Job Details: Job Description: Join Intel's Advanced Packaging Technology Development - Substrate and Wafer Assembly (ATPD: SWA) team and help us fulfill our mission to be the supplier of choice for leading-edge, cost-effective substrate packaging. As a Manufacturing Equipment Technician, you will support critical manufacturing equipment and drive continuous improvement in a highly technical, cleanroom production environment. Shift 5: Shift 5: (days frontend) AM-PM Sun-Tues and alternating Wednesday days / Hours: 6:00 a.m.-6:00 p.m. Manufacturing Equipment Technicians in Advanced Packaging Technology Development: Substrate and Wafer Assembly are responsible for: Performing electrical and/or mechanical troubleshooting to diagnose issues with non-functioning electromechanical equipment used in semiconductor manufacturing. Dismantling, adjusting, repairing, and assembling equipment according to layout plans, blueprints, operating or repair manuals, rough sketches, or engineering drawings. Performing setup, calibration, and preventive maintenance on production equipment, with a focus on wet chemistry, plating, and dry high-vacuum toolsets. Documenting maintenance activities, repairs, parts usage, and findings in accordance with established procedures and systems. Collaborating with engineering, process, and support teams to improve tool performance, reduce equipment downtime, and enhance process capability and reliability. Leading or contributing to continuous improvement projects, including root cause analysis, yield and uptime improvement initiatives, and optimization of maintenance practices. Assignments are semi-routine in nature and performed within generally defined parameters. Employees normally receive general instructions on most work and are expected to exer

Job Details: Job Description: As a Module Equipment Technician, you will play a vital role in ensuring the smooth operation of advanced manufacturing equipment used in semiconductor production. You will perform hands-on troubleshooting, maintenance, and calibration of electromechanical systems while supporting experiments and equipment modifications that drive cutting-edge advancements. Your work will directly contribute to enhancing equipment reliability and optimizing production efficiency, making an essential impact on Intel's manufacturing operations. Business Group Join Intel's Advanced Packaging Technology Development - Substrate and Wafer Assembly (ATPD: SWA) organization, a leader in delivering innovative and cost-effective substrate packaging solutions. This business group is focused on advancing Intel's capabilities in manufacturing technology to maintain competitive excellence across global markets. As part of this dynamic team, you will support critical equipment and collaborate on continuous improvement initiatives that align with Intel's broader mission of innovation and growth. Key Responsibilities Perform electrical and mechanical troubleshooting to diagnose issues with manufacturing equipment. Execute setup, calibration, corrective and preventative maintenance on production equipment, including wet chemistry, plating, and dry high-vacuum toolsets. Monitor tool performance and analyze data to identify and address equipment-related issues. Collaborate with engineering and support teams to improve equipment reliability and reduce downtime. Document maintenance activities, repair findings, and parts usage using established systems and procedures. Lead or contribute to continuous improvement projects, focusing on equipment optimization and yie

Job Details: Job Description: As one of the world's largest semiconductor manufacturers, Intel is committed to advancing every aspect of semiconductor technology, from process development and manufacturing to advanced packaging and reliability characterization. Employees within Intel Foundry are part of a global network spanning technology development, manufacturing, assembly, test, and quality organizations across both front-end silicon and advanced packaging facilities. You will join the Foundry Lab Network (FLN), a key organization within Foundry Quality, Reliability, and Labs (FQRL), located at Intel's growing Chandler, Arizona site. This site serves as the technology development hub for Intel's most advanced packaging technologies, including Hybrid Bond Interconnect (HBI), Embedded Multi-die Interconnect Bridge (EMIB-T), glass substrates, Foveros, and future advanced packaging innovations. FLN is actively expanding its laboratory capabilities and capacity to support Intel Foundry's roadmap, enabling faster technology qualification and accelerating development cycles through Quick Turn Monitoring (QTM) solutions that significantly reduce time-to-data. As the Stress Test and Reliability (STaR) Back-End Laboratory Manager, you will play a critical leadership role within FLN. You will partner closely with Packaging Technology Development, Quality and Reliability, and Failure Analysis teams to establish and enhance laboratory capabilities that support qualification and certification of next-generation packaging technologies and products. This position offers a unique combination of people leadership, technical problem solving, and organizational strategy. You will lead a team of 7-10 talented engineers, spearhead cross-functional efforts to resolve complex reliability and technology challenges, drive strong quality and operati

Logistics Analyst Description - Location: Fulltime onsite Litchfield Park/Phoenix Arizona Role Summary The Logistics Analyst is the on-site expert who orchestrates all shipping activities- picking, packing, staging, loading, and system transactions within HP’s distribution operations. Blending shop-floor coordination with advanced analytics, the role ensures that every order departs safely, on time, and in full. Working side-by-side with 3PL partners, Transportation, Customer Support, and IT teams, this individual contributor drives day-to-day execution while uncovering process improvements that elevate customer experience, cost efficiency, and compliance. This position will work onsite at our central DC in Litchfield Park/Phoenix Arizona. Key Responsibilities Oversee daily inbound or outbound operations, ensuring accurate and timely order fulfillment, packing, and shipping in line with HP’s quality and service standards. Lead and support process improvement initiatives focused on optimizing outbound flow, reducing order cycle times, minimizing shipping errors, and enhancing on-time delivery performance. Collaborate with Supply Chain, Customer Service, Warehouse, IT, and Transportation teams to coordinate outbound shipments, resolve exceptions, and ensure alignment with customer requirements. Track real-time metrics such as pick accuracy, order fill rate, on-time ship, trailer utilization, and dock-to-door cycle time; initiate immediate countermeasures when performance drifts. Serve as the primary point of contact for order expedites, configuration changes, embargo checks, and any customer-facing shipment issues. Develop and maintain SOPs for outbound operations, ensuring compliance with company policies and regulatory requirements.

Job Details: Job Description: As a Facilities Mechanical Engineer, you will play a pivotal role in ensuring the reliable operation and maintenance of Intel's advanced mechanical systems, supporting our cutting-edge manufacturing, cleanroom, and research and development activities. Your work will directly impact Intel's ability to innovate and deliver world-class technologies by maintaining the critical infrastructure that enables peak operational performance. This role offers a unique opportunity to drive engineering excellence, collaborate with cross-functional stakeholders, and shape the future of Intel's facilities globally. Key Responsibilities: Ensure the availability, reliability, and maintenance of mechanical systems such as oil-free air systems, HVAC systems, chilled water plants, boilers, environmental abatement systems, and compliance exhaust systems. Support daily tactical efforts to meet safety, reliability, and environmental targets for mechanical systems. Design and analyze mechanical systems and equipment, troubleshoot systematic issues, and provide evaluations, recommendations, and solutions to resolve problems. Develop engineering scopes of work for mechanical projects and conduct design reviews to ensure system integrity and performance. Conduct feasibility studies and testing on new and modified designs, while overseeing prototype fabrication and design testing. Partner with internal business units and operations teams to deliver engineering solutions tailored to their specific needs.

Job Details: Job Description: Intel Foundry is building the future of semiconductor manufacturing. As Intel continues to accelerate its foundry strategy, we are seeking an exceptional Factory Manager to help lead one of the world's most sophisticated semiconductor manufacturing operations. This executive leadership role will oversee a large-scale manufacturing organization responsible for delivering world-class safety, quality, yield, velocity, cost, and customer commitments while helping shape the future of advanced semiconductor manufacturing. This is a rare opportunity to lead at the intersection of manufacturing excellence, technology innovation, and business performance. Why This Role Matters Intel already possesses deep manufacturing expertise. What makes this opportunity unique is the need for a leader who can combine operational excellence with a proven ability to drive manufacturing performance through yield improvement, technology ramp execution, and large-scale organizational leadership. We are looking for an executive who understands the physics behind semiconductor manufacturing, can lead thousands of employees through complexity and change, and has successfully transitioned advanced technologies from development into high-volume production. Candidates who can demonstrate ownership of both factory operations and yield performance will be especially compelling. What You'll Do Lead a large-scale semiconductor manufacturing organization supporting advanced process technologies. Drive safety, quality, die yield, line yield, productivity, velocity, cost, and customer commitments. Lead technology transfer, qualification, and manufacturing ramp activities from development through high-volume production. Partner closely with technology development,