Hardware Operations Engineer Jobs

Job Title AI Senior Systems Engineer (AI for RAMS & Systems Engineering) Job Description As an AI Senior Systems Engineer, you will help shape the future of Systems Engineering at Philips by driving the application of Artificial Intelligence within Systems Engineering and Reliability, Availability, Maintainability and Safety Engineering (RAMS) practices. You will identify opportunities where AI can enhance engineering activities, improve engineering productivity, and increase the quality, consistency, and traceability of engineering deliverables throughout the product development lifecycle. Acting as a thought leader and trusted advisor, you will help engineering teams understand, adopt, and effectively apply AI technologies within their daily engineering work. Working closely with systems engineers, RAMS engineers, architects, software teams, and AI specialists, you will bridge the gap between engineering challenges and emerging AI capabilities. You will contribute to the evolution of engineering methodologies, tools, and best practices that enable the next generation of AI-enabled Systems Engineering and RAMS Engineering at Philips. Your role: Drive the adoption of AI within Systems Engineering and RAMS practices across Philips. Identify, develop, and scale AI use cases for requirements engineering, system architecture, modelling, verification, validation, traceability, and engineering knowledge management. Identify, develop, and scale AI use cases for RAMS engineering like FMEA, data analysis, HALT/ALT, Modelling Simulation & Analysis, for Hardware and Software Support engineering teams in evaluating and implementing AI-enabled engineering workflows, methods, and tools. Coach and educate Systems Engineers, RAMS Engineers, Architects, and technical leaders on the opportunities, limitatio

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Our team is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. Position Overview: As a Staff Process Engineer in Advanced Packaging CMP team, you will be primarily responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology. This position requires communication and collaboration with associates both within the region and internationally. Strict adherence to Micron Intellectual Property Protection policy is vital. This role will also extensively collaborate with vendors to develop processes that meet integration requirements. Responsibilities: Perform fundamental research, consumables development, and hardware evaluation, as well as test processes for novel applications Initiate and manage experiments to widen process margins and evaluate man

JLL empowers you to shape a brighter way . Our people at JLL are shaping the future of real estate for a better world by combining world class services, advisory and technology for our clients. We are committed to hiring the best, most talented people and empowering them to thrive, grow meaningful careers and to find a place where they belong. Whether you’ve got deep experience in commercial real estate, skilled trades or technology, or you’re looking to apply your relevant experience to a new industry, join our team as we help shape a brighter way forward. Key Responsibilities: Provide support in producing tender documentation packages including plans, details, schedules and specifications Take site measurements or survey Client's existing furniture inventory, if required Provide support in producing materials and finishes scheme and documentation Prepare finishes, furniture and door hardware schedules Upkeep and maintenance of library facility Assist Interior Designers and Senior Interior Designers in producing quality visuals for presentation boards Requirements: Currently pursuing a Diploma in Interior Design, Architecture or related field Proficiency in AutoCAD and SketchUp Familiarity with Revit is a plus point

Job Details: Job Description: Join Intel as a Module Development Engineer, where you will play a critical role in driving technology development and enabling advanced manufacturing solutions. In this position, you will lead the design and optimization of complex manufacturing processes, including material selection and equipment development, to enable innovative product designs and high-volume production. Your work will directly impact Intel's ability to maintain its leadership in cutting-edge semiconductor technologies. Business group As part of Intel Foundry, you will join a dynamic team focused on advancing semiconductor manufacturing technologies and capabilities. The group's mission includes enabling high-volume production through innovative process integration, equipment solutions, and technology advancements. Collaborating across Intel's global network, you will contribute to driving Intel's success in delivering transformative technologies to its customers. Key Responsibilities Lead the development of manufacturing processes that include MHS equipment development, parameter optimization, and equipment metrology. Perform pathfinding activities to enable emerging device architectures and support process and hardware development. Develop roadmaps for future technologies that align with Intel's leadership in semiconductor innovation. Collaborate with equipment and materials suppliers to implement solutions that meet manufacturing and technology needs. Recommend and execute modifications to equipment and processes to improve efficiency and optimize production output. Stay informed about industry trends in materials and manufacturing processes, identifying opportunities for innovation. Behavioral Traits Strong p

Job Details: Job Description: Join an enthusiastic team of engineers in Intel's Networking Solutions Group (NSG) focused on enabling next generation of programmable Infrastructure Processing Units (IPUs) with our lead customers as part of the Customer Experience Support (CES) organization. Intel brings decades of leadership in networking, virtualization, packet processing, storage, and security to a new class of IPU products that accelerate host networking functions and support emerging use cases such as security, virtualization, storage, load balancing, and data path optimization. Working closely with major cloud service providers and Intel development teams, you will help deliver customized IPU based solutions that enhance isolation, security, performance, storage and system management for our customers. A big part of the day-to-day job is to help customers manage feature request processes, enable solutions, and debug issues. Projects and responsibilities include but are not limited to: • Gain our customers' trust, understand their needs, and build POCs to meet them. Work closely with internal and external partners to understand use cases and requirements. • Be the go-to technical resource for customers building complex Datacenters, AI infrastructure as well as helping them understand performance characteristics for solutions. • Prepare and deliver technical content to customers including presentations, workshops, etc. • Contribute across the full IPU lifecycle, including board and platform bring up, low-level device initialization, OS driver and kernel configuration, system management, feature enablement, use case testing, debugging, and verification. • Defines systems implementation and integration solutions and plans to ensure optimum performance and reliability across hardware, firmware and software w

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. This Notice is provided as a result of the filing of applications for permanent alien labor certification for the positions noted below. Any person may provide documentary evidence bearing on an application to the Certifying Officer, U.S. Department of Labor, Employment and Training Administration, Office of Foreign Labor Certification, 200 Constitution Avenue NW, Room N–5311, Washington, DC 20210. Employer: Micron Technology, Inc. Job Title: Firmware Engineer Job Requisition: JR42883 Job Location: Longmont, Colorado Job Type: Full Time Rate of Pay: $100,000 to $254,000 Duties: Develop high-performance controller firmware for innovative volatile and non-volatile memory systems. Assist in evaluating, designing, building, bench testing, debugging, and failure analyzing firmware for new high-performance memory controllers and Solid State Drives that will increase performance, while reducing power, latency and SoC (System on Chip) complexity for the target markets. Work closely with system test engineers, system failure analysis engineers, firmware engineers, firmware test engineers, system hardware design engineers, product engineers, memory design engineers, firmware tools developers, and production engineers to solve cross-functional product development issues. Validate customer requirements and perform failure analysis on FW related issues. Develop structure

Hydraulic Systems Engineer (Associate, Experienced, or Lead) Company: The Boeing Company Boeing Defense, Space & Security (BDS) Mobility, Surveillance and Bombers (MS&B) B-52 Commercial Engine Replacement Program (CERP ) is seeking a Hydraulic Systems Engineer (Associate, Experienced or Senior) to join the Systems Engineering, Integration, and Test (SEIT) team . The selected candidate will drive engineering excellence on this complex development program in Oklahoma City, OK . Position Responsibilities: Operate as the team’s Subject Matter Expert on the B-52 Hydraulics Subsystem. Lead systems and multifunctional engineering efforts for the SEIT IPT, ensuring adherence to technical quality standards throughout the product lifecycle Collaborate with cross-functional teams, including design, manufacturing, and quality assurance, to define and implement systems engineering processes and best practices Conduct trade studies and risk assessments to inform design decisions and optimize system performance, cost, and schedule Develop and maintain system requirements, interface control documents, and verification and validation plans to ensure compliance with customer specifications and regulatory standards Oversee the integration of hardware and software components in System Integration Labs in Oklahoma City Oversee the verification and test of hardware and software components supporting the modification in San Antonio

Job Details: Job Description: Intel is shaping the future of technology to help create a better future for the entire world. Our work in pushing forward fields like AI, analytics, and cloud-to-edge technology is at the heart of countless innovations. With a career at Intel, you'll have the opportunity to use technology to power major breakthroughs and create enhancements that improve our everyday quality of life. Join us and help make the future more wonderful for everyone. Want to learn more? Visit our YouTube Channel or the link below. Life at Intel The Role and Impact As a SoC Power Thermal Performance Validation and Optimization Engineer, you will play an essential role in ensuring Intel's products achieve optimal power, thermal, and performance benchmarks at the system-on-chip (SoC) level. In this position, you will develop and execute validation methodologies, optimize hardware/software solutions, and perform SoC-level debugging to address power, thermal, and performance challenges. Your contribution will directly impact Intel's ability to deliver competitive, high-performing products to market. Business Group This role is part of Intel's Data Center Group (DCG), which focuses on designing innovative solutions to power the next generation of computing platforms for data centers. As a member of the PTP PreSi Correlation Solution team, you will contribute to shaping the development and validation processes for cutting-edge technologies, ensuring Intel meets and exceeds industry standards for performance and efficiency. Key Responsibilities: Develop and execute SoC-level power, thermal, and performance validation and

Software Chief Architect - AvionX Company: The Boeing Company The Boeing Company is looking for a Software Chief Architect - AvionX to join the AvionX Software team located in Long Beach, California . This position will focus on leading the AvionX Software Engineering organization. The Chief Software Architect for AvionX Software Vertical is the highest software technical authority across airborne software programs from architecture definition through certification closure. This role owns the coherence, integrity, and DO-178C/LOR compliance posture of software architectures across commercial and defense platforms, bridging software engineering discipline with system-level safety objectives and regulatory strategy. This role is also responsible to work with Enterprise Software Engineering Organizations to enable SW engineering practices and processes, such as Fabric, Design Practices etc. to be implemented across all AvionX Programs. Position Responsibilities: Advises management on a wide range of topics related to the embedded software engineering environment Consults on code for embedded systems software to run on specific specialized hardware Directs testing and debugging of software for embedded devices and systems. Influences current and emerging technologies, tools, frameworks, and changes in regulations relevant to software development and hardware technologies Directs the design, development, test, debugging and maintenance of software that is integrated into embedded devices and systems and meets industry, customer, safety and regulation standards Directs the review, analyses, and translation of customer requirements into the design of softwar

Define the physical limits of what a chip can do, then break them! NVIDIA's Silicon Co-Design Group sits at the crossroads of architecture, silicon, systems, and manufacturing, where first principles thinking translates directly into product outcomes at scale. As GPU power density and thermal limits approach physical boundaries, the gap between system architecture needs and manufacturable, testable capabilities widens with every generation, and this role exists to close it. You wouldn't be maintaining existing solutions, you'd be identifying where physical constraints will erode NVIDIA's competitive edge before anyone else sees it coming, then building the cross-domain responses that ensure the next generation leapfrogs those limits entirely. The problems here don't have known answers yet: Every generation of NVIDIA silicon pushes closer to the limits of physics. The Co-Design Architect role isn't about optimizing within known bounds; it's about redrawing those bounds entirely. If you want your work to shape what's physically possible in the world's most demanding computing products, this is where that work happens. What you'll be doing: Power, Thermal & Packaging Limits Analysis: Gather and analyze the hard constraints of packaging, power delivery, and thermal dissipation against roadmap demands, predicting when those constraints will reduce competitiveness and acting before they do. Cross-Domain Solution Development: Develop solutions that span silicon features, packaging innovation, firmware and hardware co-design, and DFX updates, ensuring future products are not only performant but testable to the highest quality and reliability standards. Packaging Technology Evaluation: Assess emerging packaging technologies for their voltage/frequency, noise, reliability, and testability implications, determining which are worth adopting an

NVIDIA's accelerated computing platforms move data at speeds that push the limits of what silicon and physics allow. Whether a high-speed interface trains reliably, maintains accurate margins, and survives every platform topology it will ever see is a question we answer ourselves. This role does that work. The Silicon Co-Design Group leads the boundary between what was designed and what was built. When a GPU, CPU, or SoC ships with interfaces that work at scale, this team is the reason. Most engineers debug within a layer. You will own the full stack. When an interface fails to train, the link margin is unexpectedly tight, or a customer reports a critical silicon issue, you trace the problem through protocol behavior, signal integrity, firmware, platform topology, and silicon marginalities. You then confirm that the fix works. Your methodology shapes how NVIDIA validates high-speed interfaces across generations. Your decisions affect yield, production ramp, and field quality. This is not a coordination role. The engineers who do it well hold protocol depth and system breadth simultaneously, never lose the thread across hardware, firmware, and software, and have the judgment to know when to go deeper and when to act. They are rare. Should that describe you, read on. What you'll be doing: Own post-silicon bring-up, characterization, validation, and debug of PCIe, NVLink, C2C, and other HSIO interfaces across NVIDIA GPUs, CPUs, and SoCs from first power-on through production readiness. Close the hardest failures. Drive root cause across protocol behavior, signal integrity, firmware and driver interactions, platform topology, and silicon marginalities and own every fix through to confirmation. Define validation strategy. Set test coverage, debug priorities, margining methodology, and stress criteria f

Systems Technology Inc. (STI) is a private, 100% employee-owned (ESOP) engineering consulting and product development company with a 60+ year legacy of delivering safety critical solutions to government and commercial customers. We combine the agility and culture of a startup with the stability and credibility of a longstanding aerospace innovator. Our growth plans are ambitious, and every employee plays a direct role in shaping our future. At STI, we look for true business partners—people who value transparency, collaboration, technical excellence, ownership, and accountability. If you enjoy solving complex, real - world problems and want your work to have visible impact, you will thrive here. What You'll Do: We are seeking a Business Development – UAS leader to drive growth specifically in unmanned aircraft systems (UAS) with a focus on flight control systems, autopilots, guidance, navigation, and autonomy-enabled products . This role is not a general aerospace business development position—it is tightly focused on building funded development programs and scalable commercial products around STI’s core flight control and autonomy capabilities. We expect this role to include a significant amount of government relations. Candidates with a strong background in government interactions are s trongly preferred. Success in this role is defined by the ability to convert early technical engagements and SBIR-funded efforts into sustained government and commercial programs , including Phase III contracts, follow-on development, and productized offerings. Key Responsibilities Drive new UAS business centered on flight control, autopilot, and autonomy software and hardware development . Lead the transition of existing SBIR/STTR-funded autonomy and flight control technologies into Phase III and non-SBIR contract vehicles , including sole-source awards, IDIQs, OTAs, BOAs, and FAR-based contracts. Identify and pursue commerci

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. As a PCB Power Design Engineer, you will design and optimize power distribution systems for Tenstorrent’s next-generation AI accelerator cards, balancing performance, area, cost, and reliability. You will contribute across the full power design lifecycle, from component selection and simulation through board bring-up, validation, debugging, and production readiness. Working closely with hardware, firmware/software, thermal, mechanical, and validation teams, you will help deliver robust power architectures for high-performance AI systems. This role is hybrid, based out of Toronto, Canada. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are An electrical engineer with experience designing, analyzing, and debugging power distribution systems for high-performance or high-power products. A hands-on engineer who enjoys moving from schematics and simulations into lab bring-up, testing, troubleshooting, and design validation. A systems-oriented collaborator who can work effectively across hardware design, firmware/software, thermal, mechanical, and validation teams. A detail-oriented problem solver who balances electrical performance, power integr

About Ubiquiti At Ubiquiti Inc., we create technology platforms for Businesses, Smart Homes, and Internet Service Providers, driven by our goal to connect everyone, everywhere. To date, Ubiquiti has shipped over 100 million devices worldwide, from ISP networking products to next generation of IT solutions. Our growth is made possible by the dedicated team of hundreds behind the scenes. From software developers and product managers to designers and strategists, Team UI is driven to achieve our common goal: Rethinking IT. At Ubiquiti, you’ll heighten your potential and broaden your horizons - all while shaping the future of connectivity. Join forces with us on our mission to build a better IT industry. We are currently looking for a highly skilled Embedded Software Engineer to our team in Stockholm or Malmö, Sweden. Please note that applicants must live in Sweden and hold a valid work permit at the time of application to be considered for this role. Responsibilities: Design, implement, and debug embedded firmware for 802.15.4 Thread-based devices (border routers, RCPs, sleepy/end devices) running on an RTOS and embedded Linux Integrate and maintain the OpenThread stack and Matter commissioning/data-model layers across the product line Work closely with hardware engineers on SoC/MCU bring-up and debug radio timing, RF, and low-power issues at the driver level Implement and troubleshoot Thread border routing, SRP, and network commissioning/joining flows, including bridging to Wi-Fi/Ethernet backbones Diagnose firmware-level issues using JTAG/SWD debuggers, logic analyzers, and protocol sniffers/packet captures Write and maintain unit and integration tests; participate in code review Contribute to OTA update pipelines and manufacturing/production test tooling Requirements: Strong proficiency in C++ (99 % code base) and C for embedded systems Hands-on experience with an RTOS (FreeRTOS, Zephyr, or similar) Solid MCU debugging skills Solid networking fundamentals, incl

Job Details: Job Description: About the Role Join Intel's Client Computing and Physical AI Group and help enable the next generation of mobile and desktop client platforms. We are seeking a Senior Customer Solutions Engineer to serve as a key technical leader responsible for customer platform enablement, architecture collaboration, and execution across Intel's client platform ecosystem. In this role, you will work closely with OEM customers, engineering teams, and program stakeholders to drive the successful delivery of innovative platform technologies. You will play a critical role in platform planning, issue resolution, customer engagement, and cross-functional execution from product definition through product launch and production. What You’ll Do Key responsibilities will include but not limited to: Serve as the primary technical interface between customers and Intel engineering teams, driving platform enablement and customer success. Lead cross-functional execution across platform technologies including hardware, firmware, graphics, connectivity, and I/O technologies. Drive resolution of critical platform issues, customer escalations, and technical challenges throughout the product lifecycle. Represent customer readiness, platform health, and execution status in program reviews and leadership forums. Develop technical assessments, customer enablement plans, and supporting documentation to accelerate design wins and product launches. Drive technical program execution across customer and engineering teams by aligning milestones, dependencies, risks, priorities, and deliverables. Behavioral traits that we are looking for: Strong customer focus and the ability to build trusted partners