Electrical Engineer Jobs

Job Details: Job Description: The Role and Impact As a Physical Design Engineer, you will play a critical role in driving the development of cutting-edge technologies at Intel. You will work hands-on to deliver high-performance physical designs, ensuring the successful integration of advanced semiconductor technologies. Your work will directly impact Intel's product innovation, addressing complex challenges in power, performance, and area optimization to shape the future of computing architectures. From synthesis to sign-off, your contributions will enable Intel to meet ambitious design goals and deliver transformative solutions to the market. Business Group This role is part of Intel's Corporate Technology Office (CTO), a dynamic group dedicated to advancing the company's technological leadership and innovation. The group focuses on developing foundational technologies, architectures, and methodologies that drive Intel's product roadmap and enable breakthrough computing solutions. Collaborating with cross-disciplinary teams, the CTO plays a pivotal role in delivering impactful designs that support Intel's broader mission of creating world-changing technology. Key Responsibilities - Drive RTL-to-GDS design convergence using advanced synthesis and place-and-route tools targeting performance, power, and area (PPA) goals. - Deliver block-level physical design, including closure of backend flows, electrical requirements, and enhancing silicon yield. - Collaborate with CAD and physical design methodology teams to adopt industry-leading tools and optimizations for custom designs. - Execute physical implementation tasks such as floor planning, bus/pin placement, power/clock distribution, congestion analysis, timing closure, IR drop analysis, and physical verification. - Debug timing, EM/IR, LVS, and DRC violations, and driv

Job Details: Job Description: Note: This role requires regular onsite presence to perform essential job responsibilities. This position drives technology development and enablement for both high-volume manufacturing and future process technologies. Responsibilities include providing process integration and equipment solutions, conducting feasibility studies to meet device performance requirements, and leading the design and development of advanced manufacturing processes. The role involves material selection, parameter optimization, metrology, equipment engineering, and system design to enable new product architectures and functional requirements. The successful candidate will lead pathfinding activities that support process and hardware development for next-generation manufacturing technologies and will contribute to technology roadmaps that enable future product innovation. The role also includes identifying and implementing equipment and process improvements to enhance manufacturing efficiency, optimize production output, and improve operational performance. Qualifications: Minimum Qualifications Master's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related STEM field, with 6+ years of semiconductor industry experience , primarily in dry etch process development. Bachelor's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related STEM field, with 9+ years of semiconductor industry experience , primarily in dry etch process development. 3+ years of experience collaborating with equipment suppliers (e.g., Lam Research, TEL, Applied Materials, Hit

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Principal Signal Integrity Engineer — Interface Pathfinding About the Role At Micron, we transform how the world uses information to enrich life for all. As a global leader in memory and storage innovation, we develop technologies that accelerate intelligence and enable the next era of AI, ML, and advanced computing. Micron’s Interface Pathfinding team operates at the leading edge of that mission — serving as a bridge between corporate strategy and engineering through forward-looking investigation and development of energy-efficient bandwidth solutions. Our work spans innovative circuit, signaling, packaging, and interconnect solutions with a 3–5 year technology horizon, grounded in rigorous analysis, hands-on measurement, and a commitment to building a robust intellectual property portfolio. As a Principal Signal Integrity Engineer , you will be a core technical contributor on a deliberately small, senior team united around the goal of preparing high-speed interface innovations for high-confidence product adoption. What You’ll Work On Micron’s Interface Pathfinding team investigates and validates novel interconnect and signaling solutions for high-speed memory and die-to-die interfaces. The signal integrity scope is broad and analytically deep — spanning electrical modeling, channel analysis, and substrate evaluation — with an emphasis on original analysis rather than execution of established playbooks. Key signal integrity domains include: Intercon

Job Details: Job Description: The Role and Impact Are you ready to make a significant contribution to cutting-edge semiconductor designs? As a DFT Design Engineer, you will play a critical role in shaping the testability, debuggability and reliability of complex SoC (System-on-Chip) designs. You will work closely with cross-functional teams, influencing designs from concept to production, and ensuring our products meet the highest quality standards. In this role, you will develop innovative DFT/DFD methodologies, optimize workflow with AI, and enhance post silicon efficiency. Your work will directly impact Intel's ability to deliver world-class semiconductor solutions that advance technology across industries. Key Responsibilities : Develop and implement advanced DFT methodologies for complex SoC designs to maximize test coverage and efficiency. Collaborate with design, verification, and manufacturing teams to define and optimize post silicon strategies and requirements. Integrate DFT/DFD features into RTL and ensure verification of design for testability requirements. Collaborate with post-silicon teams to debug and validate DFT features. Stay current with emerging trends, AI adoption and technologies in DFT/DFD to ensure best practices are incorporated into workflows. Qualifications: Minimum Qualifications : Bachelor's degree in Electrical Engineering, Computer Engineering, or a related field. 5+ years of experience in DFT, SoC design, or related semiconductor design areas. Expertise in RTL design using hardware description languages like Verilog, VHDL, or SystemVerilog. Preferred Qualifications : Familiar with AI application. Familiarity w

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is seeking a Signal Integrity Engineer to join our growing team. The ideal candidate will have a wealth of exposure designing high speed interconnects, breakout design, material trade-offs and verification. A background in electrical engineering, electronics or relevant fields is required. Must love all things high speed! This role is hybrid, based out of Santa Clara, CA or Austin, TX or Toronto, ON. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are You have a Bachelor’s degree in Electrical Engineering (or equivalent) and 5+ years working in high-speed digital design with a focus in high-speed PCB or package design at 10Gbps and above (e.g. 100GbE, GDDR6, PCIe Gen5+). You’re comfortable working with high-speed performance metrics such as ICR, ERL, COM, NEXT, and FEXT as well as knowledge of high-speed connector technologies, including NPO, CPO, and emerging standards. You are proficient with PCB ECAD tools (ideally Cadence Allegro). You communicate clearly (written and verbal), think critically, and love solving complex signal integrity problems. You’re enthusiastic about all things high speed and enjoy collaborating acro

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Develop test programs of SSD and UFS controller products, and enhance test coverage to ensure excellent outgoing quality and customer satisfaction. Optimize test programs to reduce product test times and manufacturing cost by improving the efficiency of the testing methods . Automate test engineering processes by writing software scripts to improve efficiency. Work closely with product and equipment engineering teams to improve overall product yields and equipment efficiency to maximize ROI. Work closely with design teams to develop design for test features to drive lower costs and increased efficiency Develop and monitor process and engineering metrics to ensure stability, efficiency and effectiveness of test processes. Bachelor’s or master’s degree in Electrical Engineering/Computer engineering. Strong interest in software development with good programming skills. Knowledge of any of the following is desirable: Python, C/C++, Visual Basic, Perl. Prefer candidates with digital, analog, and mixed signal test programming and debug experience. Familiar testing IP blocks such as PLL, efuse, LDO’s, PCIe, DDR, ONFI, and DFT patterns implementation ATPG SCAN, TDF, MemBIST & repair, JTAG, and functional patterns Test program development experience on logic ATE tester platform such as UltraFlex/J7

To manage and execute electrical engineering activities for Greenfield/Brownfield Thermal Power Plant projects, ensuring timely completion of engineering, procurement, installation, testing, commissioning, and synchronization activities while adhering to safety, quality, and project schedules Source: Adani Group | Job ID: 54970

To manage and execute electrical engineering activities for Greenfield/Brownfield Thermal Power Plant projects, ensuring timely completion of engineering, procurement, installation, testing, commissioning, and synchronization activities while adhering to safety, quality, and project schedules Source: Adani Group | Job ID: 54965

About the Team: OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role We are seeking a Manufacturing Test Engineer to own and drive manufacturing test strategy, development, and execution for complex AI hardware systems. This role will define and implement test coverage across the product lifecycle, including ICT, functional circuit test, tray-level functional test, and system manufacturing test. You will work closely with hardware design engineering, diagnostic/software teams, manufacturing engineering, quality, and external system integrators and suppliers to translate product requirements into robust, scalable, and production-ready test solutions. You will also play a key role in reviewing test data, debugging failures, improving yield, and ensuring manufacturing test readiness from early development through volume production. In This Role, You Will: Define and drive the manufacturing test strategy for boards, trays, and system-level hardware assemblies across EVT, DVT, PVT, and production ramp. Develop and manage test coverage for: ICT / structural test FCT / board-level functional test Tray-level functional and integration test System-level manufacturing and bring-up test Partner closely with electrical engineering, system engineering, and diagnostic/software teams to define test requirements, review manufacturing test scripts and diagnostics, validate failure isolation needs, debug hooks, logging, and production screening strategies. Translate engineering requirements into practical, scalable manufacturing test plans that

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities include but are not limited to the following: Team oriented approach to create new strategies for DRAM DFT. New DRAM Test Flow Strategy. Fail Pattern Recognition. Improved methodology for test time reduction and improved quality. Assist in solutions to high visibility DRAM product issues. Create supporting software tools to assist in Engineering Analysis. Invent and Innovate anything and everything related to DFT. Employer will accept a Bachelor’s degree in Electrical Engineering, Computer Science, Electrical and Computer Engineering or related field. Position requires: 1) CMOS circuit knowledge 2) Basic programming skills in Python, Java, C or C&#43;&#43; 3) DRAM knowledge 4) Statistics 5) Basic lab experience or equivalent applied software profiling/analytics As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays.<s

About Ubiquiti At Ubiquiti Inc., we create technology platforms for Businesses, Smart Homes, and Internet Service Providers, driven by our goal to connect everyone, everywhere. To date, Ubiquiti has shipped over 100 million devices worldwide, from ISP networking products to next generation of IT solutions. Our growth is made possible by the dedicated team of hundreds behind the scenes. From software developers and product managers to designers and strategists, Team UI is driven to achieve our common goal: Rethinking IT. At Ubiquiti, you’ll heighten your potential and broaden your horizons - all while shaping the future of connectivity. Responsibilities Lead hardware circuit design, schematic capture, and layout review for next-generation, high-density, and high-throughput networking platforms. Evaluate and integrate advanced switching architectures, management subsystems, and cutting-edge high-speed interconnect technologies. Drive hardware architecture design, system bring-up, high-speed signal integrity (SI) validation, and root-cause failure analysis. Partner with mechanical, thermal, and power engineering teams to address challenges related to high power density, thermal dissipation, and system-level reliability. Own BOM structure and support factory deployment to ensure seamless transition of high-layer-count PCBAs from NPI to mass production. Collaborate with cross-functional software, firmware, QA, and compliance teams throughout the entire product lifecycle. Q ualifications Bachelor’s degree or above in Electrical Engineering or a related discipline. 5+ years of hands-on experience in high-complexity system-level hardware design, ideally focused on enterprise-grade networking or high-performance infrastructure equipment. Deep technical understanding of high-speed Ethernet design, high-speed differential signals (advanced SerDes, PCIe, multi-gigabit/ultra-high-speed interfaces), and high-density PCB design rules. Practical experience with complex power d

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities: Develop and implement process integration strategies to achieve flawlessly operational semiconductor devices. Work together with diverse groups to identify the most effective methods for incorporating new technologies into current workflows. Conduct data analysis to optimize performance and yield, ensuring world-class quality standards are met. Troubleshoot and resolve process-related issues, applying your proven expertise to maintain high efficiency and reliability. Promote continuous progress projects to compete against and outperform industry norms. Actively apply AI tools to improve work efficiency and productivity. Minimum Qualifications: Master's degree or equivalent experience in Electrical Engineering, Chemical Engineering, Materials Science, or a related field. Proven experience in semiconductor process integration and development. Strong analytical and problem-solving skills. Ability to work well with diverse functional groups. Proficiency in data analysis and statistical process control. Preferred Qualifications: Master's degree or higher in a relevant field, or equivalent experience. Experience with AI tools and their application in semiconductor processes. Familiarity with advanced semiconductor materials and device physics. Proven a

NVIDIA is seeking an a PCB Library Engineer to join our PCB Design Infrastructure team. In this role, you will help develop and maintain the PCB library assets used across NVIDIA's Data Center, AI, Networking, Automotive, and Graphics products. Working alongside experienced PCB designers, library engineers, mechanical engineers, manufacturing engineers, and component engineers, you will create and validate component footprints, schematic symbols, mechanical components, panel definitions, and other critical design assets that enable successful product development. This position provides an excellent opportunity to build expertise in PCB design, manufacturing, component engineering, and design automation while supporting some of the most advanced computing platforms in the world. What you'll be doing: Develop PCB footprints, padstacks, schematic symbols, and mechanical library content using Cadence PCB design tools. Review component datasheets, package drawings, and engineering specifications to create accurate design libraries. Support library verification, release, and documentation processes. Partner with PCB design, mechanical engineering, manufacturing engineering, and operations teams to resolve library-related issues. Learn and apply industry standards, including IPC requirements, DFM, DFA, and DFT principles. Support quality initiatives to ensure library content is accurate, manufacturable, and scalable. Participate in continuous improvement and automation efforts within the library environment. Develop a strong understanding of PCB fabrication, assembly, and component technologies. What We Need to See: BS degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, Manufacturing Engineering, or a related field or equivalent experience. <p

About Graphcore Graphcore is a global leader in artificial intelligence computing systems. We design advanced semiconductors, software, and data center systems that provide the specialized processing power needed to advance AI while improving the efficiency required for broad adoption. As part of SoftBank Group, Graphcore belongs to a family of companies developing transformative technologies. Our U.S. engineering teams contribute to the hardware and software platforms that support the next generation of AI systems. The Opportunity We are looking for a computer engineering, electrical engineering, or computer science student or recent graduate to join the BMC Development team as a Firmware Engineering Intern. You will work with experienced engineers on low-level and embedded firmware that supports the operation, control, and manageability of advanced compute systems. This internship provides hands-on experience in firmware development, test automation, engineering experiments, and lab-based system testing in a Linux development environment. You will own clearly defined technical tasks with guidance from the team and contribute to production-quality engineering work. Type: 12-week summer internship Timing: May - August (exact dates to be confirmed) Commitment: Full-time What You Will Do Contribute to the design, implementation, and testing of system and embedded firmware. Develop and maintain firmware and supporting software in C, C++, or Python. Support firmware development and debugging in a Linux-based engineering environment. Create automated tests and scripts that improve firmware validation, test coverage, and engineering efficiency. Contribute to continuous integration and delivery workflows for firmware development and testing. Plan and conduct well-defined engineering experiments, record results accurately, and draw conclusions from test data. Support lab setup, system configuration, hardware bring-up, and firmware testing. Use debugging and diagnostic techn

Job Details: Job Description: Intel India Customer Engineering Team is in a mission to create successful Original Design Manufacturers (ODMs) from India across their customer base. We are seeking a Hardware Board Design Engineer specializing in Power Delivery design and debug experience to help Intel customers design and debug their hardware platforms based on Intel Core and Atom CPUs. Qualifications: • Education : Bachelor's or Master's degree in Electronics/Electrical Engineering or related field • Experience : 7-12 years of industry experience (preferably 5-6 years designing and debugging hardware boards with Power Delivery focus using Intel Core/Atom CPUs) • Power Delivery Expertise : Deep understanding of system Power Delivery requirements and familiarity with Intel Core/Atom processor Power Delivery guidelines including IMVP specifications and PDN analysis • Circuit Design : Extensive experience with Buck, Boost, and Multi-phase Power Delivery Network design, including control loop understanding and very high current/low-voltage power delivery design • Design Tools : Proficiency in schematic capture using ind