Advance Practice Provider NP/PA β TX - Plano. Apply via Workday.
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Advance Practice Provider NP/PA β TX - Keller. Apply via Workday.
Advance Practice Provider β TX - Dallas. Apply via Workday.
Advance Practice Provider NP/PA β TX - Fort Worth. Apply via Workday.
Advance Packaging Process Development Engineer β Taichung - Fab 16, Taiwan. Apply via Workday.
PWI Advance Technical Specialist β 2 Locations. Apply via Workday.
Job Details: Job Description: The Role and Impact: We are seeking a Manufacturing Quality and Reliability Engineer to join the Foundry QnR team at our Penang site, supporting Intel's advanced packaging programs (EMIB, Foveros). This role spans silicon processing and wafer-level assembly (WLA) flows, and key interfaces with packaging substrates and 2.5D EMIB technology. You will help ensure that products and processes meet rigorous quality and reliability standards from wafer fabrication through packaging and assembly. The position directly influences manufacturing performance, yield, reliability, and customer satisfaction by driving robust quality control, disciplined excursion management, and continuous process improvement. You will also have the opportunity to represent Quality and Reliability in development forums, Silicon and Advanced Packaging factory operations, and Substrate suppliers. Key Responsibilities Apply Advanced Packaging expertise to assess inline process health, excursion impact, yield risk, defect mechanisms, and downstream packaging implications. Collaborate with cross-functional teams to drive effective root cause analysis, systemic corrective and prevention actions using 8D and related problem-solving methodologies. Partner with fab manufacturing, substrates assembly, test, process engineering, and quality teams to strengthen early excursion detection, process controls, in-line screens, and outgoing quality. Drive quality control improvements devising incoming/ outgoing quality controls, using statistical process control, defect pareto analysis, control plans, audit learnings, and excursion prevention indicators across fab, substrate manufacturing, and assembly manufacturing steps. Support manufacturing excursion management, including MRB facilitation, cont
Product Engineer (Advance Data Analytics), Heterogeneous Integration Group (HIG), High Bandwidth Memory (HBM) Product Engineering β Fab 10A, Singapore. Apply via Workday.
Snr/Product Engineer (Advance Data Analytics), Heterogeneous Integration Group (HIG), High Bandwidth Memory (HBM) Product Engineering β Fab 10A, Singapore. Apply via Workday.
Product Engineer (Advance Data Analytics), Heterogeneous Integration Group (HIG), High Bandwidth Memory (HBM) Product Engineering β Fab 10A, Singapore. Apply via Workday.
Dry Etch Senior Engineer, Advance NAND β Fab 10N/X, Singapore. Apply via Workday.
Director, PDE Advance Packaging β Fab 10A, Singapore. Apply via Workday.
Sr. Assembly TD Engineer: Advance PKG stacking β Taichung - Fab 16, Taiwan. Apply via Workday.
MTS/Principal Engineer, Wet Process Engineering, NAND Advance Node β Fab 10N/X, Singapore. Apply via Workday.
Dry Etch - MTS, PD, Advance NAND β Fab 10N/X, Singapore. Apply via Workday.
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