CMP Process Development R&D Engineer

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. This job requisition is for a Photolithography Process Development Engineer at Micron Technology, Inc. Micron Technology Inc. is a Fortune 500 company and employs over 53,000 workers worldwide, with headquarters in Boise, ID. Micron offers the industry’s broadest portfolio of memory solutions—starting with foundational DRAM, NAND, and NOR Flash memory, extending to SSDs, MCPs, HBM and other memory-based systems. As the only memory fab in the western hemisphere, Micron has been in the industry for over forty -five years and continues to be the only U.S.-based DRAM manufacturer. Micron is one of the most prolific patent applicants in the world with over 60,000 patents granted and growing. As a Photo Process Development Engineer, you will be part of a revolutionary 3D DRAM Technology Development team. The position promises ample opportunity for innovation, collaboration and testing new dimensions in Advanced DRAM. You will work directly with Process Integration and other process areas including Dry Etch, Wet Process, Metals, CVD, Diffusion, and CMP. You will work on state of the art and best in class </sp

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Install, start-up, and continually improve cutting edge semiconductor processing equipment and hardware both internally with process engineering and externally with vendors to enable leadership in next-gen memory. Apply project management skills to projects and demonstrate the ability to exchange complex information with customers Set Module Level. Identify alternate CMP/Bond hardware technologies Recognizing opportunities and provide feedback to R&D personnel for technical innovation. Mentor new engineers and other upcoming engineers. Drive module level development and lead large projects of a technical nature. Standardize methods and procedures across area, department and/or FABs. Research, gather and analyze information related to specific assignments within your technical discipline. Recommend process or equipment changes to improve FAB metrics Interpret results and conduct quantitative analyses. Interpret results of new or modified equipment or processes. Design, develop, and implement technical products, systems, or processes to improve product quality and/or Fab performance Evaluating issues and define solutions to develop and implement improvements in equipment or processes to improve scrap, cost, rework, cycle time, throughput or yield. Resolve integration issues through process development. Identify and evaluate interactions between equipment, modules and processes and resolve related issues. Employer will accept a Bachelor’s degree in Engineering Technology, Electrical Engineering, Materials Engineering or related field and 2 years o

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Manager of the CMP area for the Advanced Technology Engineering team at Micron Technology, Inc., you will build and develop an elite team. Your team will drive new product introduction and ramp at our newest memory fab. This brand-new site in Boise, ID will combine technology development and manufacturing to transfer groundbreaking products from R/D into manufacturing. Your team will engage on Micron’s groundbreaking products from early in the development stage and support them all the way through customer qualification. Your objective is to use global internal and external resources to enable equipment and yield performance to plan. Responsibilities: Ensure all required safety training is completed and work is conducted in accordance with Micron safety policies while promoting a positive work environment. Hire, develop, mentor, and manage a team of highly capable process engineers. Support the qualification of a new innovative processing facility. Provide regular feedback to your team members on performance and career development. Engage with suppliers to develop the process and equipment needed to meet Micron’s technology roadmap. Collaborate with the Technology Development team to ensure successful transfer and ramp of product yield and quality. Engage with other Manufacturing teams and lead w

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) team at Micron leads the creation of powerful memory and storage solutions that power the AI era. We work hands-on with global R&D groups, suppliers, and manufacturing teams to turn breakthrough ideas into real, production-ready technologies. We thrive on innovation and collaboration! Position Overview: This role will be part of a highly collaborative and innovative Advanced Packaging Wafer Edge Trim, Backgrind & Thinning R&D team, responsible for developing and scaling critical mechanical wafer processing modules. This role offers broad opportunities for technical innovation, early stage pathfinding, and ownership of process solutions that enable next generation advanced packaging technologies. You will work closely with process integration and adjacent process areas including Bonding/De-bonding, CMP, Wet Etch, Lithography, Assembly, and Test, while driving process readiness to meet bold program, performance, and yield targets. Responsibilities: Develop and optimize wafer edge trim, backgrind, and thinning processes to meet the mechanical, electrical, and reliability requirements of Micron’s advanced memory products. Improve process capability, yield, cost efficiency, and wafer integrity through data‑driven optimization and equipment or consumable innovation. Conduct root‑cause and failure‑mode analyses to understand wafer damage mechanisms such as edge chipping, micro‑cracks, subsurface damage,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) team at Micron leads the creation of powerful memory and storage solutions that power the AI era. We work hands-on with global R&D groups, suppliers, and manufacturing teams to turn breakthrough ideas into real, production-ready technologies. We thrive on innovation and collaboration! Position Overview: This role will be part of a highly collaborative and innovative Advanced Packaging Wafer Edge Trim, Backgrind & Thinning R&D team, responsible for developing and scaling critical mechanical wafer processing modules. This role offers broad opportunities for technical innovation, early stage pathfinding, and ownership of process solutions that enable next generation advanced packaging technologies. You will work closely with process integration and adjacent process areas including Bonding/De-bonding, CMP, Wet Etch, Lithography, Assembly, and Test, while driving process readiness to meet bold program, performance, and yield targets. Responsibilities: Develop and optimize wafer edge trim, backgrind, and thinning processes to meet the mechanical, electrical, and reliability requirements of Micron’s advanced memory products. Improve process capability, yield, cost efficiency, and wafer integrity through data‑driven optimization and equipment or consumable innovation. Conduct root‑cause and failure‑mode analyses to understand wafer damage mechanisms such as edge chipping,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) team at Micron drives the technologies that enable the AI era. We work hands‑on with global R&D, suppliers, and manufacturing teams to turn breakthrough ideas into production‑ready solutions. Our work sits at the intersection of innovation, scale, and real‑world impact—and collaboration is how we win. Position Overview: Artificial intelligence is transforming the world, and High Bandwidth Memory (HBM) is at the center of that transformation. As a Senior or Staff Engineer on the Dry Etch R&D team, you will play a key role in developing and scaling plasma‑based etch processes that enable next‑generation packaging technologies. This role offers deep technical ownership, broad cross‑functional collaboration, and the opportunity to influence long‑term technology roadmaps from early research through high‑volume manufacturing. Responsibilities: Develop and optimize dry etch process modules to meet performance, yield, and reliability requirements for advanced packaging products Drive process capability, cost, and variability improvements using data‑driven experimentation and equipment innovation Collaborate closely with process integration and adjacent process teams including Wet Etch, Films, Lithography, CMP, Wafer Trim, and Bonding Perform root‑cause and failure‑mode analysis a