Td Media And Collaterals Development Engineer in United States

Job Details: Job Description: As a Packaging Module Development Engineer, you will play a pivotal role in the development and optimization of Intel's assembly media and collaterals. Your daily work will involve designing innovative solutions to improve media and collateral reliability, manufacturability, and cost efficiency. Your contributions will directly support Intel's cutting-edge assembly packaging technology roadmap, driving advancements in semiconductor manufacturing processes. Business Group You will be part of Intel Corporation's Media Development organization, a team dedicated to advancing packaging technologies and manufacturing processes. This group operates at the forefront of innovation, enabling high-performance products and driving Intel's leadership in the semiconductor industry. By joining this collaborative environment, you will contribute to Intel's broader goals of delivering transformative technology solutions. Key Responsibilities Develop and optimize media and collaterals to meet quality, reliability, cost, yield, and productivity targets. Design and implement new media and collateral solutions, leveraging statistical methods like Design of Experiments (DOE) and Statistical Process Control (SPC). Conduct evaluations of media and collaterals under simulated field conditions, including tests for heat, humidity, temperature cycling, and dynamic forces. Lead initiatives to identify and mitigate media and collateral quality and reliability risks, utilizing innovative tools and methods. Provide technical consultation on media and collateral challenges and deliver solutions that align with operational and technology milestones. Document technical improvements and innovations through research papers and presentations. <p styl

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Would you like to work in one of the most complex Fab environments in the world? As an industrial engineering intern in our research and development factory you will work on projects that further optimize our very automated factory. This role will provide exposure to larger data sets than you have ever worked with and will challenge your data management skills. Not only will this role significantly grow your skills but will also provide exceptional value to the organization on a real issue in our factory! Responsibilities: Identify key performance indicators for R&D program success. Use large data sources to extract and analyze planning data. Build reporting in Tableau and other systems to convey data to program teams. Construct infographics that display key information in easy-to-understand formats. Leveraging AI tools and find new ways to apply AI in the workplace. Minimum Qualifications: Working towards completion of a Bachelor’s or Master’s degree in the following areas: industrial engineering, manufacturing engineering, supply chain, Operations or other related discipline with expected graduation after this internship timeframe Must be a current student, and cannot graduate prior to September 2027. Ability to code in SQL, Python or similar to execute data extraction. Effective with Excel, Tableau or other data management and visualization software. Preferred Qualifications: Skille

Job Details: Job Description: As one of the world's largest semiconductor manufacturers, Intel is committed to advancing every aspect of semiconductor technology, from process development and manufacturing to advanced packaging and reliability characterization. Employees within Intel Foundry are part of a global network spanning technology development, manufacturing, assembly, test, and quality organizations across both front-end silicon and advanced packaging facilities. You will join the Foundry Lab Network (FLN), a key organization within Foundry Quality, Reliability, and Labs (FQRL), located at Intel's growing Chandler, Arizona site. This site serves as the technology development hub for Intel's most advanced packaging technologies, including Hybrid Bond Interconnect (HBI), Embedded Multi-die Interconnect Bridge (EMIB-T), glass substrates, Foveros, and future advanced packaging innovations. FLN is actively expanding its laboratory capabilities and capacity to support Intel Foundry's roadmap, enabling faster technology qualification and accelerating development cycles through Quick Turn Monitoring (QTM) solutions that significantly reduce time-to-data. As the Stress Test and Reliability (STaR) Back-End Laboratory Manager, you will play a critical leadership role within FLN. You will partner closely with Packaging Technology Development, Quality and Reliability, and Failure Analysis teams to establish and enhance laboratory capabilities that support qualification and certification of next-generation packaging technologies and products. This position offers a unique combination of people leadership, technical problem solving, and organizational strategy. You will lead a team of 7-10 talented engineers, spearhead cross-functional efforts to resolve complex reliability and technology challenges, drive strong quality and operati

Job Details: Job Description: As the world's largest chip manufacturer, and a global leader in innovation and new technology, Intel strives to make every facet of semiconductor manufacturing state-of-the-art - from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth. We're constantly working on making a more connected and intelligent future, and we need your help. Change tomorrow. Start today. What we offer: We foster a collaborative, supportive, and exciting environment where the brightest minds in the world come together to achieve exceptional results. We give you opportunities to transform technology and create a better future, by delivering products that touch the lives of every person on earth. What we do: Join the Logic Technology Development (LTD) organization, a powerhouse of process technology innovation driving Intel's IDM 2.0 strategy to exceed the aspirations of our global customers. We are seeking a visionary Principal Engineer to lead the charge in Intel's foundry revolution, serving as a strategic technical architect and executive partner in guiding our most critical customers through the entire product development lifecycle. In this leadership capacity, you will orchestrate multidisciplinary strategies spanning device engineering, product integration, and yield analysis to steer customers from critical design tape-out and pre-silicon evaluation through to NPI silicon qualification. Furthermore, you will define t

Job Details: Job Description: As a Material Analysis (MA) Technician, you will be part of a Technology Development (TD) and High-Volume Manufacturing (HVM) lab responsible for performing material analysis and failure analysis in support of Intel's silicon process development and high-volume production. You will work on developing imaging, composition analysis and sample preparation techniques, and best-known methods (BKMs) to improve lab analysis quality, efficiency and output. You will directly interface with TD and HVM fab customers and quality/reliability engineers to develop solutions to problems by utilizing lab capabilities. The scope may include wafer and unit level, front-end modules and back-end/far back-end modules. Responsibilities may include but not be limited to: • Conducting hands-on analysis by effectively utilizing lab techniques, from sample prep micro-cleaver, ion mill etcher, mechanical polish to SEM/EDX, Dual beam FIB, TEM techniques to characterize Si fabricated structures at nanometer scales and integrated circuit device to improve process, performance and reliability; and to identify physical failure mode toward the root-cause identification. • Conducting hands-on data collection with various lab equipment’s, and assisting engineers to implement materials characterization techniques to determine fundamental thin film material structure/properties and to collaborate with process development engineers across functional areas and organizations to improve process performance and reliability. • Supporting and sustaining lab equipment. Ensuring that lab analytical capabilities needed to support advanced transistor and interconnect technology and/or product development are in place. Cooperating with other lab areas beyond local MA/FA (Failure Analysis) labs to achieve

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The TD Electrical Device Characterization team pushes the boundaries of Micron’s memory technology. We explore device behavior, uncover insights through data, and collaborate across engineering teams to enable next-generation products. We are a hands-on team that values curiosity, precision, technical rigor, and collaboration. In this role, you will drive electrical characterization for advanced memory technologies and partner with device, process, and product teams to turn measurements into actionable technical insights. Your work will help guide technology development and shape the performance and reliability of future NAND, DRAM, and emerging memory products. Responsibilities: Lead electrical characterization for advanced memory devices Develop measurement methods, algorithms, and scalable characterization standards Automate data pipelines and analysis using Python, JSL, C/C&#43;&#43;, and dashboard tools Architect test setups and manage wafer probe and ATE test flows Investigate device behavior, identify root causes, and communicate technical findings Minimum Qualifications: <span style="color:#6

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Site Inventory Control (SIC) team is at the forefront of our ambitious expansion efforts. SIC plays a pivotal role in connecting wafer starts, inventory strategy, cycle time management, output delivery, and factory execution. As a Senior Engineer for Fab 4 HVM SIC, you will be the operational hub, driving alignment between Technology Development (TD), High Volume Manufacturing (HVM), Probe, Supply Chain, Planning, and Engineering organizations. This outstanding opportunity allows you to lead the charge in optimizing inventory and cycle time performance while ensuring flawless factory execution! We are looking for individuals who thrive on collaboration and tackling complex operational challenges. You'll have the chance to bring to bear data to drive decisions and implement AI-enabled solutions to improve speed, accuracy, and decision-making. Responsibilities: Lead multi-functional initiatives for wafer starts, inventory, cycle time, and output performance to support business commitments Develop and improve inventory control methodologies, business processes, and operational metrics and recommend corrective actions Develop and implement inventory, priority, and capacity strategies for New Product Introduction (NPI) programs Foster coordination between Technology Development, High Volume Manufacturing, Supply Chain, Planning, and Engineering teams to optimize inventory positions and factory flow Identify and mitigate constraints, risks, and op

Job Details: Job Description: Embark with us on a journey of growth and transformation as we create exceptionally engineered technology and bring AI everywhere. As a valued team member, your adaptability and attention to detail will contribute to our drive for results and relentless pursuit of quality, ensuring we meet our customers' needs with precision. Life at Intel: https://jobs.intel.com/en/life-at-intel As a Yield Development Engineer, you will be at the forefront of advancing Intel's cutting-edge process technologies within our Logic Technology Development (LTD) organization. This pivotal role involves identifying root cause yield limiters and driving solutions that enhance manufacturability and yield across technology nodes. You will work within a dynamic, fast-paced environment to ensure the successful introduction of new products, process improvements, and robust methodologies to meet manufacturing goals. Your expertise will directly contribute to Intel's ability to deliver world-class semiconductor solutions and advance the future of computing. About Intel Foundry At Intel, the Foundry Technology Development (TD) unit is the driving force behind Moore's Law, enabling us to create groundbreaking technology that enriches lives globally. With over 15,000 dedicated employees, Foundry TD spearheads innovative research, develops next-generation processes and packaging technologies, and manages high-volume manufacturing in state-of-the-art facilities. Within Intel Foundry TD, our Logic Technology Development (LTD) organization is at the forefront of creating and refining each process technology node, paving the way for tomorrow's computing solutions. Your responsibilities as a Product Yield Development Eng

F-18 Landing Gear Technical Support Specialist Company: Boeing Aerospace Operations Boeing Global Services (BGS) is seeking an F/A-18 Landing Gear Technical Support Specialist in Fort Walton Beach, FL. This individual will compile, analyze and format data to produce engineering lifecycle products, services and processes. The specialist will verify regulatory conformance and contractual compliance, enforce configuration control, and maintain design and maintenance documentation to company, contractual and Navy standards. Position Responsibilities: Compile, analyze and format technical and maintenance data to produce and maintain engineering lifecycle products, spreadsheets, web pages (e.g., SENTINAL), and other documentation Verify regulatory conformance and contractual compliance of products using standard guidelines; identify and document nonconformances and follow through to resolution Maintain configuration control and design documentation per company, contractual and Navy standards (CNAFINST 4790.2 Series / NAMP) Read, interpret and apply Navy Technical Directives (TD), Supplemental Technical Certificates (STC), Airworthiness Directives (AD), and engineering guidance to ensure compliant repairs and configuration actions Create, update and maintain Assembly Service Records (ASR), Equipment History Records (EHR), and Scheduled Component Repair (SRC) cards IAW CNAFINST 4790.2 Series Administer and update the OOMA NALCOMIS Configuration Management Database to manage logsets, track life limits and record component histories Use and maintain Navy databases (e.g., NATEC, Deckplate) to support configuration and maintenance actions Process and track aircraft components for overhaul per OEM instructions

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are at the heart of advanced DRAM node development, driving innovations from concept to high-volume production. Our team partners closely across Technology Development, Design, Quality, and Manufacturing to bring innovative memory technologies to life. If you’re excited about translating breakthrough ideas into real-world impact, you’ll find this work both challenging and rewarding. As a High Volume Manufacturing (HVM) Node Development Product Engineer, you will play a central role in introducing new DRAM nodes into production at the ID1 fab. This role connects development to manufacturing—owning yield ramp, cost efficiency, and quality improvements. You’ll collaborate cross-functionally to solve complex problems, improve product performance, and ensure successful technology transfer at scale. Responsibilities: Lead new node startup, qualification, yield ramp, and production readiness Guide development teams on process integration using deep technical insight Analyze yield data and electrical failures to drive measurable improvements Partner with Design, TD, Quality, and Test teams to resolve yield and performance issues Use statistical tools and lab analysis to identify root causes and optimize processes Minimum Qualifications: Bachelor’s degree in Electrical Engineering, Computer Engineering, or related field Familiarity with DRAM architecture, operation, testing, and process integration Understanding of CMOS fundamentals and

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all . Micron's Equipment Engineering organization is at the forefront of enabling advanced semiconductor manufacturing at scale within the newest U.S. memory fabrication facility. The CMP team collaborates closely with Manufacturing, Technology Development, Procurement, Facilities, and global engineering partners to drive equipment performance, innovation, and operational excellence. This team plays a meaningful role in delivering world-class yield, throughput, and cost performance. As the CMP Equipment Manager , you will lead and develop a high-performing team responsible for CMP equipment engineering . This role is accountable for setting the strategic vision, optimizing manufacturing performance, and aligning execution to Micron's global business objectives. You will partner internally and externally to enable best-in-class equipment capability while fostering a culture of collaboration, innovation, and continuous improvement. Responsibilities Lead and develop an elite CMP equipment engineering team, establishing clear performance targets aligned to fab output, yield, and cost objectives. Drive manufacturing optimization through equipment performance improvement, yield enhancement, throughput maximization, and cost reduction using data-driven methodologies. Partner cross-functionally (Manufacturing, TD, ATE, Procurement, Facilities) and globally to depl