MFG Test Development Software Engineer

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Oversees the planning, development, implementation and maintenance of manufacturing methods, processes and operations for new and existing products. Ensures the effective use of materials, equipment, and personnel in producing quality products at minimum costs. Acts as liaison with engineering in releasing new products. Develops systems to maintain reports and record keeping of company products. Selects, develops, and evaluates personnel to ensure the efficient operation of the function. Additional Job Description As Manufacture leader at Micron Technology, Inc., you will be held fully accountable to successfully execute achieve business objective from entire MFG department without any excuses . You will be expected to be very hands-on with great tenacity, sense of strong execution ownership , understand data, has strong disciplinary to use data driven solution with strong capability to drive forward-looking MFG readiness to mitigate fire fighting. You will ensure completeness, accuracy, and compliance with internal policies and procedures. You will also collaborate to develop, execute strategic plans and make business decisions. Your role will require you to develop and manage organizational capability, manage and plan organizational resources, communicate job expectations and changes, manage employee performance, and promote collaboration

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Smart Manufacturing Product Owner at Micron Technology, Inc., you will be responsible to enable innovation and new frontier technology for Smart manufacturing to define, drive and deliver end to end smart manufacturing solution, coordinated across functions of the business. The team will look into applying industry-leading the best methodologies in automation, AI and machine learning to improve Micron’s product development, business and administrative processes across the company. You are joining a team where 'we' matter and hold high standards to achieve perfection. Key Responsibilities Lead the development and implementation of AI-driven Smart Manufacturing solutions to improve product yield, quality, test coverage, and system-level performance across Micron's semiconductor operations. Partner with Test Solutions Engineering, Product Engineering, Global Quality, and multi-functional collaborators to find opportunities and drive digital transformation initiatives. Collaborate with Data Scientists, Machine Learning Engineers, Solution Architects, and Data Engineers to define requirements, prioritize solutions, and deliver end-to-end projects. Translate business needs into detailed business requirements, user stories, acceptance criteria, and data requirements while ensuring alignment with enterprise standards and governance. Develop arguments for proposed solutions, including value quantification, analysis of return on investment and net present value, success metrics, and impl

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a DRAM and Emerging Memory Quality and Reliability Assurance (DEMQRA) High Bandwidth Memory (HBM) Engineer at Micron Technology, Inc., your primary responsibility will be establishing quality criteria and monitoring quality indices based on FE and BE signals from NPI to high-volume manufacturing (HVM). You will define, lead and drive key action to bring Micron product quality to be the best in class and to prevent quality and reliability related issues from repeat occurrence. Meanwhile, you will involve in developing and supporting qualification stress flows and characterization for HBM and other high performance memory solutions. You will be driving the following: Collaborate with collaborators to define, deploy and monitor outgoing quality and reliability (OQR) metrics based on FE and BE production signals as well as reliability test results Partner with package development engineer and product engineer on latest products and technologies to define quality and reliability fail modes Proactively work to evaluate, characterize, and mitigate Quality and Reliability risks and fail modes for BE new products and HVM Collaborate with MFG Quality Assurance and Quality Engineer teams to improve QR fail mode list for HVM products. Engage with key teams to set and validate OQR specifications and address recognized and potential Quality and Reliability issues Dispo deviation material based on production signals and reliability test results with quick turnaround ti

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As the member of HIG HBM Package Product Engineering, you will lead and develop a high-performing team to driving Package and HBM Product engineering activities within the HBM Systems and Product Engineering Team. You will be part of a Global team of professional Product Engineers leading a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. Key Responsibilities ASM Yield and DPM Improvement: Accountable for improving assembly related coverage within the manufacturing flows to improve the Time 0 and Field DPM and reduce/prevent inline fallout within the assembly process. HBM Cube Yield Improvement: Improving HBM Cube yield through test optimization and cov

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As the member of HIG HBM Package Product Engineering, you will be part of a high-performing team to driving Package and HBM Product engineering activities within the HBM Systems and Product Engineering Team. You will be part of a Global team of professional Product Engineers leading a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. Key Responsibilities ASM Yield and DPM Improvement: Accountable for improving assembly related coverage within the manufacturing flows to improve the Time 0 and Field DPM and reduce/prevent inline fallout within the assembly process. HBM Cube Yield Improvement: Improving HBM Cube yield through test optimization

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As the member of HIG HBM Package Product Engineering, you will be part of a high-performing team to driving Package and HBM Product engineering activities within the HBM Systems and Product Engineering Team. You will be part of a Global team of professional Product Engineers leading a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. Key Responsibilities ASM Yield and DPM Improvement: Accountable for improving assembly related coverage within the manufacturing flows to improve the Time 0 and Field DPM and reduce/prevent inline fallout within the assembly process. HBM Cube Yield Improvement: Improving HBM Cube yield through test optimizati