Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Design and CAD Enablement Own the development, deployment, and support of scalable CAD tools, automation frameworks, design flows, and methodologies for NAND, DRAM, HBM, SoC, mixed-signal, and other advanced semiconductor products. Develop, improve, and maintain infrastructure for circuit build capture, layout, simulation, characterization, implementation, physical verification, and signoff workflows. Create robust software and scripts using Python, Tcl, SKILL, Shell, Perl, C/C++, Java, Lisp, or related languages to automate engineering workflows, analytics, and quality checks. Evaluate and integrate advanced EDA technologies, AI-assisted engineering solutions, and emerging methodologies to improve productivity, scalability, and silicon quality. Validated ability to demonstrate AI‑assisted (vibe) coding techniques to improve efficiency or automate design and analysis methodologies Leverage AI tools to automate the tools and workflow Applying Artificial Intelligence in workflows to improve build efficiency undefined undefined Lead implementation and signoff activities across physical design, static timing analysis, and design for test for complex digital, memory, SoC, or mixed-signal products. Drive floor planning, power planning, placement, clock tree synthesis, routing, optimization, timing closure, and physical verification to meet power, performance, area, reliability, and sche
ASIC Design Engineer
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Role overview
Job description
What We’re Looking For: We’re looking for ASIC design engineers to contribute to and own blocks in the development of the A-0 and A-1 wafer products, across both the XPU, memory chiplet and other dies on the wafer. Ideal Background: An ideal candidate will have: Hands-on experience with multiple advanced node tapeouts Ownership of ASIC design portion of at least one block in multiple advanced node tapeouts Understanding of PPA improvement and what levers exist for each level of the stack Ability to think creatively about methodology for fast design iterations Nice to Have: Hands-on experience with ASIC design process for large die (ideally reticle max) chips Hands-on experience with ASIC design process for AI chips Hands-on experience with multi-die/multi-chiplet/MCM designs
What they are looking for
Skills & requirements
Department · Asic
Hiring company
Volantis Semiconductor, Inc.
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$190K – $225K/yr
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