Electrical Jobs

About Ubiquiti At Ubiquiti Inc., we create technology platforms for Businesses, Smart Homes, and Internet Service Providers, driven by our goal to connect everyone, everywhere. To date, Ubiquiti has shipped over 100 million devices worldwide, from ISP networking products to next generation of IT solutions. Our growth is made possible by the dedicated team of hundreds behind the scenes. From software developers and product managers to designers and strategists, Team UI is driven to achieve our common goal: Rethinking IT. At Ubiquiti, you’ll heighten your potential and broaden your horizons - all while shaping the future of connectivity. Responsibilities Lead hardware circuit design, schematic capture, and layout review for next-generation, high-density, and high-throughput networking platforms. Evaluate and integrate advanced switching architectures, management subsystems, and cutting-edge high-speed interconnect technologies. Drive hardware architecture design, system bring-up, high-speed signal integrity (SI) validation, and root-cause failure analysis. Partner with mechanical, thermal, and power engineering teams to address challenges related to high power density, thermal dissipation, and system-level reliability. Own BOM structure and support factory deployment to ensure seamless transition of high-layer-count PCBAs from NPI to mass production. Collaborate with cross-functional software, firmware, QA, and compliance teams throughout the entire product lifecycle. Q ualifications Bachelor’s degree or above in Electrical Engineering or a related discipline. 5+ years of hands-on experience in high-complexity system-level hardware design, ideally focused on enterprise-grade networking or high-performance infrastructure equipment. Deep technical understanding of high-speed Ethernet design, high-speed differential signals (advanced SerDes, PCIe, multi-gigabit/ultra-high-speed interfaces), and high-density PCB design rules. Practical experience with complex power d

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities: Develop and implement process integration strategies to achieve flawlessly operational semiconductor devices. Work together with diverse groups to identify the most effective methods for incorporating new technologies into current workflows. Conduct data analysis to optimize performance and yield, ensuring world-class quality standards are met. Troubleshoot and resolve process-related issues, applying your proven expertise to maintain high efficiency and reliability. Promote continuous progress projects to compete against and outperform industry norms. Actively apply AI tools to improve work efficiency and productivity. Minimum Qualifications: Master's degree or equivalent experience in Electrical Engineering, Chemical Engineering, Materials Science, or a related field. Proven experience in semiconductor process integration and development. Strong analytical and problem-solving skills. Ability to work well with diverse functional groups. Proficiency in data analysis and statistical process control. Preferred Qualifications: Master's degree or higher in a relevant field, or equivalent experience. Experience with AI tools and their application in semiconductor processes. Familiarity with advanced semiconductor materials and device physics. Proven a

Job Details: Job Description: Join Intel's Silicon and Platform Engineering Group (SPE) as an Exempt Tech Contract Employee, The Role and Impact :As a Power Integrity Engineer, you will play a pivotal role in ensuring Intel's platforms and products meet the highest standards of performance and reliability. This position offers you the opportunity to work on cutting-edge technologies, designing and optimizing power delivery networks for complex high-speed platforms, boards, packages, and silicon. Your contributions will directly impact Intel's ability to deliver industry-leading solutions to its customers, driving innovation in power integrity and enhancing the performance and functionality of our silicon and systems. Join us to tackle exciting challenges and create impactful solutions that push technological boundaries. The primary responsibilities for this role will include, but are not limited to: Develop and analyze power delivery networks, including 2D and 3D model extraction and noise analysis across die/C4 bumps, silicon, package, sockets, and boards. Define power grid specifications and power and area targets to achieve optimal balance between power integrity and performance. Design test structures, electrical analysis methodologies, and verification plans to address power integrity challenges. Perform measurements to characterize power noise profiles across frequency, ground bounce, and other critical metrics, verifying power delivery networks post-design. Correlate measurements back to presilicon analysis and estimations for improved accuracy. Apply expertise in power integrity design and tradeoffs to guide simulations of power networks and physical implementations for packages and platforms. Ensure on-die power noise meets system-on-chip (SoC) functionality an

Job Details: Job Description: Intel India Customer Engineering Team is in a mission to create successful Original Design Manufacturers (ODMs) from India across their customer base. We are seeking a Hardware Board Design Engineer specializing in Power Delivery design and debug experience to help Intel customers design and debug their hardware platforms based on Intel Core and Atom CPUs. Qualifications: • Education : Bachelor's or Master's degree in Electronics/Electrical Engineering or related field • Experience : 7-12 years of industry experience (preferably 5-6 years designing and debugging hardware boards with Power Delivery focus using Intel Core/Atom CPUs) • Power Delivery Expertise : Deep understanding of system Power Delivery requirements and familiarity with Intel Core/Atom processor Power Delivery guidelines including IMVP specifications and PDN analysis • Circuit Design : Extensive experience with Buck, Boost, and Multi-phase Power Delivery Network design, including control loop understanding and very high current/low-voltage power delivery design • Design Tools : Proficiency in schematic capture using ind

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a SoC Design Engineer, you will be part of the Heterogeneous Integration Group (HIG), contributing to the design, development, and integration of next‑generation HBM SoC logic die. You will work closely with architecture, verification, physical design, firmware, and product teams to implement robust, high‑performance SoC solutions that meet ambitious power, performance, area, and schedule targets. You will also work to enable and integrate AI-driven tools and AI-enabled workflows into the team's methodologies. Key Responsibilities Design and implement RTL for SoC‑level blocks and subsystems used in HBM logic die. Integrate internal and third‑party IP (e.g., controllers, microcontrollers, NOC, RAS, MBIST, interfaces, adapters, buffers, PHY‑adjacent logic). Collaborate with SoC architects to translate architectural and micro‑architectural specifications into high‑quality RTL implementations. Participate in SoC‑level integration activities, including clocking, reset, power intent, and configuration infrastructure. Assist with pre‑silicon validation and post‑silicon bring‑up, including root‑cause analysis of silicon issues. Contribute to design documentation, block specifications, and design reviews. Collaborate multi-functionally with Product Engineering, Test, Probe, Process Integration, and Manufacturing to ensure robust and manufacturable builds. Minimum Qualifications Bachelor’s or master’s degree in electrical engineering, Computer Engin

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is seeking a Signal Integrity Engineer to join our growing team. The ideal candidate will have a wealth of exposure designing high speed interconnects, breakout design, material trade-offs and verification. A background in electrical engineering, electronics or relevant fields is required. Must love all things high speed! This role is hybrid, based out of Santa Clara, CA or Austin, TX or Toronto, ON. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are You have a Bachelor’s degree in Electrical Engineering (or equivalent) and 5+ years working in high-speed digital design with a focus in high-speed PCB or package design at 10Gbps and above (e.g. 100GbE, GDDR6, PCIe Gen5+). You’re comfortable working with high-speed performance metrics such as ICR, ERL, COM, NEXT, and FEXT as well as knowledge of high-speed connector technologies, including NPO, CPO, and emerging standards. You are proficient with PCB ECAD tools (ideally Cadence Allegro). You communicate clearly (written and verbal), think critically, and love solving complex signal integrity problems. You’re enthusiastic about all things high speed and enjoy collaborating acro

1671 About the Role We are seeking a Senior Signal Integrity Engineer to develop, validate, and optimize high-speed signaling solutions across blade- and rack-level architectures for advanced compute platforms. This role sits at the intersection of silicon, package, interconnect, board, and system design , with a strong emphasis on hands-on measurement, simulation correlation, and cross-functional technical communication. Key Responsibilities End-to-end signal integrity analysis for blade- and rack-level system architectures. Analyze and optimize high-speed and low-speed I/O interfaces, including PCIe Gen4/5/6, Ethernet, DDR, SerDes, SPI , I2C, etc . and related interconnects. Perform time-domain and frequency-domain simulations using tools such as Ansys HFSS, Keysight ADS, Cadence Sigrity, CST, SPICE , or similar. Support hands-on lab validation using VNA, TDR, BERT, and high-speed oscilloscopes . Correlate simulation results with lab measurements to identify margin gaps, debug issues, and improve design methodology. Collaborate with silicon, package, board, connector, cable, and system design teams to optimize I/O channel performance. Work with interconnect vendors and ODMs to guide board layout, stack-ups, routing rules, and system design decisions. Review schematics, layouts, simulation results, and validation data for blade, backplane, and rack-level hardware. Prepare and communicate clear validation reports, measurement summaries, debug findings, and technical recommendations to internal teams, vendors, and senior technical stakeholders. Required Qualifications Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field . Strong experience in signal integrity for high-speed digital systems. Hands-on measurement expertise using VNAs, TDRs, BERTs, and high-speed oscilloscopes . Experience measuring and analyzing S-parameters, impedance profiles, eye diagrams, jitter, timing margins, insertion loss, return loss, and cro

We are seeking a Front-End Integration Engineer for the NIC Silicon group. Join our team at NVIDIA's Networking business unit and be part of the innovative build and implementation of the next generation Network Adapter Silicon chips. Contribute to the development of powerful communication devices. What You'll Be Doing: Own and maintain Continuous Integration pipelines. Monitor, complete, and fix daily and nightly CI flows in front-end build areas. These include Lint, Synthesis, Equivalence Checking and Simulation. Automate EDA Flows: Build, develop, and maintain robust automation scripts using Python, Tcl scripting, and Shell to integrate EDA tools (Synopsys, Cadence) into automated build pipelines. Manage Perforce Integration: Maintain multi-IP branch/stream strategies, manage workspace specs, complete hardware build drops, and handle release labels/tags in Perforce (Helix Core). Support Engineering Teams: Act as the primary point of contact for RTL and verification engineers to debug flow crashes, bottlenecks, environment setups, and CI failure reports. Enforce Quality Gates: Implement automated check-in and change list triggers to run sanity checks, linting, and style enforcement before code is committed to main streams. Optimize Infrastructure: Monitor compute farm resources (LSF) and storage usage to reduce pipeline runtime and improve overall execution efficiency. What We Need to See: Experience: 2+ years of hands-on industry experience in ASIC/SoC front-end integration, CAD, or EDA flow automation. Education: Bachelor’s degree or Master’s degree or equivalent experience in Electrical Engineering, Computer Engineering, Computer Science, or a related field. Perforce Expertise: Strong hands-on experience managing Perforce (P4 / Helix Core) streams, workspace specs, c

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job duties Include • Interpreting contract documents and specifications • Interpreting control and P & ID drawings • Ability to prepare and update project budgets • Prepare, review and finalize cost estimates • Ability to produce, update, and manage project schedules • Review instrumentation, control and electrical designs • Oversee design, engineering and manufacturing team members • Interaction with other engineering firms, contractors and vendors Scope summary, clarifications, and exclusions • Experience in managing I&C projects to a successful conclusion • Familiarity with electrical schematics and control diagrams • Familiarity with process controls and strategy • Ability to work well with others and lead by example • Proficient in Word, Excel, and Adobe Acrobat • Good communication skills with clients and employees Typical responsibilities include, but are not limited to: Safety & Quality: • Ensuring compliance with laws, regulations, and standard processes • Leading quality improvement initiatives in area of expertise to reduce Fab impacts,

NVIDIA is seeking an a PCB Library Engineer to join our PCB Design Infrastructure team. In this role, you will help develop and maintain the PCB library assets used across NVIDIA's Data Center, AI, Networking, Automotive, and Graphics products. Working alongside experienced PCB designers, library engineers, mechanical engineers, manufacturing engineers, and component engineers, you will create and validate component footprints, schematic symbols, mechanical components, panel definitions, and other critical design assets that enable successful product development. This position provides an excellent opportunity to build expertise in PCB design, manufacturing, component engineering, and design automation while supporting some of the most advanced computing platforms in the world. What you'll be doing: Develop PCB footprints, padstacks, schematic symbols, and mechanical library content using Cadence PCB design tools. Review component datasheets, package drawings, and engineering specifications to create accurate design libraries. Support library verification, release, and documentation processes. Partner with PCB design, mechanical engineering, manufacturing engineering, and operations teams to resolve library-related issues. Learn and apply industry standards, including IPC requirements, DFM, DFA, and DFT principles. Support quality initiatives to ensure library content is accurate, manufacturable, and scalable. Participate in continuous improvement and automation efforts within the library environment. Develop a strong understanding of PCB fabrication, assembly, and component technologies. What We Need to See: BS degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, Manufacturing Engineering, or a related field or equivalent experience. <p

A Test Program Manager (or Test Engineering Program Manager) leads cross-functional teams to define, plan, and execute product testing strategies, ensuring quality from development to launch. They manage test schedules, budgets, and vendor relations while driving bug resolution and reporting status to leadership. Apple +4 Key Responsibilities Strategy & Planning: Define comprehensive end-to-end testing strategies, covering functional, regression, and system testing. Cross-Functional Leadership: Coordinate with software, hardware, and RF test engineers to align testing with product development. Execution & Monitoring: Drive test readiness reviews, monitor test execution, and manage defect reporting. Vendor & Budget Management: Manage test suppliers, vendors, and development budgets. Risk Management: Proactively identify project risks, inter-dependencies, and bottlenecks to ensure on-time delivery. Apple +6 Required Skills & Qualifications Technical Proficiency: Familiarity with test technologies, CICD, and automation tools. Project Management: Experience with software development lifecycles (SDLC) and complex product testing. Communication: Excellent leadership, presentation, and conflict-resolution skills. Education/Experience: Often requires a degree in Engineering (Software/Electrical) and experience in testing or program management. Apple +4

Job Details: Job Description: Contributes to module process development, process integration flows, and equipment configuration for manufacturing modules. Supports yield improvement initiatives by analyzing defect data, conducting experiments, and assisting in risk assessments. Electrcial characterization of transistors and analysis of data to help yield or improved process conditions. Collaborates with engineering teams to optimize metrology strategies and troubleshoot process flow issues. Contributes to continuous improvement efforts in high volume manufacturing environments. As an intern, learns and applies knowledge, builds skills, and explores future career opportunities through hands on experience and projects that support Intel business goals in a collaborative environment Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your schoolwork, classes, research, relevant previous job, and/or internship experiences. Minimum qualifications: Must be pursuing a PhD degree in a hard science discipline such as Electrical Engineering, Physics, Materials Science.

NVIDIA is now looking for a Senior Memory System Engineer to join our ASIC Memory Subsystem team! As a Senior Systems Engineer at NVIDIA, you'll join a group of hardworking engineers to develop and architect innovative Memory Solution for Tegra SoCs. In this position, you'll make a real impact in a multifaceted, technology-focused company. You will work with memory controller/PHY and Platform / System architect, Firmware, SI/PI, Memory suppliers to design and architect cutting edge, high speed and lower power memory technology for NVIDIA CPUs and SOCs. What You Will Be Doing: Analyze future DDR/LPDDR/HBM technologies to determine optimum performance, power, function and RAS in memory for Next generation SOC and Systems. Collaborate with ASIC Architects, Designers, Software and Firmware SW/FW teams to drive memory technology and associated requirements for memory controllers. Define Memory module, Package, and PCB layouts appropriate to the system workloads Debug and bring up memory evaluation / validation and failure issues on memory technology. Collaborate with DRAM suppliers and industry partners on to develop memory and memory related component technology. What We need to see: Bachelor's degree or master’s degree in Electrical Engineering, Computer Engineering (CE), or a related field (or equivalent experience) 10 years of proven track record in DRAM design, module design, or memory sub system design. Deep understanding and strong fundamental of memory design, features, ECC algorithm, SI and PI (Training algorithm) in DDR, LPDDR, and HBM. Strong understanding of memory sub system level interaction with Cache, Memory controller and PHY. Experience in the design, bring-up and validation for memory failure analysis Experience with Python, C/C

About the Team OpenAI’s Industrial Compute team is building and productizing infrastructure capabilities that help organizations deploy and operate advanced AI systems at scale. The team works across AI hardware, systems engineering, physical infrastructure, and customer delivery to turn emerging technologies into reliable, repeatable infrastructure solutions. Our work sits at the intersection of technical strategy, product development, engineering, and deployment. We partner closely with customers and internal engineering teams to solve complex infrastructure challenges spanning compute, power, cooling, controls, and facility efficiency. About the Role We are seeking a senior, hands-on Data Center Infrastructure Architect to develop and optimize the physical infrastructure required for large-scale AI deployments. This is a broad technical role spanning data center architecture, electrical and mechanical systems, high-density compute, controls, telemetry, and digital modeling. You will use simulation, operational data, and digital-twin approaches to evaluate infrastructure designs, identify system-level constraints, and improve efficiency, reliability, cost, and speed of deployment. The ideal candidate can move fluidly between first-principles analysis, facility and equipment design, computational modeling, engineering review, and real-world implementation. You should be comfortable working across disciplines rather than operating solely within electrical, mechanical, or software boundaries. Key Responsibilities Define system-level architectures for high-density AI data centers across power, cooling, IT equipment, controls, and facility infrastructure. Develop digital twins and other computational models that represent the behavior of data center systems under changing workloads, environmental conditions, equipment configurations, and failure scenarios. Use design and operational data to identify constraints, improve PUE and related efficiency metrics, and optimize

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an Intern Product Yield Enhancement (PYE) Engineer at Micron Technology Inc., you will assist in taking next generation DRAM devices from design to mass production! PYE Engineers are crucial partners between Research and Development, Manufacturing, Product Engineering and Global Quality teams. Our goal is to offer hands-on and substantial engineering projects that allow interns to gain valuable experience with memory systems and the product life cycle while adding impact to Micron’s business. Our intern programs help prepare engineers for future roles and offer an extraordinary experience that supplements your academic experience! The PYE Engineering role is critical to Micron as it serves the company's charter to be the most cost-effective producer of DRAM memory while delivering the quality and reliability that customers expect from the Micron brand. This position is for a 3-month internship. Responsibilities: Your job duties will include detailed DRAM electrical and physical failure analysis. Identify defects introduced by the semiconductor fabrication process. You will data mine using statistical analysis, AI assisted engineering tools, and automation workflows. Find the root cause of failure mechanisms, communicating results with Management, Product, Process and Test Engineering teams. Complete 3-month internship. Minimum Qualifications: Must be pursuing a minimum of a bachelor’s degree in Electrical Engineering, Computer Engineering,