Intern Design Engineer in United States

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we are transforming how the world uses information to enrich life. The High Bandwidth Memory (HBM) Design team develops industry-leading memory solutions that enable advances in Artificial Intelligence, high-performance computing, graphics, and data-center applications. Our engineers collaborate across global teams to deliver innovative memory architectures and semiconductor technologies that power next-generation computing systems. As an HBM Design Engineer Intern, you will work alongside experienced memory engineers and gain hands-on experience in semiconductor design, simulation, verification, and analysis. This internship provides exposure to industry-standard design methodologies, EDA tools, and cross-functional collaboration throughout the product development lifecycle. You will also have opportunities to apply AI-Assisted and AI-Enabled workflows to improve engineering productivity, debug efficiency, and design quality. Responsibilities Assist with the design, simulation, analysis, and verification of HBM memory and logic circuits using industry-standard semiconductor design tools. Support RTL development, circuit implementation, timing analysis, power analysis, and functional validation activities. Develop scripts, automation solutions, and AI-Assisted workflows to improve design productivity, debug efficiency, and design-flow quality. Collaborate with Design, Verification, Physical Design, CAD, and Product Engineering teams on technical reviews, debug activities, and project deliv

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we are transforming how the world uses information to enrich life. The High Bandwidth Memory (HBM) Design team develops industry-leading memory solutions that enable advances in Artificial Intelligence, high-performance computing, graphics, and data-center applications. Our engineers collaborate across global teams to deliver innovative memory architectures and semiconductor technologies that power next-generation computing systems. As an HBM Design Engineer Intern, you will work alongside experienced memory engineers and gain hands-on experience in semiconductor design, simulation, verification, and analysis. This internship provides exposure to industry-standard design methodologies, EDA tools, and cross-functional collaboration throughout the product development lifecycle. You will also have opportunities to apply AI-Assisted and AI-Enabled workflows to improve engineering productivity, debug efficiency, and design quality. Responsibilities Assist with the design, simulation, analysis, and verification of HBM memory and logic circuits using industry-standard semiconductor design tools. Support RTL development, circuit implementation, timing analysis, power analysis, and functional validation activities. Develop scripts, automation solutions, and AI-Assisted workflows to improve design productivity, debug efficiency, and design-flow quality. Collaborate with Design, Verification, Physical Design, CAD, and Product Engineering teams on technical reviews, debug activities, and project deliv

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology’s DRAM and Emerging Memory Group (DEG) is a distributed team of engineers and innovators focused on advancing next-generation memory technologies. For more than 43 years, Micron has been a leader in semiconductor innovation, delivering solutions that power applications ranging from artificial intelligence and high-performance computing to immersive digital experiences. The team is committed to innovation, integrity, sustainability, and meaningful community impact while driving the future of memory technology. As an HBM Memory Design Engineer, you will design, analyze, and optimize digital, analog, and memory circuits used in High Bandwidth Memory (HBM) products. You will collaborate with global design, verification, and product teams to develop high-performance DRAM solutions that meet manufacturability, reliability, and performance objectives. This role provides the opportunity to contribute to innovative memory technologies supporting AI, HPC, and data-centric applications. As part of Micron’s AI-Enabled workforce transformation, you will leverage AI-Assisted tools and data-driven methodologies to improve engineering productivity, accelerate design analysis, enhance decision-making, and drive innovation throughout the product development lifecycle. Responsibilities Design, analyze, and optimize memory, logic, and analog circuits for HBM products, including support for layout, validation, and tape-out activities. Perform circuit verification, parasitic modeling, and design simulations

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Design Technology Co-Optimization (DTCO) team works at the intersection of process technology, standard cell architecture, and design implementation to optimize power, performance, and area (PPA) for advanced memory products. The team collaborates closely with standard cell library, RTL, and physical design engineers to evaluate design tradeoffs and develop methodologies that improve silicon outcomes. As a DTCO Intern, you will gain hands-on experience assessing and optimizing PPA at the standard cell and logic block level. You will use industry-standard place-and-route tools and AI-enabled automation techniques to implement, benchmark, and optimize logic blocks while developing practical skills in physical design, timing closure, and design analysis. Responsibilities Implement standard cell logic blocks using industry-standard physical design tools, including floorplanning, placement, clock tree synthesis (CTS), routing, and optimization activities focused on PPA assessment. Analyze and benchmark power, performance, and area across standard cell libraries and logic block configurations, identifying opportunities for improvement. Perform static timing analysis (STA), investigate setup and hold timing violations, and support timing closure activities. Execute physical verification checks, including DRC, LVS, and IR-drop analysis, and assist with resolving design issues. Leverage Generative AI, AI Assistants, and Agentic AI solutions to automate data collection, reporting, comparison, and w

Our work at NVIDIA is dedicated towards a computing model focused on visual and AI computing. For two decades, NVIDIA has pioneered visual computing, the art and science of computer graphics, with our invention of the GPU. The GPU has also shown to be spectacularly effective at solving some of the most complex problems in computer science. Today, NVIDIA’s GPU simulates human intelligence, running deep learning algorithms and acting as the brain of computers, robots and self-driving cars that can perceive and understand the world. We are looking to grow our company and teams with the smartest people in the world and there has never been a more exciting time to join our team! The AI Infrastructure Product Design team creates software used by engineers and researchers to prepare data, run complex workflows, and understand results. This internship offers ownership of a defined product problem from early research through a tested design and implementation handoff. Designers on this team often move between Figma and working HTML prototypes, and may hand off HTML directly to engineering. This work calls for a high standard of visual and interaction design alongside technical fluency. The role is a good fit for someone who enjoys making technically complex systems easier to understand and who uses large language models and software agents thoughtfully as part of their design and prototyping process. What you will be doing: Own a focused design project for an internal AI infrastructure product, from understanding the problem through a validated design and implementation handoff. Interview engineers and researchers, map their workflows, and turn the findings into clear product requirements, user flows, and interaction models. Create precise, implementation-ready interface designs and interactive prototypes in Figma and HTML/CSS, with careful attention to typography, hierarchy, spacing, visual consistency, interactio

At Freddie Mac, our mission of Making Home Possible is what motivates us, and it’s at the core of everything we do. Since our charter in 1970, we have made home possible for more than 90 million families across the country. Join an organization where your work contributes to a greater purpose. We are accepting applications for this position until 10/16/2026 Position Overview: Are you looking for a company to help prepare you for a successful career? The Multifamily Division within Freddie Mac is searching for talented, curious, and motivated individuals to support the division's technology initiatives, projects, and strategic objectives. Freddie Mac Multifamily is a dynamic organization, providing interns with opportunities to contribute to real-world software development projects while building both technical and professional skills. As a Software Development Intern, you will gain hands-on experience throughout the software development lifecycle, working alongside experienced engineers to design, build, test, and support applications that help advance Freddie Mac's mission. Our Impact: The Multifamily Technology team develops and maintains critical applications and digital solutions that support Freddie Mac's Multifamily business. Our teams leverage modern software engineering practices, Agile methodologies, cloud technologies, and AI-enabled tools to deliver innovative, scalable solutions. We collaborate closely with business and technology partners to solve complex challenges, improve operational efficiency, and deliver products that support Freddie Mac's role in the housing finance industry. Your Impact: Contribute to real-world software development projects and support initiatives that drive business and technology outcomes. Participate in all phases of the software development lifecy

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we are transforming how the world uses information to enrich life through innovative memory and storage solutions. The DRAM Thin Films Process Engineering team develops advanced materials and deposition processes that enable future memory scaling, improved device performance, and next-generation semiconductor technology. Our team works at the forefront of process development to support DRAM technologies that power artificial intelligence, cloud computing, and data-intensive applications. As a DRAM Thin Films Process Engineering Intern, you will work alongside experienced engineers on a high-impact summer project focused on semiconductor process development and optimization. This role provides hands-on experience with experimental design, process characterization, data analysis, and multi-functional collaboration. You will contribute to real engineering challenges and present your results to technical and leadership audiences at the conclusion of the internship. Responsibilities Research and develop innovative solutions that support next-generation memory technology and thin film process advancement. Develop, complete, and analyze experiments to improve thin films process performance, manufacturability, and product quality. Apply statistical analysis, data science techniques, and AI-enabled tools to identify process trends, optimize performance, and accelerate engineering decision-making. Partner with process, equipment, and integration engineering teams to solve complex technic

About Graphcore Graphcore is a global leader in artificial intelligence computing systems. We design advanced semiconductors and data center hardware that deliver the specialized processing power needed to advance AI while improving the efficiency required for broad adoption. As part of SoftBank Group, Graphcore belongs to a family of companies developing some of the world’s most transformative technologies. Our new AI Engineering Campus in Austin will play a central role in building the future of AI computing. The Opportunity We are seeking a system validation engineering intern to help drive server blade and rack validation efforts for next-generation AI infrastructure hardware systems. This role focuses on post-silicon system validation across the full lifecycle of server hardware systems, ensuring functional and performance meets product objectives. You will help drive end-to-end blade and rack validation including development, execution, and debug while collaborating across silicon, firmware, systems, and platform teams. The Blade and Rack Validation team is responsible for ensuring system readiness and quality at scale. The team works cross-functionally with firmware, silicon, and system engineering teams to validate complex AI compute platforms. Type: 12-week summer internship Timing: May - August (exact dates to be confirmed) Commitment: Full-time What You’ll Do Help drive and execute post-silicon validation goals of AI compute blades and racks including testcase planning, development, and automation Help drive validation testcase execution and system debug against program achievements and report validation progress and risks. Drive provisioning and integration of system components (SoC FW, BMC, RMC, OS) for rack-level readiness Triage test failures, collect debug data, and collaborate on root cause analysis. Track validation coverage and continuously improve test processes and infrastructure. What You’ll Bring Working towards a Bachelor's

About Graphcore Graphcore is a global leader in artificial intelligence computing systems. We design advanced semiconductors, software, and data center systems that provide the specialized processing power needed to advance AI while improving the efficiency required for broad adoption. As part of SoftBank Group, Graphcore belongs to a family of companies developing transformative technologies. Our U.S. engineering teams contribute to the hardware and software platforms that support the next generation of AI systems. The Opportunity We are looking for a computer engineering, electrical engineering, or computer science student or recent graduate to join the BMC Development team as a Firmware Engineering Intern. You will work with experienced engineers on low-level and embedded firmware that supports the operation, control, and manageability of advanced compute systems. This internship provides hands-on experience in firmware development, test automation, engineering experiments, and lab-based system testing in a Linux development environment. You will own clearly defined technical tasks with guidance from the team and contribute to production-quality engineering work. Type: 12-week summer internship Timing: May - August (exact dates to be confirmed) Commitment: Full-time What You Will Do Contribute to the design, implementation, and testing of system and embedded firmware. Develop and maintain firmware and supporting software in C, C++, or Python. Support firmware development and debugging in a Linux-based engineering environment. Create automated tests and scripts that improve firmware validation, test coverage, and engineering efficiency. Contribute to continuous integration and delivery workflows for firmware development and testing. Plan and conduct well-defined engineering experiments, record results accurately, and draw conclusions from test data. Support lab setup, system configuration, hardware bring-up, and firmware testing. Use debugging and diagnostic techn

About Graphcore Graphcore is a global leader in artificial intelligence computing systems. We design advanced semiconductors and data center hardware that deliver the specialized processing power needed to advance AI while improving the efficiency required for broad adoption. As part of SoftBank Group, Graphcore belongs to a family of companies developing some of the world’s most transformative technologies. Our new AI Engineering Campus in Austin will play a central role in building the future of AI computing. The Opportunity As a Mechanical Engineering Intern, you will contribute to the mechanical design and thermal validation of advanced AI hardware. Working alongside experienced mechanical and thermal engineers, you will gain hands-on experience with 3D computer-aided design (CAD), laboratory setup, test development, prototype evaluation, and engineering documentation. Type: 12-week summer internship Timing: May - August (exact dates to be confirmed) Commitment: Full-time What You’ll Do Contribute to mechanical design activities using Creo or comparable 3D CAD software, including part modeling, assemblies, drawings, and design updates under the guidance of experienced engineers. Work with the thermal engineering team to develop test procedures and help set up laboratory capabilities for evaluating AI hardware. Support thermal and mechanical testing using appropriate laboratory equipment; collect, organize, and analyze test data. Assist the mechanical and thermal design teams with prototype evaluation, troubleshooting, design verification, and documentation of findings. Collaborate with cross-functional engineering partners, communicate progress and issues clearly, and follow applicable laboratory and safety procedures. What You’ll Bring Current enrollment in a bachelor's, master's, or doctoral program in mechanical engineering or a related discipline during the internship. Students in other disciplines with relevant mechanical engineering exper

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is expanding its semiconductor manufacturing operations in Boise through a historic $15 billion investment that will support next-generation DRAM production and advanced manufacturing capabilities. This growth creates exciting opportunities for students to contribute to the future of semiconductor technology while working in a highly collaborative, data-driven manufacturing environment. The High Volume Manufacturing Process Engineer Intern supports process optimization, yield improvement, throughput enhancement, cost reduction, and issue resolution within a manufacturing area. This role partners closely with equipment engineering, operations teams, process owners, and cross-functional stakeholders to improve process performance and achieve key manufacturing objectives. Responsibilities Drive process optimization and manufacturing efficiency initiatives by monitoring process performance, analyzing data, and supporting area throughput and wafer output goals. Identify, troubleshoot, and resolve process issues that could result in yield loss, defects, equipment restrictions, excursions, or production impacts, escalating concerns when necessary. Apply SPC, FDC, Design of Experiments (DOE), and structured problem-solving methodologies, including 8D, to improve process capability and equipment performance. Partner with process owners, operations teams, and engineering stakeholders to address chronic process issues and support continuous improvement initiatives. Leverage Artificial Intelligence and data a

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Boise site is undergoing a historic $15 billion investment in semiconductor manufacturing, with DRAM production planned for the second half of the decade. As part of Micron’s global $150 billion expansion, our High Volume Manufacturing team drives innovation and operational excellence to deliver world-class memory solutions. As an ID1 High Volume Manufacturing Process Engineer Intern , you will work on process optimization, yield improvement, and cost reduction initiatives. This role involves collaborating with equipment teams, operations leaders, and multi-functional collaborators to ensure area critical metrics are met and wafer output is optimized. Responsibilities Finish the required safety training and adhere to safety policies and laws. Ensure proper tool documentation and update reaction mechanisms as needed. Supervise and resolve issues impacting yield, excursions, defects, or output loss. Apply SPC, FDC, and 8D methodologies to optimize processes and improve tool availability. Analyze data using engineering knowledge and visualization tools to make critical process decisions. Perform project work to optimize wafer processing and increase wafer outs. Update or create procedures to align with area and global practices. Minimum Qualifications Current student in an engineering or related degree program; graduation date not before September 2027. Understanding of SPC and Design of Experiments. Prof

We’re looking for Software Engineering Interns to help build and scale the systems that power Datadog’s observability and security platform. Interns contribute directly to real-world engineering challenges across backend, frontend, infrastructure, data engineering, and developer tooling while working alongside experienced engineers and mentors. You’ll help design, build, and improve systems that process and analyze massive volumes of metrics, logs, and application data in real time. Whether you’re interested in distributed systems, Kubernetes, AI-powered products like Bits AI, or developer platform tooling, you’ll work on meaningful projects that deliver impact to customers at global scale. At Datadog, we place value in our office culture - the relationships and collaboration it builds and the creativity it brings to the table. We operate as a hybrid workplace to ensure our Datadogs can create a work-life harmony that best fits them. What You’ll Do: Contribute to production systems that process and analyze large-scale observability and application data in real time Build and improve distributed systems across backend infrastructure, developer platforms, and cloud-native services Help identify and solve performance, reliability, and scalability challenges in critical services supporting Datadog’s growing customer base Own and deliver technical projects from design through deployment with support from experienced engineers and mentors Develop technical expertise through hands-on experience with technologies such as Kubernetes, distributed systems, and cloud-native infrastructure Collaborate with fellow interns, mentors, and engineers while building software that delivers impact at global scale Who You Are: Pursuing a degree in Computer Science, Software Engineering, or a related technical field, or have equivalent practical experience Targeting a 2028 full-time start date Demonstrate strong computer science fundamentals, including data structures,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Thin Films Equipment Engineering team at Micron develops and enhances advanced semiconductor manufacturing equipment in a fast-paced research and development environment. The team works closely with Process Engineering, Facilities Engineering, and equipment suppliers to enable next-generation memory technologies and achieve world-class equipment performance. Through innovation, collaboration, and data-driven decision-making, the team plays a critical role in advancing semiconductor technology development. As a Thin Films Equipment Engineering Intern, you will gain hands-on experience working with groundbreaking semiconductor equipment and processes. You will support engineering projects focused on equipment optimization, data analysis, and technology development while collaborating with multi-functional teams. This role provides exposure to semiconductor manufacturing, experimental design, and the application of advanced analytics to solve complex engineering challenges. Responsibilities Collect, analyze, and interpret equipment and process data to find opportunities for performance optimization and continuous improvement. Support structured engineering experiments, document findings, and communicate results through technical reports and presentations. Collaborate with Equipment Engineering, Process Engineering, Facilities Engineering, and equipment suppliers to address technology-development challenges and improve equipment performance. Develop an understanding of equipment hardware,

We’re looking for Software Engineering Interns to help build and scale the systems that power Datadog’s observability and security platform. Interns contribute directly to real-world engineering challenges across backend, frontend, infrastructure, data engineering, and developer tooling while working alongside experienced engineers and mentors. You’ll help design, build, and improve systems that process and analyze massive volumes of metrics, logs, and application data in real time. Whether you’re interested in distributed systems, Kubernetes, AI-powered products like Bits AI, or developer platform tooling, you’ll work on meaningful projects that deliver impact to customers at global scale. At Datadog, we place value in our office culture - the relationships and collaboration it builds and the creativity it brings to the table. We operate as a hybrid workplace to ensure our Datadogs can create a work-life harmony that best fits them. What You’ll Do: Contribute to production systems that process and analyze large-scale observability and application data in real time Build and improve distributed systems across backend infrastructure, developer platforms, and cloud-native services Help identify and solve performance, reliability, and scalability challenges in critical services supporting Datadog’s growing customer base Own and deliver technical projects from design through deployment with support from experienced engineers and mentors Develop technical expertise through hands-on experience with technologies such as Kubernetes, distributed systems, and cloud-native infrastructure Collaborate with fellow interns, mentors, and engineers while building software that delivers impact at global scale Who You Are: Pursuing a degree in Computer Science, Software Engineering, or a related technical field, or have equivalent practical experience Targeting a 2028 full-time start date Demonstrate strong computer science fundamentals, including data struc