Senior Electrical Engineer

Abbott is a global healthcare leader that helps people live more fully at all stages of life. Our portfolio of life-changing technologies spans the spectrum of healthcare, with leading businesses and products in diagnostics, medical devices, nutritionals and branded generic medicines. Our 122,000 colleagues serve people in more than 160 countries. JOB DESCRIPTION: Job Title Senior Electrical Engineer, Manufacturing Working at Abbott At Abbott, you can do work that matters, grow, and learn, care for yourself and your family, be your true self, and live a full life. You’ll also have access to: Career development with an international company where you can grow the career you dream of. Employees can qualify for free medical coverage in our Health Investment Plan (HIP) PPO medical plan in the next calendar year. An excellent retirement savings plan with a high employer contribution. Tuition reimbursement, the Freedom 2 Save student debt program, and FreeU education benefit - an affordable and convenient path to getting a bachelor

About the Team OpenAI is building the infrastructure foundation for the next generation of AI. The Data Center Engineering team defines the strategy, reference architectures, technical requirements, and delivery standards for the large-scale data centers that support OpenAI research, products, and infrastructure partners. As a Data Center Infrastructure Electrical Engineer, you will help define, validate, and scale the electrical power systems that support high-density AI compute. You will translate evolving compute requirements into practical facility and rack-power architectures, evaluate new technologies and vendor solutions, and drive technical decisions across design, manufacturing validation, construction, commissioning, deployment, and operations. This role is best suited for a senior hands-on engineer with deep experience in mission-critical power systems, strong judgment under ambiguity, and the ability to connect facility infrastructure, hardware requirements, controls, telemetry, reliability, and operations. About the Role We are seeking a senior electrical infrastructure engineer to lead the development of reliable, scalable, and efficient power architectures for high-density, liquid-cooled AI data centers. The ideal candidate has strong practical experience with critical electrical systems at data centers or comparable industrial scale, including medium-voltage and low-voltage distribution, utility interfaces, backup power, UPS and battery systems, rack power delivery, grounding, protection, controls, and monitoring systems. You should be comfortable moving between long-range architecture, detailed engineering review, lab validation, vendor qualification, field deployment, and operational troubleshooting. Key Responsibilities Design and optimize electrical topologies and equipment strategies that reduce cost, accelerate schedules, improve efficiency, increase scalability, and maintain high reliability and maintainability. Review and develop basis-of-des

1671 About the Role We are seeking a Senior Signal Integrity Engineer to develop, validate, and optimize high-speed signaling solutions across blade- and rack-level architectures for advanced compute platforms. This role sits at the intersection of silicon, package, interconnect, board, and system design , with a strong emphasis on hands-on measurement, simulation correlation, and cross-functional technical communication. Key Responsibilities End-to-end signal integrity analysis for blade- and rack-level system architectures. Analyze and optimize high-speed and low-speed I/O interfaces, including PCIe Gen4/5/6, Ethernet, DDR, SerDes, SPI , I2C, etc . and related interconnects. Perform time-domain and frequency-domain simulations using tools such as Ansys HFSS, Keysight ADS, Cadence Sigrity, CST, SPICE , or similar. Support hands-on lab validation using VNA, TDR, BERT, and high-speed oscilloscopes . Correlate simulation results with lab measurements to identify margin gaps, debug issues, and improve design methodology. Collaborate with silicon, package, board, connector, cable, and system design teams to optimize I/O channel performance. Work with interconnect vendors and ODMs to guide board layout, stack-ups, routing rules, and system design decisions. Review schematics, layouts, simulation results, and validation data for blade, backplane, and rack-level hardware. Prepare and communicate clear validation reports, measurement summaries, debug findings, and technical recommendations to internal teams, vendors, and senior technical stakeholders. Required Qualifications Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field . Strong experience in signal integrity for high-speed digital systems. Hands-on measurement expertise using VNAs, TDRs, BERTs, and high-speed oscilloscopes . Experience measuring and analyzing S-parameters, impedance profiles, eye diagrams, jitter, timing margins, insertion loss, return loss, and cro

NVIDIA is now looking for a Senior Memory System Engineer to join our ASIC Memory Subsystem team! As a Senior Systems Engineer at NVIDIA, you'll join a group of hardworking engineers to develop and architect innovative Memory Solution for Tegra SoCs. In this position, you'll make a real impact in a multifaceted, technology-focused company. You will work with memory controller/PHY and Platform / System architect, Firmware, SI/PI, Memory suppliers to design and architect cutting edge, high speed and lower power memory technology for NVIDIA CPUs and SOCs. What You Will Be Doing: Analyze future DDR/LPDDR/HBM technologies to determine optimum performance, power, function and RAS in memory for Next generation SOC and Systems. Collaborate with ASIC Architects, Designers, Software and Firmware SW/FW teams to drive memory technology and associated requirements for memory controllers. Define Memory module, Package, and PCB layouts appropriate to the system workloads Debug and bring up memory evaluation / validation and failure issues on memory technology. Collaborate with DRAM suppliers and industry partners on to develop memory and memory related component technology. What We need to see: Bachelor's degree or master’s degree in Electrical Engineering, Computer Engineering (CE), or a related field (or equivalent experience) 10 years of proven track record in DRAM design, module design, or memory sub system design. Deep understanding and strong fundamental of memory design, features, ECC algorithm, SI and PI (Training algorithm) in DDR, LPDDR, and HBM. Strong understanding of memory sub system level interaction with Cache, Memory controller and PHY. Experience in the design, bring-up and validation for memory failure analysis Experience with Python, C/C

The DFP Engineer – Manufacturing role defines and implements the validation and screening of new silicon features within high‑volume manufacturing flows. You will translate product requirements into executable test methodologies, infrastructure, and detailed manufacturing test plans that ensure quality, yield, and efficiency at scale. This role sits at the intersection of multiple multi-functional teams to make manufacturing test an outstanding part of the overall codesign and DFP lifecycle. What you will be doing: Own end-to-end manufacturing test methodology across all test stages. Translate system specs and product POR into DFP requirements, test content, coverage, and flows. Define and maintain the DFP roadmap, including infrastructure and turning point planning. Partner multi-functionally to implement test content, debug hooks, and coverage improvements. Drive alignment on manufacturability, test time, binning strategies, and cost vs. coverage trade-offs. Embed testability requirements into design to enable robust screening and debug. Define data and analytics frameworks to support yield analysis and continuous improvement. Lead DFP documentation as the single source of truth and feed findings into future methodologies. What we need to see: MS in Electrical Engineering, Computer Engineering, or related field (or equivalent experience) 6&#43; years in silicon post‑silicon validation and/or high‑volume manufacturing test for complex SoCs, GPUs, CPUs, or similar. Hands‑on experience with test content bring‑up, limit setting, correlation to characterization, and yield/coverage optimization. Proficiency with scripting and data analysis (e.g., Python, MATLAB, R, SQL) for test data analytics, limit tuning, and yield/debug analysis. <

NVIDIA's GPUs and SOCs are the world leaders in power, performance and efficiency. We are continually innovating to deliver new and creative, unusual solutions to extraordinary problems in a wide range of sectors. To this purpose, we are now seeking a hard-working Senior Package Layout Engineer who is committed to making a difference in the world through their contributions! This position will collaborate with Technical Package Lead and different design teams in the design and development of sophisticated, detailed layout of IC substrates for NVIDIA products. In addition, work with design teams to plan schedules, resolve costs, manufacturing, and electrical design issues. What you'll be doing: As part of a Layout team, you will collaborate to implement high speed/density ASIC packages. Perform substrate breakout patterns for ASIC packages. Optimize package pinout incorporating system level trade-offs of pins assignment. Help perform package routing, placement, stack-up, reference plane and power distribution using Cadence APD or SiP tool suite. Propose layout design trade-offs to the Technical Package Lead for resolution and implementation. Conduct design feasibility studies to evaluate the Package design goals for size, cost, and system performance. Develop symbols and CAD library databases using Cadence APD design tools Develop methodologies to improve layout productivity What we need to see: Hold a B.S. Electrical Engineering or equivalent experience 5&#43; years experience in PCB Layout of graphics cards, motherboards, line cards or other related technology. Experience with HDI designs is a plus Proven experience in substrate layout of wire bond and flip chip packages, preferred Significant background with Cadence AP