Asic Physical Design Intern Jobs

Staff engineer , ASIC AMS Verification — 2 Locations. Apply via Workday.

STAFF, ASIC TECHNICAL PROGRAM MANAGEMENT — Bengaluru, India. Apply via Workday.

Principal Engineer, ASIC Design — San Jose, CA. Apply via Workday.

Principal Engineer , ASIC Analog Design — Bengaluru, India. Apply via Workday.

Principal Engineer, ASIC Analog Design — Bengaluru, India. Apply via Workday.

NVIDIA is now looking for a Senior Memory System Engineer to join our ASIC Memory Subsystem team! As a Senior Systems Engineer at NVIDIA, you'll join a group of hardworking engineers to develop and architect innovative Memory Solution for Tegra SoCs. In this position, you'll make a real impact in a multifaceted, technology-focused company. You will work with memory controller/PHY and Platform / System architect, Firmware, SI/PI, Memory suppliers to design and architect cutting edge, high speed and lower power memory technology for NVIDIA CPUs and SOCs. What You Will Be Doing: Analyze future DDR/LPDDR/HBM technologies to determine optimum performance, power, function and RAS in memory for Next generation SOC and Systems. Collaborate with ASIC Architects, Designers, Software and Firmware SW/FW teams to drive memory technology and associated requirements for memory controllers. Define Memory module, Package, and PCB layouts appropriate to the system workloads Debug and bring up memory evaluation / validation and failure issues on memory technology. Collaborate with DRAM suppliers and industry partners on to develop memory and memory related component technology. What We need to see: Bachelor's degree or master’s degree in Electrical Engineering, Computer Engineering (CE), or a related field (or equivalent experience) 10 years of proven track record in DRAM design, module design, or memory sub system design. Deep understanding and strong fundamental of memory design, features, ECC algorithm, SI and PI (Training algorithm) in DDR, LPDDR, and HBM. Strong understanding of memory sub system level interaction with Cache, Memory controller and PHY. Experience in the design, bring-up and validation for memory failure analysis Experience with Python, C/C

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron's Global Supplier Quality organization is seeking a Controller Quality Principal Engineer to lead the quality strategy, qualification, and continuous improvement of storage and memory controller (ASIC/SoC) manufacturers supporting Micron's SSD, embedded, and storage solutions portfolio. This is a senior technical leadership role responsible for driving controller supplier quality performance from design qualification through mass production and field support The successful candidate will collaborate across functions with ASIC Development Team, Compose Engineering, Product Engineering, Dependability, Manufacturing, and Commodity Management, as well as directly with controller IC vendors, foundries, third party reliability labs and OSAT (outsourced assembly and test) partners, to ensure controller quality, reliability, and supply continuity meet Micron's standards. This role can be based in Taiwan, Hyderabad, or San Jose and will work extensively across time zones with global partners and suppliers! Develops, evaluates, revises, and applies technical quality assurance protocols/methods to inspect and test in-process raw materials, production equipment, and finished products. Ensures activities and items are in compliance with both company quality assurance standards and applicable government regulations. Performs analysis and identifies trends in the inspection of finished products, in-process materials and bulk raw materials, and recommends corrective actions when vital. Ensures that established manufacturing inspection, sampling and statisti

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron's Global Supplier Quality organization is seeking a Controller Quality Principal Engineer to lead the quality strategy, qualification, and continuous improvement of storage and memory controller (ASIC/SoC) manufacturers supporting Micron's SSD, embedded, and storage solutions portfolio. This is a senior technical leadership role responsible for driving controller supplier quality performance from design qualification through mass production and field support The successful candidate will collaborate across functions with ASIC Development Team, Compose Engineering, Product Engineering, Dependability, Manufacturing, and Commodity Management, as well as directly with controller IC vendors, foundries, third party reliability labs and OSAT (outsourced assembly and test) partners, to ensure controller quality, reliability, and supply continuity meet Micron's standards. This role can be based in Taiwan, Hyderabad, or San Jose and will work extensively across time zones with global partners and suppliers! Develops, evaluates, revises, and applies technical quality assurance protocols/methods to inspect and test in-process raw materials, production equipment, and finished products. Ensures activities and items are in compliance with both company quality assurance standards and applicable government regulations. Performs analysis and identifies trends in the inspection of finished products, in-process materials and bulk raw materials, and recommends corrective actions when vital. Ensures that established manufacturing inspection, sampling and statisti

NVIDIA's GPUs and SOCs are the world leaders in power, performance and efficiency. We are continually innovating to deliver new and creative, unusual solutions to extraordinary problems in a wide range of sectors. To this purpose, we are now seeking a hard-working Senior Package Layout Engineer who is committed to making a difference in the world through their contributions! This position will collaborate with Technical Package Lead and different design teams in the design and development of sophisticated, detailed layout of IC substrates for NVIDIA products. In addition, work with design teams to plan schedules, resolve costs, manufacturing, and electrical design issues. What you'll be doing: As part of a Layout team, you will collaborate to implement high speed/density ASIC packages. Perform substrate breakout patterns for ASIC packages. Optimize package pinout incorporating system level trade-offs of pins assignment. Help perform package routing, placement, stack-up, reference plane and power distribution using Cadence APD or SiP tool suite. Propose layout design trade-offs to the Technical Package Lead for resolution and implementation. Conduct design feasibility studies to evaluate the Package design goals for size, cost, and system performance. Develop symbols and CAD library databases using Cadence APD design tools Develop methodologies to improve layout productivity What we need to see: Hold a B.S. Electrical Engineering or equivalent experience 5+ years experience in PCB Layout of graphics cards, motherboards, line cards or other related technology. Experience with HDI designs is a plus Proven experience in substrate layout of wire bond and flip chip packages, preferred Significant background with Cadence AP

About the Team: OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. Role Overview We are seeking a Package Reliability Engineer to lead reliability engineering for advanced packages used in high-performance AI and computing systems. The primary focus of this role is to assess package level mechanical and thermal reliability risks and apply thermal and mechanical modeling to optimize package design, material selection, and assembly processes. The engineer will also develop reliability test plans with external partners, identify failure mechanisms, perform root-cause analysis, and recommend practical corrective actions. In this role, you will assess package reliability risks from early architecture development through product qualification and high-volume manufacturing. You will work closely with package design, silicon design, system engineering, manufacturing, and ASIC partners to predict package behavior, develop qualification strategies, resolve reliability issues, and improve overall package robustness and lifetime. In this role you will: Lead reliability test plan and assessments for advanced HPC packages, including risk identification, potential failure-mechanism analysis, root-cause investigation, mitigation planning, and corrective-action development. Drive reliability-focused package design optimization based on thermo-mechanical modeling to improve package reliability, power integrity, thermal performance, mechanical robustness, and platform scalability. Develop, validate, and apply package reliability models and lifetime-prediction

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. Role summary We are seeking a Networking Operating System Firmware Engineer to help bootstrap and scale the switching layer of our AI supercomputers. In this role, you will build and maintain custom NOS images from scratch, using open source components from SONiC, SAI, FRR, and related networking stacks while working across the Linux kernel, switch ASIC SAI/SDKs, platform drivers, control-plane services, and orchestration layers. This is a software engineering role that requires a deep understanding of networking, NOS internals, switch hardware, and production systems. You will design, implement, test, and debug production NOS software across platform drivers, routing and control-plane state, ASIC programming, observability, and fleet integration. The engineer in this role should be able to work through ambiguous, open-ended technical problems and drive feature development across software, hardware, and vendor boundaries. This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance to new employees. In this role, you will Design, develop, and maintain custom NOS images for large-scale AI fabrics, using open source components from SONiC, FRR, and related networking stacks. Integrate, build and configure Linux kernel components, device drivers, switch ASIC SDKs, and SAI layers. Bring up new switch platforms, including thermal and fan control, power monitoring, transceiver management, watchdogs, OSFP CMIS, L

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. We are looking for a highly skilled and motivated Senior Design Verification Engineer to join our team. In this role, you will be responsible for the end-to-end verification of our IOMMU (Input/Output Memory Management Unit) IP. You will play a critical role in ensuring the functional correctness and performance of the design, taking ownership of the verification process right from the initial specification understanding down to final coverage closure. This role is hybrid, based out of Bangalore, India. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are You have hands-on experience in ASIC or SoC verification using SystemVerilog and UVM. You enjoy debugging complex design and verification issues and working closely with cross-functional teams. You’re comfortable building verification environments from scratch and driving coverage closure. You have familiarity with standard bus protocols and modern verification tools. What We Need Experience owning block or subsystem-level verification from test planning to sign-off. Strong understanding of constrained-random verification, coverage analysis, and regression debugging. Familiarity with proto

The SCG Architecture team is hiring a Senior Power Integrity Co-Design Engineer to architect and deliver di/dt mitigation across silicon, package, board, and platform. This role bridges architecture, silicon, and platform — translating product noise targets into shipped specifications, and feeding silicon findings back into the next generation's build. Success in this role requires strong systems thinking and a willingness to accept ambiguity. It also requires the ability to apply AI as a force multiplier while maintaining rigorous engineering judgment. What you'll be doing: Architect voltage-noise mitigation across the full stack — silicon, package, board, platform — and own the codesign trade-offs between them. Co-design noise features with Speed, Power, Reliability, Circuit Design , Power-Arch, ASIC, and platform teams. You're the connective tissue across the codesign web. Work with other team members to define product-level voltage noise targets, drive them to closure, and sign them off at shipment. Build and take ownership of the Sim-to-Si correlation methodology for noise. You know when a model is lying and when silicon is. Model and prototype next-gen noise features — transient sense, droop response, mitigation IP, and codify them so every future program inherits them. Lead show-stopper noise bugs during bringup. The critical issues stop with you. Drive architecture-level codesign tradeoffs across V/F Power Noise Reliability Thermal (Noise-Variation) and (Noise-to-Closure) boundary work, where the highest-leverage innovation lives. What we need to see: BS / MS / PhD in EE, CE, or related (or equivalent experience). 5+ years in silicon power integrity, voltage noise, or PDN. Deep expertise in at least one of

NVIDIA's Silicon Co-design Group (SCG) sits at a rare intersection: we own the full product development lifecycle, from early architecture definition through silicon bringup to product release. Our ArchDev team is the hub for silicon and system-level feature development, driving tradeoff analysis, system integration, and POR alignment across the entire organization. If you want to see your work go from whiteboard to world-class silicon, this is where that happens. What You'll Be Doing: Architect and integrate system-level performance and power management features, controllers, and policies to optimize product efficiency across datacenter and client products . Build feature roadmaps to address low-power, low-noise, and performance-per-watt product needs through prototyping, use-case analysis, and cost/benefit trade-offs. Partner with architecture, ASIC, board/platform, software/firmware, and marketing teams to drive design decisions and debug complex issues. Track industry trends and market needs and translate them into forward-looking roadmaps that keep NVIDIA's products ahead of the curve. Lead debug efforts, develop workarounds, and support bringup , validation, manufacturing, and customer escalations. What We Need to See: <

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. At Tenstorrent, we're building cutting-edge AI compute solutions. Developing diagnostics programs to validate the functionality and stress the performance of our solutions is a critical part of delivering exceptional products. We are looking for Engineers to join our Diagnostics Development team. These engineers will work closely with our firmware, software, board, ASIC design and verification teams to ensure that the ASICs, boards, and AI compute systems meet the highest standards of quality and performance. This role is hybrid, based out of Toronto, Canada. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are You're curious, hands-on, and excited by the challenge of building powerful systems that sit at the intersection of hardware and software. You enjoy working close to the metal, whether that’s writing code, debugging hardware, or exploring how systems perform under stress. You thrive in collaborative environments and love learning from teammates across disciplines like firmware, ASIC design, and manufacturing. You’re motivated by impact and want to contribute to technology that’s shaping the future of AI and computing. What We Need A