Hbm Production Operator Jobs

New College Grad - Product Manager, HBM — Boise, ID - Main Site. Apply via Workday.

New College Grad - Product Yield Enhancement Engineer, HBM — Boise, ID - Main Site. Apply via Workday.

New College Grad - Mixed Signal Design Engineer, HBM — Richardson, TX. Apply via Workday.

Sr. Member Technical Staff - ESD and Latch-Up - HBM — Folsom, CA. Apply via Workday.

New College Grad - Memory Design Engineer, HBM — Richardson, TX. Apply via Workday.

New College Grad - Memory Design Engineer, HBM — Richardson, TX. Apply via Workday.

DMTS/ Sr.Principal Product Manager, HBM — 3 Locations. Apply via Workday.

Sr Manager Design Development Technical Leadership, HBM — Richardson, TX. Apply via Workday.

SoC Timing (Static Timing Analysis/STA) Engineer, HBM — Richardson, TX. Apply via Workday.

Sr Manager, High Bandwidth Memory (HBM), Product Development Team Leader — Fab 10A, Singapore. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: We are advancing the future of semiconductor packaging through innovative 2.5D, 3D, and heterogeneous integration technologies. Our team develops the processes that enable next-generation AI and high-performance computing products, working across materials, device, design, manufacturing, and test engineering to solve complex technical challenges. If you're excited by emerging packaging architectures and breakthrough integration approaches, you'll find meaningful opportunities to make an impact here. Position Overview: As a Process Integration Lead for Advanced Packaging, you will lead a team focused on developing and integrating advanced packaging technologies from concept through full-scale manufacturing. This role plays a critical part in enabling high-performance multi-die solutions by driving technology development, process integration, technology transfer, and collaborative execution. You will help shape the roadmap for next-generation packaging platforms while mentoring a highly skilled technical team. Responsibilities: Manage and grow a team responsible for seamless process integration across 2.5D and 3D packaging platforms, including advanced interconnect architectures, die-stacking solutions, and HBM implementation. Spearhead the development, optimization, and qualification of emerging packaging technologies through experimental design (DOE), process analysis, performance validation, and establishment of design rules. Improve

Engineer, Product Engineering, Media Health Manufacturing, HIG-HBM — Fab 10A, Singapore. Apply via Workday.

Staff Engineer (Pkg PE MFG), Heterogeneous Integration Group(HIG), High Bandwidth Memory (HBM) Product Engineering — Fab 10A, Singapore. Apply via Workday.

Principal Engineer, Product Engineering, Media Health Reliability, HIG-HBM — Fab 10A, Singapore. Apply via Workday.

Senior Product Engineer (Pkg PE MFG), Heterogeneous Integration Group(HIG), High Bandwidth Memory (HBM) Product Engineering — Fab 10A, Singapore. Apply via Workday.