Packaging Module Development Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Summary The Material Engineer is responsible for driving packaging material qualification, material improvements, and supplier quality management to support manufacturing cost, quality, delivery, and risk objectives. This role collaborates closely with Key Material Group (KMG) teams, manufacturing sites, quality, suppliers, and partner organizations to execute material qualification, manage material changes, and ensure laboratory, equipment, and compliance readiness. Key Responsibilities Responsibilities include, but are not limited to: Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements. Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work. Collaborate with KMG teams and site stakeholders to develop and implement material improvements that reduce cost and improve quality and delivery performance. Execute packaging material qualification for trays, carrier tapes, formed end caps, moisture barrier bags (MBB), desiccants, and humidity indicator cards. <li

SINGAPORE REQUIRED COMPANY SPONSERED VISA DEPERNDS ON CANDIDATES SKILLS WORK PERMIT, S- PASS OR E PERMIT LOW COST VISA CANDIDATES SHOULD PAY ONLY 27000 RS BALANCE IS DEDUCTION YOUR SALARY. ELECTRICAL ENGINEER 1 TO 2 YEARS EXPERIENCE REQUIRED PACKAGING SUPERVISOR 0 TO 1 YEARS EXPERIENCE REQUIRED HELPER HARD WORKING REQUIRED CANDIDATE HR MANAGER 2 TO 4 YEARS EXPERIENCE REQUIRED ADMIN ASSISTANT 1 TO 2 YEARS EXPERIENCE REQUIRED ACCOUNTANT 1 TO 2 YEARS EXPERIENCE REQUIRED COMPUTER OPERATOR 1 TO 2 YEARS EXPERIENCE REQUIRED BILLING ASSISTANT 1 TO 2 YEARS EXPERIENCE REQUIRED BUSINESS DEVELOPMENT MANAGER 1 TO 2 YEARS EXPERIENCE REQUIRED ALL PROCESS DONE IN 45 DAYS

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Manages production support engineering for a specific product or group of products after transfer from design to high volume production. Interfaces with design, process, test and reliability engineering to solve problems. Sustains products with cost reduction and yield improvements. 其他職務說明 As the member of HIG HBM Package PE, you will lead and develop a high-performing team to driving Package PE activities within the HBM Systems and Product Engineering Team. You will lead a Global team of professional Product Engineers leading a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. Key Responsibilities Accountable for improving assembly related coverage within the manufacturing flows to improve the Time 0 and Field DPM and reduce/prevent inline fallout within the assembly process. Accountable for driving down the HBM Cube on Wafer Assembly Yield Loss which is seen as part of the Manufacturing Line Yield Pareto through optimized test coverage and collaborating with the Technology Development and Packaging organizations. Driving Cumulative Yield Ownership wit

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Micron’s vision is to transform how the world uses information to enrich life for all . Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in supercomputing and artificial intelligence possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing. We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing. Job Summary The Package Health Test Engineer will contribute to the development and execution of package health monitoring, simulation, and characterization activities. This role involves hands-on en

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. The Package Health Analyst will contribute to the development and execution of package health monitoring, simulation, and characterization activities. This role involves hands-on engineering work in DFT, data analysis, and reliability testing to ensure robust packaging solutions Key Responsibilities Package Health Metrics & Monitoring Define quantitative package health metrics Develop detection mechanisms and monitoring dashboards for continuous health assessment. Perform electrical and mechanical characterization of packages. Inline Defect Characterization Implement real-time defect detection and classification (critical vs. non-critical). Conduct next-level characterization for critical defects and integrate findings into predictive models. Advanced Analytics & Knowledge Base Perform correlation and causation studies between process variables, defect patterns, and reliability outcomes. Build and maintain a structured knowledge base for package health learnings to enable NPI handover and future technodes. End-to-End Traceability </

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, our Technology Development team sits at the center of innovation. We build advanced modeling and AI solutions that shape how memory and storage technologies are designed, built, and scaled. Working at the intersection of physics, data, and engineering, we turn complex problems into practical breakthroughs that matter! This role is critical to how we accelerate semiconductor technology development using advanced AI and physics-based modeling. You will lead the design and deployment of agentic and LLM-powered solutions that directly influence process technology, packaging, and early manufacturing decisions. If you enjoy driving hard problems end to end and collaborating across hardware and software teams, this role offers real impact and visibility. Note: We are hiring for more than one role spanning Senior/Staff/Principal/Technical Staff Engineer. Responsibilities: Design and deploy physics-based, ML, and LLM-powered modeling solutions for semiconductor process, package, and manufacturing workflows Architect agentic AI systems that integrate with modeling tools, design automation environments, and fab/test platforms to enable digital twin development Define and promote best known methods for deploying LLMs and agentic systems reliably in production environments Evaluate and improve model performance using methods such as structured benchmarking, prompt tuning

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Roles & responsibilities can include but are not limited to: Define the global DL4 matrices (Turnaround time, overdue matrices, detection compliance, Statistical Bin Limits (SBL) reactions etc) Ensure all sites adhere to globally aligned DL4 workflows Drive global automation and AI enhancements (YIT, Auto-contain, auto-disposition, Smart Manufacturing & Artificial Intelligence (SMAI) assisted detection) Oversee universal alignment so DL4 signal signals behave the same across sites Monitor the Assembly and Test specifications Improvements and optimization in existing DL4 systems via automation systems Spec limits (Analog values and limits, SBL Bins, Product level ESD) Test coverage/DL4 improvements (based on lessons learnt, Material review boards and Fail Mode Registers(FMR)) Network standardization (Dispositions/problems) FMR, Failure analysis, Failure analysis modelling and Defense Line Correlations Test program review and release Collaborate with cross-functional teams from Product Engineering, Media Health, Global Quality, Advanced Packaging Technology Development and Test Systems Engineering and drive projects to further enhance defense line 4 capabilities Mandatory Requirements: Strong understanding of semiconductor device physics Experience or know-how in device modelling and simulation using TCAD (Silvaco, Sentaurus, etc), as well as compact modellin

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron Technology, we transform how the world uses information to enrich life for all. The Heterogeneous Integration Group (HIG) HBM Architecture team develops next-generation High-Bandwidth Memory (HBM) solutions that power AI, high-performance computing, cloud infrastructure, and advanced networking systems. The team works across architecture, design, verification, packaging, product engineering, and technology development to evaluate innovative memory architectures and deliver scalable, high-performance semiconductor solutions. As an HBM Design Architect, New College Graduate, you will contribute to the evaluation and development of future HBM and DRAM architectures. Working with experienced architects and engineering teams, you will analyze system and block-level design tradeoffs related to performance, power, area, thermal behavior, reliability, and manufacturability. This role provides an opportunity to leverage AI, Large Language Models (LLMs), and data-driven engineering methodologies to accelerate architecture exploration and improve decision-making. Responsibilities Analyze HBM and DRAM architectures using analytic

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. MTS, Interface Pathfinding Hardware Development Engineer About the Role At Micron, our vision is to transform how the world uses information to enrich life for all. As a global leader in memory and storage innovation, we develop technologies that accelerate intelligence and enable the next generation of high-speed interfaces. Micron’s Interface Pathfinding team drives performance-scaling innovation across circuits, signaling, packaging, and interconnects with a 3–5 year technology horizon. As the Interface Pathfinding Hardware Development Engineer , you will own characterization for a high-speed interface test-chip program: the characterization plan and its success criteria, development of the characterization bench hardware and its automation, the measurement-uncertainty budget, and the correlation report proving the silicon matches the models. You will join a small, senior team spanning analog design, layout, digital design, and verification, working closely with the Chip Lead and the Signal Integrity and Physical Design engineers — driving decisions independently while consulting heavily with other experts across Micron. This is a foundational hire for a growing program. Strong execution early is expected to lead to follow-on projects of increasing scope, team size, and characterization complexity — including an expanding mandate for AI-enabled engineering leadership across the organization. What You’ll Own Characterization Planning • Derive the electr

Work Flexibility: Onsite Schedule: Monday - Friday 5:00am-1:30pm, OT as needed Position Summary: The Production Tech I position is responsible for issuing materials to manufacturing orders; packaging operations including blister packaging, pouch sealing, cartooning and shrink wrapping; and making and checking labels, as well as operating digital scales and cleaning various components/products. This position could either focus in SJO, Biologics, Augment, or Xerogel operations. Essential Duties & Responsibilities Issues materials to manufacturing orders. Performs packaging operations (blister, pouch, carton, shrink wrap). Makes labels. Fills out routers correctly in Device History Record Management. Performs all preventive maintenance on time. Operating miele washer and cleaning components. Operate digital scales. Data entry - correctly entering required production data into systems for business purposes. Perform daily, weekly, monthly, quarterly, and annual cleanings as required. Participate in daily management activities. Maintains a dependable work schedule through regular attendance and punctuality. Demonstrates flexibil

Work Flexibility: Onsite Schedule: Monday - Friday 5:00am-1:30pm, OT as neede Position Summary: The Production Tech I position is responsible for issuing materials to manufacturing orders; packaging operations including blister packaging, pouch sealing, cartooning and shrink wrapping; and making and checking labels, as well as operating digital scales and cleaning various components/products. This position could either focus in SJO, Biologics, Augment, or Xerogel operations. Essential Duties & Responsibilities Issues materials to manufacturing orders. Performs packaging operations (blister, pouch, carton, shrink wrap). Makes labels. Fills out routers correctly in Device History Record Management. Performs all preventive maintenance on time. Operating miele washer and cleaning components. Operate digital scales. Data entry - correctly entering required production data into systems for business purposes. Perform daily, weekly, monthly, quarterly, and annual cleanings as required. Participate in daily management activities. Maintains a dependable work schedule through regular attendance and punctuality. Demonstrates flexibility by

Job Details: Job Description: Intel Foundry Automation - Back End Automation Group is seeking a talented student to support our Automation Integrators in advancing manufacturing automation systems. Key Responsibilities: • Assist Automation Integrators with troubleshooting, system upgrades, user training, and root cause analysis to improve efficiency and reduce waste. • Enable Automation Integrators in designing, developing, testing, and debugging software for factory operations, wafer processing, and packaging across multiple software layers. • Support client-based Station Controller systems through validation, troubleshooting, and quality control. Collaborate with global cross-functional teams to drive automation projects and integrate machine learning and AI solutions as needed. Qualifications: Candidates must be currently pursuing a bachelor's degree in computer science, Data Science, Computer Engineering, or a related discipline. They should possess strong analytical, problem-solving, and communication skills, along with hands-on programming experience in languages such as Python, C, and C#. Knowledge of Agile software development methodologies and experience with manufacturing systems are highly desirable. Job Type: Student / Intern Shift: Shift 1 (Malaysia) Primary Location: Malaysia, Penang Additional Locations: Malaysia, Kulim Posti

Job Details: Job Description: oin Intel Foundry Construction and Sourcing (FCS) in building the world's largest semiconductor manufacturing factories across the globe. The future is what we build. The scope of our work includes but is not limited to Advanced Packaging Factories, New Wafer Fabrication factories (Fabs), Fab Conversions, Process Tools Install, Infrastructure, and Progressive Build. We are looking for world-class technical talent to join our team. If you enjoy working with the latest technology in a rewarding, fast-paced environment, this is the right place for you. Everywhere you go, you'll find an opportunity to make a difference. In any given workday, you will be given the responsibility to innovate and create an impact on our business. The Install Qualification Operation Sr Specialist is responsible for driving key milestones enabling tool installation, readiness, and qualification within Intel Foundry Construction and Sourcing (FCS). The role is responsible for equipment install execution from pre-design through design finish and set to SL2 signoff, ensuring safe delivery, accurate scope definition, efficient construction, and prompt vendor qualification. This position requires five days per week of onsite presence and close coordination with manufacturing, design, construction, OEMs, trade contractors, and supplier partners. Please consider that this is an Intel Contract position (3 years). Responsibilities will include but are not limited to: Safety and Compliance: Champion Intel's Culture of Caring and ensure safe behaviors across design and construction activities. Enforce cleanroom, IP protection, and site protocols to maintain compliance with all applicab

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Interposer Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for physical design and integration of advanced packaging interposers within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Physical design and integration of interposers used within advanced packaging for quantum computing - Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Design validation and verification; including DRC and LVS - Deliver and disseminate design milestones to stakeholders - Communicate designs in presentations and relevant documentation - Stay current with the latest developments in packaging technology and design techniques by attending conferences and reading papers As

Product Manager Enterprise Integrations Description - Role Summary We are looking for a Principal Product Manager to lead the evolution of HP’s Enterprise Integration strategy—from fragmented, point-to-point integrations to a scalable, productized API ecosystem. This role will define and drive a shift toward API-as-a-product, enabling reusable business capabilities, accelerating developer productivity, and laying the foundation for an AI-first, composable enterprise. You will play a pivotal role in transforming our integration landscape into a unified Integration Fabric, and ultimately an Intelligence Fabric that powers next-generation digital and AI-driven experiences. What You’ll Own API Productization Strategy Transform APIs from point solutions into reusable, discoverable product offerings Define capability-based packaging aligned to business domains (B2C, B2B, Partner ecosystems) Drive standardization across design, classification, and maturity frameworks Enterprise Integration Fabric Define integration patterns that unify platform, SaaS, and custom-built APIs Establish a holistic, cross-application view of enterprise APIs Reduce point-to-point integrations through reusable architecture patterns and services Data &#43; API Convergence Partner with Data teams to define and expose data products via APIs Enable consistent access to enterprise data through standardized interfaces Align API strategy with enterprise data governance and cataloging AI-First APIs & Developer Experience Define APIs optimized for AI agents, automation, and developer productivity Build APIs that are discoverable, composable, and machine-consumable Enable next-gen use cases including agent or