Advanced Dram Process Integration Engineer Jobs

Shift Process Engineer, Advanced Packaging Technology Development (APTD) — Boise, ID - Main Site. Apply via Workday.

Staff Process Engineer, Advanced Packaging CMP — Boise, ID - Main Site. Apply via Workday.

Principal/Staff, APTD - Advanced Packaging Wafer Level Technology Process Engineer — Fab 10A, Singapore. Apply via Workday.

Principal Wet Process Engineer, Advanced Packaging — Boise, ID - Main Site. Apply via Workday.

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Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: We are advancing the future of semiconductor packaging through innovative 2.5D, 3D, and heterogeneous integration technologies. Our team develops the processes that enable next-generation AI and high-performance computing products, working across materials, device, design, manufacturing, and test engineering to solve complex technical challenges. If you're excited by emerging packaging architectures and breakthrough integration approaches, you'll find meaningful opportunities to make an impact here. Position Overview: As a Process Integration Lead for Advanced Packaging, you will lead a team focused on developing and integrating advanced packaging technologies from concept through full-scale manufacturing. This role plays a critical part in enabling high-performance multi-die solutions by driving technology development, process integration, technology transfer, and collaborative execution. You will help shape the roadmap for next-generation packaging platforms while mentoring a highly skilled technical team. Responsibilities: Manage and grow a team responsible for seamless process integration across 2.5D and 3D packaging platforms, including advanced interconnect architectures, die-stacking solutions, and HBM implementation. Spearhead the development, optimization, and qualification of emerging packaging technologies through experimental design (DOE), process analysis, performance validation, and establishment of design rules. Improve

Member of Technical Staff, NAND Advanced Thin Films Process Development — Fab 10N/X, Singapore. Apply via Workday.

Distinguished Member of Technical Staff, NAND Advanced Thin Films Process Development — Fab 10N/X, Singapore. Apply via Workday.

Senior Member of Technical Staff, NAND Advanced Thin Films Process Development — Fab 10N/X, Singapore. Apply via Workday.

Principal Engineer, Films - Procurement and Operations Central Team Advanced Development — Hiroshima - Fab 15, Japan. Apply via Workday.

Principal/Staff Engineer Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering — Fab 10A, Singapore. Apply via Workday.

Principal Engineer - Metals/Implant, Operations Central Teams - Advanced Development Team — Hiroshima - Fab 15, Japan. Apply via Workday.

Principal/Staff/Senior Engineer, APTD CEM - Advanced Packaging Wafer Level Technology Engineering — Fab 10A, Singapore. Apply via Workday.

Principal Engineer - Dry Etch, Operations Central Teams - Advanced Development Team — Hiroshima - Fab 15, Japan. Apply via Workday.

Principal/Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering — Fab 10A, Singapore. Apply via Workday.