Advanced Development Engineer Jobs

Advanced Development Engineer, Networking Architecture — Israel, Tel Aviv. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Specific Responsibilities: 1. Drive HBM process development and yield improvement in FILMs process. 2. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development 4. Support project on-site execution and make decisions as technical consultant 5. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues 6. Generate internal and external documentation for presentations and technical reports Technology Development: 1. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs. 2. Project engagement with cross-team interaction, providing expert contribution in materials characterization. 3. Coordinate mechanical characterization for advanced packaging development efforts globally including US, Japan, and Singapore site. 4. Provide recommendations for test structure and test vehicle design for material property evaluation. 5

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Specific Responsibilities: 1. Drive HBM process development and yield improvement in WSS process. 2. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development 4. Support project on-site execution and make decisions as technical consultant 5. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues 6. Generate internal and external documentation for presentations and technical reports Technology Development: 1. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs. 2. Project engagement with cross-team interaction, providing expert contribution in materials characterization. 3. Coordinate mechanical characterization for advanced packaging development efforts globally including US, Japan, and Singapore site. 4. Provide recommendations for test structure and test vehicle design for material property evaluation. 5.

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As Photolithography Process Development Engineer in Micron's R&D/Technology Development group, you will be responsible for process module development for memory devices, in addition to other photolithography and process integration related activities. In this position, you will work with Micron engineers, technology partners and vendors to develop unit processes that meet device requirements for next-generation semiconductors, integrate processes as part of multi-functional teams and ultimately provide technology transfers to Micron’s worldwide manufacturing network. Additionally, you will address process issues with pilot line manufacturing and work on continuous improvements for manufacturability. Advanced process development tasks will include: Performing material evaluations; reticle, la

Job Details: Job Description: The Role and Impact: Join Intel's Module Development Engineering team as a manager, where you will lead a group of talented engineers in crafting innovative solutions for next-generation technology development in wafer processing, assembly/test, and module repair factories. As a key driver of Intel's technological advancement, you will play a pivotal role in ensuring the successful development, transfer, and implementation of cutting-edge technologies that enable Intel's leadership in power performance, structural efficiency, and cost optimization. With a focus on driving results and fostering collaboration across multiple organizational boundaries, this role offers an opportunity to make a significant impact on Intel's global manufacturing capabilities and future technological roadmap. Key Responsibilities: - Lead a team of module development engineers to develop, implement, and transfer advanced technology solutions. - Define and oversee technology roadmaps for the module, ensuring alignment with Intel's strategic goals. - Manage resources, set priorities, and foster collaboration across teams to meet project schedules and maximize operational outcomes. - Partner with integration, device, and yield engineering teams to develop robust process solutions that deliver power perform

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) team at Micron is shaping the future of memory and storage technologies that fuel the AI era. We collaborate with global R&D groups, suppliers, and manufacturing teams to turn bold ideas into production-ready solutions. We innovate fast, learn continuously, and work as one team! This position is intended to be part of Micron's Technical Leadership Program (TLP). This is a career path for individuals seeking to advance as technical leaders and industry innovators. TLP members are expected to influence, lead, and mentor others. Position Overview: We are seeking an experienced organizational leader who will l ead and influence methodology improvements, including best practices in process development, data-driven decision-making, and application of AI/advanced analytics to drive innovation. In this role, you will drive strategic process development for Micron’s most advanced memory products, including HBM, 3DS DRAM, and emerging 3D architectures. You will

Principal/Staff Advanced Packaging Development Process Engineer — Fab 10A, Singapore. Apply via Workday.

Job Details: Job Description: This position is in the Logic Technology Development team working in one of the most advanced semiconductor process technologies in the world. You will design, execute, and analyze experiments to develop the process of the next technologies to come into the market. Come join us and help shape the future of the semiconductor process for decades to come. What we offer: We foster a collaborative, supportive, and exciting environment where the brightest minds in the world come together to achieve exceptional results. We give you opportunities to transform technology and create a better future, by delivering products. Intel Corporation Core Values here. Benefits: We provide benefits that promote a healthy, enjoyable life: excellent medical plans, wellness programs, and amenities, ti

R&D Thin Films Process Development Engineer Advanced DRAM — Boise, ID - Main Site. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Principal/MTS Process Development Engineer with a focus on Vapor/Thermal etching, you will be part of a revolutionary Advanced DRAM Technology Development team. The position promises ample opportunity for innovation, collaboration and testing new dimensions in Advanced DRAM. You will work directly with Process Integration, equipment development engineers, hardware vendors and other process areas including Dry Etch, Metals, CVD, Diffusion, Lithography and CMP. You will work on state of the art and best in class tooling and own the process roadmap to meet program and yield goals! Responsibilities: <

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron Technology, we’re looking for a Process Engineer with experience in thin films deposition to help drive the most critical projects associated with Thin Films Development for Micron’s Advanced DRAM Nodes, with focus on enabling High-Value solutions for High Aspect Ratio, Electrically Sensitive, High Density Devices. We are a collaborative engineering team focused on advancing high-quality manufacturing processes at scale. We partner closely with cross-functional teams to solve complex problems, improve efficiency, and bring new products to life. If you enjoy hands-on impact and continuous improvement, you’ll feel right at home with us! In this role, you’ll lead critical process engineering initiatives that directly influence yield, cost, and product reliability. You’ll work across development and manufacturing to troubleshoot issues, implement improvements, and enable successful product ramps. This is a high-visibility position where your technical expertise and pr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. This job requisition is for a Photolithography Process Development Engineer at Micron Technology, Inc. Micron Technology Inc. is a Fortune 500 company and employs over 53,000 workers worldwide, with headquarters in Boise, ID. Micron offers the industry’s broadest portfolio of memory solutions—starting with foundational DRAM, NAND, and NOR Flash memory, extending to SSDs, MCPs, HBM and other memory-based systems. As the only memory fab in the western hemisphere, Micron has been in the industry for over forty -five years and continues to be the only U.S.-based DRAM manufacturer. Micron is one of the most prolific patent applicants in the world with over 60,000 patents granted and growing. As a Photo Process Development Engineer, you will be part of a revolutionary 3D DRAM Technology Development team. The positi

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Senior or Staff Equipment Development Engineer in Micron's Advanced Technology Packaging Development (APTD) team, you will be primarily responsible for developing and optimizing next generation, first of a kind (FAOK) wafer and die equipment (Post probe wafer and die development) to improve capability, productivity and cost of such equipment. You will take ideas from conception, through equipment and sub-component development, all the way to implementation in APTD and manufacturing facilities. You will also be required to identify, diagnose, and resolve equipment related problems by applying failure analysis, FMEA, 8D or FDC/Data Science methodology. Additional responsibilities include coordinating and carrying out equipment evaluation/optimization to implement changes, leading and participating in equi

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Principal/MTS Photolithography Process Development Engineer in Micron's R&D Technology Development group, you will lead advanced photolithography process development for next-generation memory devices, driving innovation in process integration and technology transfer across Micron’s global manufacturing network. Key Responsibilities: Lead development and optimization of photolithography processes to achieve yield, quality, and performance targets for advanced technology nodes. Define and translate future device requirements into robust process specifications and equipment roadmaps. Drive early adoption of innovative process and equipment solutions to enhance margin and manufacturability. Identify and integrate disruptive technologies into product

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description: A senior advanced assembly technology development engineer is responsible for introducing new technology to enable next generation packaging. This position engaged latest stacking/flip chip technology, advance packaging material and work on new process set up, process/ packaging characterization and process transfer from TD phase to high volume production to meet development milestone. This position required high motivation and operation skill to build DOE sample and fulfill customer requirement sample as well as cooperate with Material engineer, Bumping, PI, NPI, quality and manufacturing team to ensure process transfer successfully. Responsibilities Explore new technology on semiconductor industry such as flip chip, TCB and hybrid bonding process equipment and packaging material. Provide plan and resource requirement to enable new technology. Set up DOE plan and