DMTS, Systems Architect

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Product Manager at Micron Technology, Inc. in the Cloud Memory Business Unit (CMBU), you will be charged with driving execution of the products in high bandwidth memory (HBM) portfolio that will position Micron for success in growing the Artificial Intelligence (AI), Machine Learning (ML) and High-Performance Computing (HPC) business segments. You will be working on leading-edge technologies to enable next generation high bandwidth memory (HBM) products and drive customer focused innovation. You will lead a cross-functional team of key representatives from multiple engineering, marketing, and operations teams to ensure the execution of product is aligned to spec within a specific timeline and budget. You will assist the Product Management team in defining the strategy and vision of the product portfolio and drive the execution focused Stage Gates when necessary. Ideal candidates are ambitious leaders with a strong Business plus Engineering background and analytical skills who “own” all aspects of the execution and possess good communication skills to drive the cross functional team towards the business goals. Products managers in this role will be self-starters with a can-do attitude who can apply their critical thinking ability to drive the best possible outcome. Responsibilities: Develop and drive product strategy, roadmap planning, and requirements definition for next-generation HBM solutions targeting AI, HPC, and cloud infrastructure markets Partner with customers, hyperscal

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We define ESD and latch-up architecture for next-generation HBM products across advanced nodes and 3D integration. Our team works across device, circuit, and packaging domains to solve reliability challenges that directly impact product quality. We take on complex problems and turn them into scalable solutions that enable high-performance memory! As an SMTS/DMTS HBM ESD/Latch-Up Architect, you will define protection strategies across base die, DRAM stacks, and interconnects. This role shapes product reliability from early architecture through silicon validation. You will work across teams and influence technical direction while solving system-level ESD challenges. This role supports the design and deployment of AI-enabled solutions that improve efficiency and decision-making. Responsibilities: Define end-to-end ESD and latch-up architecture across base die, DRAM die, and interconnects Develop protection strategies for high-speed I/O, TSV interfaces, and advanced packaging Establish ESD/LUP standards, rule decks, and signoff criteria Drive correlation between d

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) team at Micron is shaping the future of memory and storage technologies that fuel the AI era. We collaborate with global R&D groups, suppliers, and manufacturing teams to turn bold ideas into production-ready solutions. We innovate fast, learn continuously, and work as one team! This position is intended to be part of Micron's Technical Leadership Program (TLP). This is a career path for individuals seeking to advance as technical leaders and industry innovators. TLP members are expected to influence, lead, and mentor others. Position Overview: We are seeking an experienced organizational leader who will l ead and influence methodology improvements, including best practices in process development, data-driven decision-making, and application of AI/advanced analytics to drive innovation. In this role, you will drive strategic process development for Micron’s most advanced memory products, including HBM, 3DS DRAM, and emerging 3D architectures. You will guide end‑to‑end technology execution, partner across organizations, and influence both internal roadmaps and the external ecosystem. This is a high-impact role for someone who thrives at the intersection of innovation, complexity, and collaboration. Responsibilities: Own advanced packaging process technologies across wafer‑level and die‑level modules from pathfinding through manufacturing readiness Develop

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: We are advancing the future of semiconductor packaging through innovative 2.5D, 3D, and heterogeneous integration technologies. Our team develops the processes that enable next-generation AI and high-performance computing products, working across materials, device, design, manufacturing, and test engineering to solve complex technical challenges. If you're excited by emerging packaging architectures and breakthrough integration approaches, you'll find meaningful opportunities to make an impact here. Position Overview: As a Process Integration Lead for Advanced Packaging, you will lead a team focused on developing and integrating advanced packaging technologies from concept through full-scale manufacturing. This role plays a critical part in enabling high-performance multi-die solutions by driving technology development, process integration, technology transfer, and collaborative execution. You will help shape the roadmap for next-generation packaging platforms while mentoring a highly skilled technical team. Responsibilities: Manage and grow a team responsible for seamless process integration across 2.5D and 3D packaging platforms, including advanced interconnect architectures, die-stacking solutions, and HBM implementation. Spearhead the development, optimization, and qualification of emerging packaging technologies through experimental design (DOE), process analysis, performance validation, and establishment of design rules. Improve

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are the CMOS Device Integration Team at Micron, where we push the limits of memory technology every day. We work at the intersection of device physics, process integration, and product performance to enable the next wave of DRAM, HBM, and Compute-in-Memory innovation. If you’re excited by challenging technical problems and real-world impact, you’ll feel right at home here! In this role, you’ll serve as a technical leader shaping the future of Micron’s most advanced memory products. As a Distinguished Member of Technical Staff, you’ll drive CMOS device and module development that directly impacts array efficiency, data rates, and product scalability. Your expertise and influence will help guide technology decisions that power AI, high-performance computing, and emerging applications. Responsibilities: Develop and integrate advanced CMOS devices for next-generation DRAM, HBM, and emerging memory architectures Perform detailed electrical characterization of CMOS devices and circuits to drive performance improvements Partner with Design, TCAD, Modeling, Process, Reliability, and Layout teams to deliver integrated technology solutions Provide technical leadership, strategic recommendations, and clear presentations to guide technology direction Minimum Qualifications: Master’s degree or PhD in Electrical Engineering or equivalent practical experience 10 or more years of hands-on experience in advanced CMOS device design and/or integration 1

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is a global DRAM leader whose innovative builds push the boundaries of future semiconductors. We seek a dynamic BEOL Process Integration Expert with proven experience in developing, transferring, and optimizing advanced DRAM technologies. Our team enjoys solving complex integration challenges and improving yield, reliability, and manufacturability. Known for technical leadership, strategic vision, and passion for semiconductor advancement, this role suits ambitious and determined candidates eager to make a big impact. Responsibilities In this role, you will need to have strong semiconductor Process Integration skills in an R&D department. You will be developing the future generation DRAM technologies. This position is intended to be part of Micron's Technical Leadership Program (TLP). This is a career path for individuals seeking to advance as technical leaders and industry innovators. TLP members are expected to influence, lead, and mentor others. Define and implement BEOL process flows, build rules, and specifications for advanced DRAM products. Lead troubleshooting and resolution of complex integration issues spanning multiple modules and fields. Drive yield improvement and reliability enhancement initiatives using data-driven methodologies. Coordinate technology transfers, ensuring robust process qualification and rapid ramp to high-volume manufacturing. Engage in industry benchmarking and collaborative projects to maintain te