Principal Engineer, ESSD Firmware Developer

For more than 30 years, SonicWall has delivered a partner-first unified cybersecurity portfolio that helps SMBs, MSPs, and IT teams consolidate network security, endpoint security, security service edge (SSE), and threat response across hybrid environments. By bringing connected technology, real-time threat intelligence, automation, and expert services together, SonicWall helps organizations simplify security operations, achieve better security outcomes, and lower total cost of ownership. Backed by a global ecosystem of more than 17,000 partners, SonicWall delivers enterprise-grade protection built for SMB and mid-market realities. For more information, visit www.sonicwall.com or follow us on X, LinkedIn , Facebook , and Instagram . We are seeking an experienced Principal Software Engineer to lead the architecture, development, and evolution of a large-scale malware analysis and cybersecurity platform. This role will own the end-to-end technical architecture across Python-based analysis pipelines, message-driven job orchestration systems, Windows VM sandbox environments, and web-based interfaces. The ideal candidate brings deep expertise in software engineering, malware analysis, and distributed systems, with a proven ability to take ownership of complex legacy platforms and drive modernization initiatives. You will lead the design and implementation of advanced detection capabilities, including behavioral analysis, malware sandboxing, machine learning-based classification, and support for new file types, while ensuring platform scalability, reliability, and performance. This position requires strong hands-on development skills in Python with Linux-based production environments, messaging architectures such as RabbitMQ, virtualization technologies, and cloud-native deployment practices. As the technical leader for the platform, you will establish engineering standards, guide architectural decisions, reduce technical debt, mentor senior engi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Role and Responsibilities Lead end-to-end layout execution of analog, mixed-signal, custom digital blocks and full-chip integration for HBM products. Own full-chip technical decisions covering analog, digital, memory, ESD, EM/IR and ensure optimal performance, power, and area (PPA). Technical Expertise : Hands-on experience in layout design of critical Memory /Analog and mixed-signal blocks such as: Array Layout, Decoder, Control logic , IOs , PLLs , ADCs, DACs, LDOs, Bandgaps, Reference Generators, Charge Pumps, Current Mirrors, Comparators, and Differential Amplifiers. Drive project planning and execution , including area/time estimation, scheduling, task delegation, and milestone tracking across multiple concurrent programs. Ensure timely delivery with quality , responsible for block-level and full-chip layouts meeting schedule commitments and quality expectations. Perform and oversee layout verification activities including LVS, DRC, Antenna checks, and ensure closure with proper documentation and audits. Lead and mentor the layout team , guiding junior engineers on sub-block execution, conducting design reviews, and enabling capability development. Drive innovation and productivity improvements , including adoption of AI/automation to reduce layout effort, improve turnaround time, and enhance quality. <li

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities 12&#43; years in Design Verification (experience with DDR/GDDR/DDR memory Verification is preferred) Define and drive verification architecture and methodology for next generation DDR designs. Develop verification plans, coverage strategies, and sign-off criteria. Architect and implement UVM-based testbenches and reusable verification components. Collaborate strictly with build teams to ensure verification completeness and quality. Mentor and guide verification engineers on guidelines and advanced methodologies. Evaluate and integrate AMS Co-Simulation techniques for mixed-signal IP verification. Work closely with EDA vendors to adopt the latest tools and flows. Leverage AI/ML tools to improve verification efficiency and debug turnaround time Develop or utilize AI-assisted regression analysis tools for failure classification Apply data-driven techniques to identify patterns in verification failures and silicon risks Contribute to automation initiatives such as Intelligent test generation, predictive coverage gap analysis, AI-driven waveform/debug analytics Required Skills & Qualifications Expert-level proficiency in SystemVerilog, UVM, and advanced verification methodologies. Familiarity with AMS Co-Simulation and mixed-signal verification flows (preferred). Hands-on experience with simulation, coverage analysis, and r

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Role and Responsibilities Responsible for layout design and development of critical analog, mixed-signal, custom digital block, standard cells and full chip level. Perform layout verification like LVS, DRC, Antenna, Shield, Matching, Latch up, EM IR Totem checks, quality check and documentation. Responsible for development of digital block layouts using auto placement and route tools Responsible for basic understanding of skill coding and automation Responsible for on-time delivery of block-level layouts with acceptable quality. Demonstrate leadership skill in planning, area/time estimation, scheduling, delegation and execution to meet project schedule/breakthroughs in multiple project environment. Guide team members in their execution of Sub block-level layouts & review their work Effectively communicating with Global engineering teams to assure the success of layout project. Responsible for the reducing the layout effort by using AI About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performa

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. For more than 45 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life. As a Principal Engineer, you will be an integral part of our HIG HBM Team in Hyderabad, India, responsible for designing and developing complex Application-Specific Integrated Circuits to meet our product's specifications and requirements for High Bandwidth Memories, working for intensive applications such as artificial intelligence and high performance computing solution. Your expertise will contribute to the successful realization of pioneering semiconductor products, enabling our company to maintain its competitive edge in the industry. Role and Responsibilities Must have a solid understanding of die design . This includes knowledge of various die components, their functions, and how they interact within the overall tool. Familiarity with the principles of die design is essential to create effective and efficient layouts. Industry Involvement : You actively participate in standards committees, representing Micron and staying informed about industry developments. Leading Project Layout Team : You lead the establishment and growth of a layout team to meet Micron’s global HBM layout requirements. Technical Expertise :

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Be part of a highly skilled and challenging high-speed PHY design team working on advanced technology nodes (12nm and below). Own analog sub-blocks within the PHY and drive specification, design, simulation, reliability, and mixed-mode verification. Leverage AI-enabled tools to improve productivity and decision-making. Drive layout implementation through mask designers while ensuring compliance with process rules and DFM requirements. Participate in design reviews with internal teams and customers, explaining design choices and robustness. Collaborate with cross-functional teams across multiple global locations. Create IP EDA views including Behavioral models, Verilog-A, timing views, and abstracts. Participate in silicon bring-up, characterization, and correlation of silicon results with models and simulations. Mentor and guide junior engineers. Competitive compensation and equal opportunity workplace. Required Skills Strong analog/mixed-signal CMOS circuit design experience in deep sub-micron technologies (2nm to 28nm). Experience in High-Speed Memory Interfaces (DDR3/4/5, LPDDR5/6, GDDR5/6/7) or SerDes Interfaces (PCIe, MIPI, HDMI, USB, SATA, etc.). Full ownership experience of at least one critical PHY sub-block such as: PLL DLL CDR High-speed Receiver with Equalization Transmitter Front-End High-Speed Data Path </ul