impact outcomes. We are especially interested in leaders who have managed teams and are intentionally seeking an individual contributor role where their impact comes through judgment, influence, and direct ownership. Rather than owning a fixed category, you will be deployed against high-priority opportunities where deal complexity, commercial stakes, executive visibility, or time pressure require exceptional negotiation leadership. Your initial focus will include data platforms and infrastructure, including data lake and lakehouse technologies, observability, and enterprise SaaS, with flexibility to work across other strategic technology areas. You will lead negotiations from strategy through execution, aligning decision-makers and driving agreements to closure. Many of these negotiations exist within broader supplier and partner ecosystems. You will look beyond the immediate transaction to account for interconnected cost, equity, revenue, partnership, risk, and long-term strategic implications. Success requires strong economics, sound judgment under pressure, executive credibility, and the ability to bring stakeholders with you through difficult decisions. This role is based in San Francisco, CA. We u

About Dawn Aerospace Dawn Aerospace is redefining space transportation through reusable, sustainable, and high-cadence flight systems. Our Aurora Spaceplane enables rapid access to suborbital space and speeds over Mach 3, serving a growing need for near-space testing, high-speed flight, and microgravity research. Together with our in-space propulsion business, Dawn is building the infrastructure for sustainable access to and operation in space. Role Overview Aurora is the first vehicle capable of flying missions to the edge of space multiple times a day. Your job is to transform this vehicle capability into mission success for our customers working from anywhere in the US - although Huntsville , USA is preferred (with domestic and international travel) . As a Mission Manager, your core role is to translate customer objectives into executable flight plans. You will be the customer’s interface to Dawn's flight operations, engineering, regulatory, and commercial teams. Throughout any project, you will coordinate the specialists required to solve individual problems while retaining responsibility for the mission. This is not a passive account-management role. You will be expected to assess mission feasibility, challenge customer assumptions, defend engineering realities, and drive clarity across complex, first-of-a-kind mission concepts. You will be the customer’s technical advocate inside Dawn, and Dawn’s operational interface to the customer. You will succeed here if you can lead through ambiguity, communicate with precision, and have the technical depth to engage meaningfully with aerospace engineers and flight operators, while keeping customers aligned, informed, and confident. Key Responsibilities Mission Ownershi

We are now looking for a Senior SRAM Engineer within our Full Custom Memory (FCM) team! The FCM team designs specialized RAM implementations across NVIDIAs wide array of processing chips. Be it high speed, low power, multiport, we engage closely with processor architecture teams to build custom solutions across the entire NVIDIA silicon portfolio. Are you interested in designing circuits for the next generation of AI chips? Join a team of dedicated engineers developing the custom SRAM circuits that help power these chips. What you'll be doing: Design best-in-class SRAM circuits using state-of-the-art technology processes Optimize circuits for performance, area, and power Collaborate with mask designers to craft high quality and dense pitch-matched layout Verify functionality, electrical integrity, and robustness Improve/develop flows and methodologies to streamline design automation, data collection, and analysis to ensure working silicon What we need to see: BS/MS/PhD (or equivalent experience) in Electrical or Computer Engineering Minimum 12 years of circuit design experience Strong understanding of SRAM and memory design techniques and macro/block development Ways to stand out from the crowd: Self-motivation, attention to detail, clear data analysis and presentation skills Familiarity with industry tools such as Cadence Virtuoso for schematic and layout, SPICE simulators, waveform viewers Background with developing and using various flows and methodologies, in

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. Role Overview We are seeking an experienced ASIC Package Signal Integrity / Power Integrity Engineer to drive electrical architecture, modeling, optimization, and validation for the most advanced AI/HPC silicon and package design. This role focuses on high-speed SerDes and memory channel architecture, advanced 2.5D/3D package SI/PI, substrate to package co-design, power-delivery-network optimization, electromagnetic modeling, and simulation-to-measurement correlation. The ideal candidate has strong hands-on experience with high-speed channel and PDN analysis across ASIC packages, interposers, substrates, and power-delivery structures, and can translate simulation results into practical design requirements for interposers and package substrate design optimization. The engineer will work closely with ASIC, package, system, mechanical, thermal, power, and silicon validation teams from early architecture and feasibility studies through production bring-up. In this role you will Own SI/PI architecture and analysis for advanced AI ASIC packages from early feasibility studies through production. Develop and optimize high-speed electrical channels for 200G/400G SerDes, PCIe, HBM, DDR, and chiplet/die-to-die interfaces. Perform package, interposer and substrate modeling using 2D/3D electromagnetic solvers. Define and optimize package stack-ups, transmission-line structures, via transitions, breakout structures, return paths, ground shielding, bump maps, and ball maps based on SI/PI re