Packaging Value Engineer

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. About the Role Micron's Market Intelligence team shapes how the company sees the memory market: where demand is heading, what is driving it, and how our competitors are positioning. We are looking for an analyst based in Taiwan who can act as our eyes and ears in the heart of the semiconductor supply chain. This role suits someone early in their career, likely coming from sell-side or buy-side equity research covering foundry, memory, or memory suppliers, who already has a strong network across the industry and a good instinct for where the market is moving. You will turn what you hear and observe into differentiated, ahead-of-consensus insight for our team. You will also take on core operating responsibilities: TAM reporting to cross functional teams, data center TAM alignment with cross functional teams, and supporting our internal planning system and data management work. What You Will Do Market and ecosystem intelligence Build and maintain a network across foundries, OSATs, hyperscaler supply chains, ODMs/OEMs, substrate and equipment suppliers, and the investment community in Taiwan and Korea. Spot early signals on industry direction, such as capacity moves, product transitions, build plans, and inventory and pricing behavior, so the team sees shifts before they show up in consensus or published reports. Track the ecosystem drivers of memory demand, including AI accelerator and GPU ramps, CoWoS and advanced packaging capacity, server builds (AI

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is looking for a hands-on Manufacturing Engineer to own the manufacturing interface between package design, semiconductor assembly, package test, board assembly, and final product integration. This role is focused on making advanced packages manufacturable and transferable from design engineering into qualified OSAT processes and downstream board/system assembly. You will work closely with Packaging Engineering, Silicon Manufacturing and Test, Quality, Supply Chain, PCB/board design, and external partners such as substrate suppliers, OSATs, test houses, and contract manufacturers. The ideal candidate understands how package decisions—such as package size, substrate construction, bump and ball design, warpage, underfill, materials, and assembly location—affect package yield, package test, PCB footprint and stencil design, SMT assembly, and final product readiness. This role is remote based out of Taiwan but requires close engagement with regional OSATs, foundry/test partners, contract manufacturers, and Tenstorrent engineering teams across multiple time zones. Regular on-site presence at partner factories is expected during qualification, commissioning, build, and ramp activities. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and of

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an Engineer in Packaging Technology Management at Micron, you will have an outstanding chance to influence and lead the development of world-class packaging technologies. You will work in a collaborative and innovative environment. This role allows you to operate at the forefront of technology in Taiwan, contributing to Micron's strategic goals and helping build the future of the semiconductor industry. AI Proficiency and AI-Enabled Ways of Working Micron is committed to building an AI-enabled workforce. Successful candidates are encouraged to bring to bear approved AI technologies and analytics to improve engineering efficiency, accelerate innovation, improve technical decision making, and streamline collaboration. This includes applying AI-assisted tools for data analysis, technical research, knowledge discovery, workflow automation, competitive intelligence, and technical communication while adhering to Micron policies for responsible AI use, information security, and data governance. Responsibilities and Duties include, but not limited to: Deliver high-value, differentiated technology solutions by finding opportunities and driving technical innovation to provide business value. Collaborate continuously with internal and external partners to ensure flawless technology integration. Consult and influence technical and strategic decisions at senior management levels. Lead multi-disciplinary technical teams and task forc

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department overview The Advanced Packaging Technology Development (APTD) team at Micron leads the creation of cutting‑edge memory and storage solutions that power the AI era. We work hands-on with global R&D groups, suppliers, and manufacturing teams to turn breakthrough ideas into real, production-ready technologies. We thrive on innovation and collaboration! Job summary As a Principal Engineer within APTD, you will play a key role in driving innovation through strategic, industry‑informed leadership. Based at the Boise campus, you will shape advanced packaging technology roadmaps and investment priorities by applying deep technical expertise alongside rigorous cost and value analysis, enabling well‑balanced trade‑off decisions across performance, scalability, and total cost of ownership. Working in a highly collaborative, dynamic environment, you will influence solutions aligned with Micron’s business objectives, contributing directly to increased revenue, long‑term strategic success, and the development of leading‑edge packaging technologies. Responsibilities Deliver high-value, differentiated technology solutions by finding opportunities and driving technical innovation to provide business value. Collaborate continuously with internal and external partners to ensure seamless technology integ

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Micron’s vision is to transform how the world uses information to enrich life for all . Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in supercomputing and artificial intelligence possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing. We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing. Job Summary The Package Health Test Engineer will contribute to the development and execution of package health monitoring, simulation, and characterization activities. This role involves hands-on en

The Language Tools team enables ~1,500 Datadog developers to build, test, and package millions of lines of Go, Python, Java, Rust, and TypeScript in our backend monorepo. Our success is measured by their productivity and satisfaction. They use the tools that we develop and support several times a day, in both development and CI environments. We use the Bazel open source build system as a foundation. The team is growing rapidly, both with Datadog and as we absorb other repositories into the monorepo. As a senior software engineer on the team, you will own projects from start to finish, both greenfield and brownfield. You will gain first-hand understanding of what Datadog developers need, and inform our roadmap. At Datadog, we place value in our office culture - the relationships that it builds, the creativity it brings to the table, and the collaboration of being together. We operate as a hybrid workplace to ensure our employees can create a work-life harmony that best fits them. What You’ll Do: Invent build, test and packaging tools that are simpler and more reliable to use. Push performance and cost efficiency at scale, raising cache hit rates and cutting CI times and compute spend across millions of targets. Treat CI like SREs treat prod, making sure our pipelines are green and fast. Prepare, run, and finish complex migrations. Contribute back to the Bazel ecosystem, upstreaming fixes and shaping features we depend on. Who You Are: An expert in Bazel and/or one of the languages listed above. A well-rounded engineer. You must broadly understand the various types of software projects that are built, tested, and packaged with our tools. Both careful and fearless. The changes we make impact the velocity of hundreds of engineers. They are risky but necessary. User-focused. We help Datadog engineers to use the tools that we develop, and continuously improve their usability, so they don’t need our help the next time. Ideally, you have ex