EnCharge AI is a leader in advanced AI hardware and software systems for edge-to-cloud computing. EnCharge’s robust and scalable next-generation in-memory computing technology provides orders-of-magnitude higher compute efficiency and density compared to today’s best-in-class solutions. The high-performance architecture is coupled with seamless software integration and will enable the immense potential of AI to be accessible in power, energy, and space constrained applications. EnCharge AI launched in 2022 and is led by veteran technologists with backgrounds in semiconductor design and AI systems. Lead DFT Engineer Job Description: Developing silicon for edge-to-cloud computing isn't just about speed; it’s about balancing high-performance data processing with extreme power efficiency and reliability in remote environments. As the Design for Test (DFT) Lead, you will be the architect of our testing strategy, ensuring our data center chips are flawlessly manufacturable and resilient enough for edge deployment. Key Responsibilities: Architectural Leadership: Define and implement the end-to-end DFT architecture for complex SoCs, including Hierarchical DFT, Scan compression, Boundary Scan and MBIST. Edge-Specific Reliability: Develop strategies for In-System Test (IST) and power-on self-test (POST) to ensure chip health in remote edge data centers. Implementation & Flow: Oversee scan insertion, ATPG (Stuck-at, Transition, Path Delay), and Memory /Logic BIST. Cross-Functional Synergy: Collaborate with Design, Physical Design, and Yield teams to ensure high test coverage while minimizing area overhead and power impact as well as timing analysis . Post-Silicon Validation: Lead the bring-up and debug phase on ATE (Automated Test Equipment) to root-cause silicon failures and optimize test time. Technical Requirements: Experience: 12+ years in DFT, with at least 2 years in a leadership or principal role. Bachelor’s degree in a related field. Tools:
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Role overview
Job description
What We’re Looking For: We’re looking for DFT engineers to contribute to and own DFT efforts for blocks and entire dies on the A-0 and A-1 wafer-scale systems. Ideal Background: Experience leading DFT efforts for multiple advanced node SoC tapeouts Nice to Have: Experience leading DFT efforts for large die area (eg reticle-max) chips Experience leading DFT efforts for multi-die/multi-chiplet/MCM designs Experience leading DFT efforts for AI accelerator SoCs
What they are looking for
Skills & requirements
Department · Asic
Hiring company
Volantis Semiconductor, Inc.
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