Fab Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. About Fab 4 Wet Process Operations Fab 4 Wet Process Operations supports the safe, efficient, and high-quality movement of wafers through the Wet Process area. Our team works closely with peer manufacturing areas, Process teams, Equipment teams, and many other organizations to supervise fab performance, manage production risks, optimize cycle time, and drive execution against move targets. Through real-time decision making and continuous improvement, we help ensure the fab meets customer and business commitments. Position Summary The Shift Manufacturing Engineer (ME) is responsible for driving daily fab performance within the assigned area. This role partners closely with Manufacturing Technicians, Shift Lead Engineers, Process Engineers, and Operations teams to achieve wafer move targets, optimize cycle time, respond to quality concerns, and maintain efficient workflow through the manufacturing line. Working on a 12-hour compressed workweek schedule, this position provides real-time operational leadership by identifying manufacturing constraints, supervising material flow, supporting production decisions, and driving actions needed to meet weekly wafer movement and wafer-on-hand objectives. Responsibilities: Supervise wafer movement performance by DID, process step, and operational targets. Identify manufacturing gaps, WIP imbalances, bottlenecks, and workflow disruptions. Develop and implement plans to close gaps and achieve weekly move and wafer-on-hand commitments.</l

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 擔任 Hook-up 專案技術領導者&#xff0c;整合設計、施工、品質與營運需求&#xff0c;確保機台導入及量產所需公用系統按時交付 主要職責 負責半導體廠房機台 Hook-up&#xff08;二次配&#xff09;工程規劃、執行與進度管理。 統籌機台 Move-in、Pre Hook-up、Hook-up、Turn-on 等各階段工作。 協調廠務&#xff08;FAC&#xff09;、設備&#xff08;ME&#xff09;、工務&#xff08;Construction&#xff09;、IE、EHS 及承攬商等跨部門作業。 審查 Hook-up 設計圖面、BIM 模型及施工方案&#xff0c;確保符合安全、品質及產能需求。 管理施工進度、施工品質、成本及風險議題&#xff0c;確保關鍵里程碑達成。 主導現場施工問題排除、介面整合及資源協調。 推動 QA/QC 驗證、測試驗收及系統交付作業。 建立並持續優化 Hook-up 標準流程、施工規範及教育訓練制度。 人工智慧與數位化能力 - 具備運用人工智慧工具、數據分析和數位技術提升專案規劃、工程執行、風險管理和營運效率的能力。 - 具備應用人工智慧輔助解決方案進行設計審查、專案控制、工作流程自動化、知識管理和持續改進的經驗。 - 致力於推動數位轉型&#xff0c;並促進工程和施工團隊採用創新技術。 Hook-up Senior Engineer / Technical Lead Position Summary Serve as the technical lead for Hook-up projects, integrating design, construction, quality, and operational requirements to ensure the timely delivery of utility systems required for tool installation and volume manufacturing. Key Responsibilities Lead the planning, execution, and schedule management of semiconductor fab Hook-up (secondary distribution) projects. Coordinate all phases of tool installation, including Move-in, Pre-Hook-up, Hook-up, and Turn-on activities. Collaborate closely with Facilities (FAC), Manufacturing Engineering (ME), Construction, Industrial Engineering (IE), Environmental Health & Safety (EHS), and contractors to ensure seamless project execution. Rev

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Would you like to work in one of the most complex Fab environments in the world? As an industrial engineering intern in our research and development factory you will work on projects that further optimize our very automated factory. This role will provide exposure to larger data sets than you have ever worked with and will challenge your data management skills. Not only will this role significantly grow your skills but will also provide exceptional value to the organization on a real issue in our factory! Responsibilities: Identify key performance indicators for R&D program success. Use large data sources to extract and analyze planning data. Build reporting in Tableau and other systems to convey data to program teams. Construct infographics that display key information in easy-to-understand formats. Leveraging AI tools and find new ways to apply AI in the workplace. Minimum Qualifications: Working towards completion of a Bachelor’s or Master’s degree in the following areas: industrial engineering, manufacturing engineering, supply chain, Operations or other related discipline with expected graduation after this internship timeframe Must be a current student, and cannot graduate prior to September 2027. Ability to code in SQL, Python or similar to execute data extraction. Effective with Excel, Tableau or other data management and visualization software. Preferred Qualifications: Skille

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s DRAM Product Architecture Group partners across fabs, test, module, and system teams worldwide to deliver high-performance memory products. We work across geographies and functions to solve complex technical challenges, drive product innovation, and enable industry-leading DRAM solutions. Our team values collaboration, continuous learning, and making a measurable impact through engineering excellence. As a New College Graduate DRAM Yield & Quality Engineer, you will play a key role in monitoring and improving the health of Micron’s server DRAM products. Working with experienced engineers and cross-functional teams around the globe, you will analyze product and manufacturing data, investigate technical issues, and contribute to strategies that improve yield, quality, and performance throughout the product lifecycle. This is a highly visible role with direct impact on customer success and product reliability. Responsibilities Analyze silicon parametric, test, and manufacturing data to identify trends, resolve product issues, and support root cause investigations. Contribute to yield and quality improvement initiatives across new product introduction (NPI), qualification, ramp, and high-volume manufacturing. Collaborate with fab, test, module, quality, and operations teams to drive execution of product health objectives. Develop and maintain automation solutions to improve engineering efficiency, data analysis, and reporting. Apply AI, Agentic AI, and Generative AI tools to en

Job Details: Job Description: The Role and Impact: We are seeking a Manufacturing Quality and Reliability Engineer to join the Foundry QnR team at our Penang site, supporting Intel's advanced packaging programs (EMIB, Foveros). This role spans silicon processing and wafer-level assembly (WLA) flows, and key interfaces with packaging substrates and 2.5D EMIB technology. You will help ensure that products and processes meet rigorous quality and reliability standards from wafer fabrication through packaging and assembly. The position directly influences manufacturing performance, yield, reliability, and customer satisfaction by driving robust quality control, disciplined excursion management, and continuous process improvement. You will also have the opportunity to represent Quality and Reliability in development forums, Silicon and Advanced Packaging factory operations, and Substrate suppliers. Key Responsibilities Apply Advanced Packaging expertise to assess inline process health, excursion impact, yield risk, defect mechanisms, and downstream packaging implications. Collaborate with cross-functional teams to drive effective root cause analysis, systemic corrective and prevention actions using 8D and related problem-solving methodologies. Partner with fab manufacturing, substrates assembly, test, process engineering, and quality teams to strengthen early excursion detection, process controls, in-line screens, and outgoing quality. Drive quality control improvements devising incoming/ outgoing quality controls, using statistical process control, defect pareto analysis, control plans, audit learnings, and excursion prevention indicators across fab, substrate manufacturing, and assembly manufacturing steps. Support manufacturing excursion management, including MRB facilitation, cont

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans the entire quantum compute stack while harnessing the power of Intel's 18A process and design infrastructure. We are seeking an exceptional Quantum Design Engineer to join our pioneering quantum computing team. In this position, you will be joining a team of incredibly talented engineers focused on the challenging task of scaling our quantum computing chips to millions of qubits. Here you will be involved in all aspects of the qubit chip process from initial conception through Process-Design-Kit definition, design execution and tapeout, along with ensuring silicon runs smoothly in fab and final system integration. You'll work closely not only with our qubit, control, system integration, and software/algorithms teams, but also with teams in Foundry lithography, process and design. You'll be working at the intersection of cutting-edge semiconductor technology and quantum physics, creating solutions that push the boundaries of what's possible in computing. Ready to help build the future of quantum computing? Apply now and be part of this extraordinary journey Key Responsibilities • Work alongside lithography, process integration, measurement, and PDK engineers to establish qubit processes and design rules • Architect qubit and readout element standard cell design and autom

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are transforming how the world uses information to enrich life for all. Within our DRAM organization, we develop next-generation memory technologies in an industry-leading 300mm R&D environment, bringing together expertise across process development, design, modeling, characterization, reliability, and manufacturing. Our team works collaboratively to advance memory scaling while improving performance and manufacturability. As a Process Integration Engineer, you will help enable state-of-the-art DRAM technologies and solve complex integration, device, yield, and circuit challenges. You will work closely with cross-functional engineering teams to optimize process flows, improve yield and margin, and translate technical data into solutions that enable future generations of memory technology. Responsibilities: Lead technology integration activities to enable manufacturability of advanced DRAM technologies Partner with process development, product engineering, design, yield, mask, and probe teams to resolve yield, performance, reliability, and margin challenges Design and implement R&D fab experiments and optimize process flows to meet product and technology requirements Analyze inline, defect, parametric

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Metrology Overlay Process Development Engineer you will be primarily responsible for starting up, developing, and optimizing the overlay metrology processes used for DRAM photolithography process flows. Overlay metrology is a critical need within the semiconductor industry, and in this position your responsibilities will include, but are not limited to: · Driving the understanding of new metrology technology and measurement techniques to ensure that our overlay measurement capabilities meet the precision, accuracy, and throughput required to meet our device overlay roadmaps · Partnering with metrology equipment vendors on continuous improvement of software/hardware and development of overlay techniques to support lithography process characterization, process optimization, and process control · Optimizing and maintaining the calibration of metrology systems that support our technology development · Working closely with process development and process integration engineers to optimize measurements for multiple device process flows and layer stacks · Developing applications on next generation processes and technologies within Fab 4 and qualification for tech

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job duties Include • Interpreting contract documents and specifications • Interpreting control and P & ID drawings • Ability to prepare and update project budgets • Prepare, review and finalize cost estimates • Ability to produce, update, and manage project schedules • Review instrumentation, control and electrical designs • Oversee design, engineering and manufacturing team members • Interaction with other engineering firms, contractors and vendors Scope summary, clarifications, and exclusions • Experience in managing I&C projects to a successful conclusion • Familiarity with electrical schematics and control diagrams • Familiarity with process controls and strategy • Ability to work well with others and lead by example • Proficient in Word, Excel, and Adobe Acrobat • Good communication skills with clients and employees Typical responsibilities include, but are not limited to: Safety & Quality: • Ensuring compliance with laws, regulations, and standard processes • Leading quality improvement initiatives in area of expertise to reduce Fab impacts,

Experienced Low Observables Mission Systems Integration Engineer Company: The Boeing Company We are seeking a Low Observables (LO) Design & Integration Engineer to support design and analysis activities for stealth/low-signature systems. The engineer will perform LO material and structure design, electromagnetic analysis, integration and test support, data processing, and technical reporting. The role requires practical experience with LO materials and technologies, solid electromagnetics knowledge, and hands-on expertise with computational electromagnetic (CEM) solvers used to design and optimize LO solutions. Key Responsibilities Perform design and analysis tasks for LO materials, coatings, treatments, and structural treatments to minimize radar, infrared, and other signatures. Develop and validate LO integration concepts for aircraft/vehicle structures and subsystems, including manufacturability and testability considerations. Use CEM solvers to model, simulate, and optimize LO components and systems (e.g., surface treatments, RAM, apertures, seams, RAM-structure interactions). Perform sensitivity studies and trade-offs across materials, geometry, and integration approaches to meet system-level LO requirements. Process and analyze measured test data from laboratory and flight/field tests; compare test results to simulation and iterate designs. Produce technical documentation: detailed analysis reports, integration guidance, test plans, and summaries suitable for engineering and program management audiences. Communicate technical results and recommendations to multidisciplinary teams and support design reviews. Support manufacturing and test engineering to ensure LO design intent is preserved through fab

NVIDIA has transformed computer graphics, PC gaming, and accelerated computing for more than 25 years through exceptional technology and the people who build it. In semiconductor manufacturing, our role is to enable the ecosystem, not compete within it. We partner with fabs, equipment manufacturers, and software providers to make inspection, metrology, and manufacturing intelligence dramatically faster on the NVIDIA platform. Our team builds the software that makes this possible: models, adaptation and evaluation workflows, and deployable inference capabilities that partners integrate into their own tools. We work in environments where labeled data is limited and proprietary, distributions shift across tools and fabs, production budgets are tight, and software must operate inside air-gapped facilities. We’re seeking a Principal Systems Software Engineer for Semiconductor Inspection in Santa Clara. This is a hands-on architect role: you will define the approach, build it, evaluate it, and demonstrate the results. You will work across computer vision, time-series modeling, multimodal AI, anomaly detection, model adaptation, evaluation, and production inference. Success means technology that a fab or equipment vendor can integrate, operate, and trust—not only a successful internal demonstration. What you’ll be doing: Define and prototype AI system architectures spanning optical and e-beam inspection, wafer and mask inspection, metrology, defect review, equipment signals, and process data. Advance world foundation model capabilities for semiconductor manufacturing, including vision, time-series and multimodal representation learning, model adaptation, domain transfer, and data-scarce defect understanding. Develop workflows for defect detection, classification, localization, segmentation, nuisance filtering, ADC, AD

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Position Overview: As a Staff/Principal Equipment Engineer within PROCT ADT, you will provide technical leadership to improve equipment performance, capability, and global manufacturing outcomes. You will lead complex, multi-site initiatives to resolve equipment challenges, enable technology node readiness, and drive yield and defectivity improvements. This role requires deep expertise, strong ownership, and the ability to influence across teams and suppliers to deliver measurable impact in cost, performance, and scalability. Responsibilities Lead global ownership of equipment performance across toolsets, driving improvements in stability, availability, matching, and efficiency. Direct complex, multi-fab root cause analysis for equipment-driven yield, defectivity, and reliability issues using data-driven and physics-based approaches. Provide technical leadership in tool hardware and chamber behavior to expand process capability and improve performance limits. Partner with Technology Development, integration, and process teams to enable node readiness, volume ramp, and disciplined change control. Influence equipment supplier strategy by leading technical engagements, driving design improvements, and aligning roadmaps to business needs. Drive global standardization through development, validation, and deployment of Best Known Methods (BKMs) across sites. Lead initiatives to improve cost of ownership, reduce variation,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities include, but not limited to: ​ Key Responsibilities Develop systems to optimize operational performance across manufacturing platforms. Design, build, and deploy predictive models related to equipment utilization and performance enhancement. Analyze manufacturing data to identify bottlenecks and optimization opportunities for both short-term and long-term planning. Build and deploy LLM-based AI solutions to support fab operations, enabling smarter decision-making and improved operational efficiency. Collaborate closely with PMs, IT, and Core AI teams to drive cross-functional AI initiatives. Build interactive dashboards and visualizations to support data-driven decision-making. Work within the GCP environment for model training, deployment, and maintenance. Explore and implement MLOps, AutoML, and other advanced techniques to enhance model performance and reliability. Required Qualifications Master’s degree or above in Computer Science, Statistics, Engineering, or related fields 3&#43; years of experience in data science Proficient in Python, SQL, TensorFlow or other deep learning frameworks Skilled in data visualization tools Strong communication skills and experience in cross-functional collaboration </li

Job Details: Job Description: The Role and Impact As a Product Failure Analysis Engineer at Intel, you will play a vital role in identifying and resolving product issues to enhance performance, quality, and reliability. You will conduct comprehensive failure analyses and collaborate with cross-functional teams to develop innovative solutions that improve product yield and reliability. Through your efforts, you will directly impact Intel's ability to deliver world-class technologies. Business group The role is part of Intel Corporation's Product Quality and Reliability organization, which focuses on ensuring Intel's products meet the highest standards of quality and reliability. This group supports Intel's mission by driving improvements in product performance, enhancing manufacturing processes, and advancing technology innovation. Key Responsibilities Perform failure analysis and root cause investigation on Intel products, including CPUs, SoCs, and AI interface graphic platforms. Conduct failure analyses to identify defects and recommend corrective actions to design, fab, assembly, and test teams to improve product reliability. Develop and refine failure analysis methodologies, tools, and processes to enhance efficiency and accuracy. Collaborate with cross-functional teams to implement process improvements and innovative solutions for future technologies. Maintain and optimize Failure Mode and Effects Analysis (FMEA) and control plans throughout product lifecycles. Support new product launches, enabling technology transfers and toolset improvements across Intel sites. Qualifications: Minimum Qualifications Bachelor's or Mas

Job Details: Job Description: As a Material Analysis (MA) Technician, you will be part of a Technology Development (TD) and High-Volume Manufacturing (HVM) lab responsible for performing material analysis and failure analysis in support of Intel's silicon process development and high-volume production. You will work on developing imaging, composition analysis and sample preparation techniques, and best-known methods (BKMs) to improve lab analysis quality, efficiency and output. You will directly interface with TD and HVM fab customers and quality/reliability engineers to develop solutions to problems by utilizing lab capabilities. The scope may include wafer and unit level, front-end modules and back-end/far back-end modules. Responsibilities may include but not be limited to: • Conducting hands-on analysis by effectively utilizing lab techniques, from sample prep micro-cleaver, ion mill etcher, mechanical polish to SEM/EDX, Dual beam FIB, TEM techniques to characterize Si fabricated structures at nanometer scales and integrated circuit device to improve process, performance and reliability; and to identify physical failure mode toward the root-cause identification. • Conducting hands-on data collection with various lab equipment’s, and assisting engineers to implement materials characterization techniques to determine fundamental thin film material structure/properties and to collaborate with process development engineers across functional areas and organizations to improve process performance and reliability. • Supporting and sustaining lab equipment. Ensuring that lab analytical capabilities needed to support advanced transistor and interconnect technology and/or product development are in place. Cooperating with other lab areas beyond local MA/FA (Failure Analysis) labs to achieve