Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Overview|職缺概述 Micron Taiwan is building a long‑term HBM talent pool to support the expansion of advanced memory manufacturing in Taichung. This evergreen posting is intended to attract talents across Engineering, Manufacturing, Quality, Automation, Facilities, and Operations Leadership functions. Micron 台灣持續擴展 HBM(High Bandwidth Memory)製造與營運團隊 ,此 evergreen 職缺用於建立長期人才庫,將依業務需求媒合合適職務。 Potential Roles|涵蓋職務方向(不限於) Manufacturing / Process 製造/製程工程師 Automation & Manufacturing Systems Engineer 自動化與製造系統工程師 Industrial Engineer 工業工程師 Product Quality Assurance / Quality Engineering (PQA / PQE) 產品品質保證/品質工程 HBM Manufacturing / Test Production Supervisor HBM 製造/測試產線主任 Assembly Equipment Engineer / Process Engineer 設備/製程工程師 Facilities Engineer 廠務工程師(水處理/HVAC/氣體系統/擴建工程專案/二次配) What You Will Do|工作內容摘要 Depending on role alignment, responsibilities may include: Support and improve HBM manufacturing, assembly, test, automation, or facility systems 支援並優化 HBM 製造、封裝、測試、自動化或廠務系統 Drive process optimization and yield improvement, enhance product quality, and support new product introduction and production ramp 負責分析與優化
Salary not disclosed
Check market pay for comparable ENGINEER roles before applying.
Role overview
Job description
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Job Summary
We are seeking a highly motivated Failure Analysis Engineer to join our Product Failure Analysis (PFA) Laboratory. The successful candidate will be responsible for conducting failure analysis, root cause investigations, and advanced package characterization to support product development and yield improvement.
This role requires strong analytical skills, hands-on laboratory experience, and the ability to collaborate with cross-functional teams in a fast-paced semiconductor environment.
Qualifications
Education
Bachelor's or Master's degree in:
- Materials Science & Engineering
- Electrical Engineering
- Electronics Engineering
- Mechanical Engineering
- Chemical Engineering
- Physics, Chemistry, or related technical disciplines
Experience in one or more of the following areas is preferred:
- Wafer Fabrication
- Assembly and Packaging
- Product Engineering
- Yield Enhancement
- Failure Analysis Laboratory
- Advanced Packaging Technologies
Responsibilities
- Perform electrical and physical failure analysis of semiconductor devices and packages.
- Conduct root cause investigations and provide technical recommendations.
- Develop and execute analytical plans to support engineering requests.
- Interpret analytical results and communicate findings effectively.
- Collaborate with Process, Product, Quality, Reliability, and Manufacturing teams.
- Generate technical reports and present findings to stakeholders.
- Support urgent customer and production-related failure analysis activities.
Preferred Technical Skills
Experience in one or more of the following:
Failure Analysis Techniques
- Fault Isolation (FI)
- Voltage Contrast (VC)
- Delayer / Deprocessing
- Cross-section Analysis
- Die-level Failure Analysis
- Root Cause Analysis
Equipment Experience
- FIB (Focused Ion Beam)
- SEM / EDS
- 3D X-ray / CT
- CSAM
- Optical Microscopy
- Hot Spot Analysis
- Emission Microscopy (EMMI)
- OBIRCH
- PHEMOS
- Sample Preparation Equipment
Preferred Experience
Candidates with experience in the following areas are highly desirable:
- HBM Failure Analysis
- Advanced Packaging Technologies
- TSV Analysis
- Micro-bump Inspection
- Hybrid Bonding Characterization
- Die Crack Analysis
- Delamination Investigation
- Thermal Failure Analysis
- Material Characterization
Soft Skills
- Strong problem-solving and analytical skills
- Self-motivated and fast learner
- Ability to work independently and drive tasks to completion
- Strong communication and presentation skills
- Effective collaboration across global and cross-functional teams
- Ability to manage multiple priorities in a dynamic environment
Nice to Have
- Experience with Python, JMP, Power BI, or data analytics tools
- Knowledge of HBM, 2.5D/3D packaging, or advanced packaging technologies
- Experience supporting new technology node development and qualification
- Technical report writing and presentation experience in English
AI & Digital Skills (Preferred)
- Leverage AI-assisted tools and digital solutions to improve failure analysis efficiency, data interpretation, and technical decision-making.
- Apply data analytics, automation, and AI-enabled workflows to accelerate root cause investigation and problem-solving activities.
- Utilize AI-based tools to enhance technical reporting, knowledge management, and process optimization.
- Demonstrate a data-driven mindset with the ability to identify opportunities for workflow automation and productivity improvement.
- Experience with Python, JMP, Power BI, SQL, machine learning, or AI-assisted engineering tools is a plus.
About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.
To learn more, please visit micron.com/careers
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
To request assistance with the application process and/or for reasonable accommodations, please contact at hrsupport_taiwan@micron.com.
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.
Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.
What they are looking for
Skills & requirements
Qualification
Bachelor's or Master's degree in

Hiring company
Micron
Micron is a global leader in memory and storage, powering AI and compute-intensive applications from cloud to edge with innovative semiconductor solutions.
Related opportunities
Similar active roles
Relevant, currently active roles for this market.
🔔 Get job alerts
New ENGINEER, MTB PQA LAB jobs in Taichung - Mtb, Mtb, Taiwan, straight to your inbox.
No spam · Unsubscribe anytime