Advanced Engineering & Manufacturing Internship (Singapore)

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we are transforming how the world uses information to enrich life through innovative memory and storage solutions. The DRAM Thin Films Process Engineering team develops advanced materials and deposition processes that enable future memory scaling, improved device performance, and next-generation semiconductor technology. Our team works at the forefront of process development to support DRAM technologies that power artificial intelligence, cloud computing, and data-intensive applications. As a DRAM Thin Films Process Engineering Intern, you will work alongside experienced engineers on a high-impact summer project focused on semiconductor process development and optimization. This role provides hands-on experience with experimental design, process characterization, data analysis, and multi-functional collaboration. You will contribute to real engineering challenges and present your results to technical and leadership audiences at the conclusion of the internship. Responsibilities Research and develop innovative solutions that support next-generation memory technology and thin film process advancement. Develop, complete, and analyze experiments to improve thin films process performance, manufacturability, and product quality. Apply statistical analysis, data science techniques, and AI-enabled tools to identify process trends, optimize performance, and accelerate engineering decision-making. Partner with process, equipment, and integration engineering teams to solve complex technic

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Would you like to work in one of the most complex Fab environments in the world? As an industrial engineering intern in our research and development factory you will work on projects that further optimize our very automated factory. This role will provide exposure to larger data sets than you have ever worked with and will challenge your data management skills. Not only will this role significantly grow your skills but will also provide exceptional value to the organization on a real issue in our factory! Responsibilities: Identify key performance indicators for R&D program success. Use large data sources to extract and analyze planning data. Build reporting in Tableau and other systems to convey data to program teams. Construct infographics that display key information in easy-to-understand formats. Leveraging AI tools and find new ways to apply AI in the workplace. Minimum Qualifications: Working towards completion of a Bachelor’s or Master’s degree in the following areas: industrial engineering, manufacturing engineering, supply chain, Operations or other related discipline with expected graduation after this internship timeframe Must be a current student, and cannot graduate prior to September 2027. Ability to code in SQL, Python or similar to execute data extraction. Effective with Excel, Tableau or other data management and visualization software. Preferred Qualifications: Skille

Job Details: Job Description: The Role and Impact Join Intel as a Module Engineer, where you will play a pivotal role in enhancing the production of advanced integrated circuits. In this position, you will own and optimize high-volume manufacturing equipment and processes, ensuring precision and minimizing defects. Your contributions will directly impact manufacturing efficiency, quality, and scalability, enabling Intel to maintain its leadership in semiconductor innovation. Business Group The role is part of Intel's Assembly Test Manufacturing (ATM) division, which serves as the backbone of Intel's back-end manufacturing operations. ATM supports Intel's diverse portfolio of products across key business segments, including client, server, automotive, and connectivity. The group focuses on advanced packaging and manufacturing technologies to deliver competitive solutions, aligning with Intel's IDM 2.0 strategy to drive innovation and global leadership. Key Responsibilities Own and optimize high-volume manufacturing equipment and processes to achieve production efficiency, quality, and cost goals. Conduct tests and measurements to control critical dimensions and minimize defectivity in production lines. Recommend and implement modifications to improve operational efficiencies, manufacturing techniques, and output performance. Expand high-volume manufacturing capacity to demonstrate technology capabilities and ensure seamless transfer to global manufacturing sites. Execute equipment maintenance, repair activities, and continuous improvement initiatives aligned with safety, quality, productivity, and yield metrics. Develop systems for excursion prevention and identify discrepant material or activities within equipment and processes. Manage equipm

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an Intern Product Yield Enhancement (PYE) Engineer at Micron Technology Inc., you will assist in taking next generation DRAM devices from design to mass production! PYE Engineers are crucial partners between Research and Development, Manufacturing, Product Engineering and Global Quality teams. Our goal is to offer hands-on and substantial engineering projects that allow interns to gain valuable experience with memory systems and the product life cycle while adding impact to Micron’s business. Our intern programs help prepare engineers for future roles and offer an extraordinary experience that supplements your academic experience! The PYE Engineering role is critical to Micron as it serves the company's charter to be the most cost-effective producer of DRAM memory while delivering the quality and reliability that customers expect from the Micron brand. This position is for a 3-month internship. Responsibilities: Your job duties will include detailed DRAM electrical and physical failure analysis. Identify defects introduced by the semiconductor fabrication process. You will data mine using statistical analysis, AI assisted engineering tools, and automation workflows. Find the root cause of failure mechanisms, communicating results with Management, Product, Process and Test Engineering teams. Complete 3-month internship. Minimum Qualifications: Must be pursuing a minimum of a bachelor’s degree in Electrical Engineering, Computer Engineering,

Chief Engineer - Patriot Advanced Capability (PAC-3) Company: The Boeing Company Boeing Defense, Space & Security (BDS) is searching for an inspiring and visionary Chief Engineer to lead groundbreaking engineering transformation for the PAC-3 Acceleration Efforts in Huntsville, AL . This pivotal role offers a unique opportunity to be at the forefront of accelerating production rates by driving innovative design for manufacturability and testability, optimizing production systems, and pioneering advanced engineering solutions that empower high-rate manufacturing success. As production demands soar, you will be the catalyst transforming engineering processes and production capabilities—ensuring we not only meet ambitious acceleration targets but also uphold Boeing’s renowned standards of quality and technical excellence. The Chief Engineer will serve as a strategic technical leader, spearheading engineering changes essential to unlocking higher production rates. You will collaborate seamlessly with engineering, manufacturing, quality, supply chain, and production teams to enhance product designs and processes geared toward efficiency, scalability, and continuous improvement. Position Responsibilities: Lead and champion engineering transformation initiatives to significantly accelerate PAC-3 production rates Drive and embed design for manufacturability (DFM), design for testability (DFT), and design for assembly (DFA) practices that enable smooth, high-rate production Partner closely with manufacturing and production teams to innovate and implement enhancements in production systems, tooling,

Work Flexibility: Hybrid I am delighted to share that we are now accepting applications for our Stryker Advanced Operations (AO) Global Engineering Development Programme (AOGEDP) – to begin in September 2027. If you are an upcoming or recent graduate in a Level 8 or above Engineering, Software or Digital discipline-based Degree, then this is the opportunity for you! Advanced Operations (AO) is Stryker’s function that specialises in new product introductions across all of our divisions. The “ AO Global Engineering Development Programme ” is a 2 0 - month structured programme that provides participants the opportunity to be part of a global team, with exposure to cutting edge technology varying from traditional manufacturing processes to a dditive manufacturing and Robotics, as well as interactions with market leading Product Development , Quality Assurance and Operations teams from across the 9 Stryker divisions. The programme focuses on developing the skillset s , mindset and toolkit of each participant to enable them for success within Advanced Operations to