Engineering Compensation Partner Jobs

Engineer, APTD CEM – Advanced Packaging Wafer Level Technology Engineering — Fab 10A, Singapore. Apply via Workday.

Senior/Staff/Principal Engineer, HIG-HBM Product System & Engineering (Media Health Reliability Coding) — Fab 10A, Singapore. Apply via Workday.

Engineer, HIG-HBM Product System & Engineering (Media Health Reliability) — Fab 10A, Singapore. Apply via Workday.

Engineer, HIG-HBM Product System & Engineering (Media Health Reliability Coding) — Fab 10A, Singapore. Apply via Workday.

Engineer, HIG-HBM Product System & Engineering (Media Health Manufacturing) — Fab 10A, Singapore. Apply via Workday.

Engineer, Process Integration PDE (Package Development Engineering) — MSB, Singapore. Apply via Workday.

Engineer, Yield Enhancement PDE (Package Development Engineering) — MSB, Singapore. Apply via Workday.

Sr Engineer, Advanced Packaging Design Enablement Engineering (APDEE) — Hyderabad - Phoenix Aquila, India. Apply via Workday.

Senior/Staff/Principal Engineer, HIG-HBM Product System & Engineering (Media Health Reliability) — Fab 10A, Singapore. Apply via Workday.

Principal/Staff ML/AI Engineer, Product Engineering, STPG — Fab 10N/X, Singapore. Apply via Workday.

Staff/ Principal Engineer, OCT MTE Material Engineering — 2 Locations. Apply via Workday.

Sr Engineer, Advanced Packaging Design Enablement Engineering (APDEE) — Hyderabad - Phoenix Aquila, India. Apply via Workday.

Engineer, HIG-HBM Product & System Engineering (Media Health Manufacturing) — Fab 10A, Singapore. Apply via Workday.

Senior/Staff Engineer, Frontend Labor Productivity & Data Engineering — Hiroshima - Fab 15, Japan. Apply via Workday.

Senior/Staff Engineer, HIG-HBM Product Engineering (Media Health Manufacturing) — Fab 10A, Singapore. Apply via Workday.