Packaging Module Development Engineer Jobs

Sr RDA Engineer, Advanced Packaging — Boise, ID - Main Site. Apply via Workday.

Shift Process Engineer, Advanced Packaging Technology Development (APTD) — Boise, ID - Main Site. Apply via Workday.

Staff Process Engineer, Advanced Packaging CMP — Boise, ID - Main Site. Apply via Workday.

Principal/Staff, APTD - Advanced Packaging Wafer Level Technology Process Engineer — Fab 10A, Singapore. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: We are advancing the future of semiconductor packaging through innovative 2.5D, 3D, and heterogeneous integration technologies. Our team develops the processes that enable next-generation AI and high-performance computing products, working across materials, device, design, manufacturing, and test engineering to solve complex technical challenges. If you're excited by emerging packaging architectures and breakthrough integration approaches, you'll find meaningful opportunities to make an impact here. Position Overview: As a Process Integration Lead for Advanced Packaging, you will lead a team focused on developing and integrating advanced packaging technologies from concept through full-scale manufacturing. This role plays a critical part in enabling high-performance multi-die solutions by driving technology development, process integration, technology transfer, and collaborative execution. You will help shape the roadmap for next-generation packaging platforms while mentoring a highly skilled technical team. Responsibilities: Manage and grow a team responsible for seamless process integration across 2.5D and 3D packaging platforms, including advanced interconnect architectures, die-stacking solutions, and HBM implementation. Spearhead the development, optimization, and qualification of emerging packaging technologies through experimental design (DOE), process analysis, performance validation, and establishment of design rules. Improve

Principal Wet Process Engineer, Advanced Packaging — Boise, ID - Main Site. Apply via Workday.

Principal/Staff Engineer Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering — Fab 10A, Singapore. Apply via Workday.

Principal/Staff/Senior Engineer, APTD CEM - Advanced Packaging Wafer Level Technology Engineering — Fab 10A, Singapore. Apply via Workday.

Principal/Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering — Fab 10A, Singapore. Apply via Workday.

MTS Design Engineer, Bonding and Packaging — Boise, ID - Main Site. Apply via Workday.

Media & Materials Partner Manager, Labels & Packaging — All Cities, Massachusetts, United States of America. Apply via Workday.

Who We Are At Justworks, you’ll enjoy a welcoming and casual environment, great benefits, wellness program offerings, company retreats, and the ability to interact with and learn from leaders in the startup community. We work hard and care about our most prized asset - our people. We’re helping businesses get off the ground by enabling them to focus on running their business. We solve HR issues. We’re data-driven and never stop iterating. If you’d like to work in a supportive, entrepreneurial environment, are interested in building something meaningful and having fun while doing it, we’d love to hear from you. We're united by shared goals and shared motivations at Justworks. These are best summed up in our company values, which are reflected in our product and in our team. Our Values If this sounds like you, you’ll fit right in. Who You Are The mission of Justworks’ Product Marketing team is to define, articulate, and differentiate our value proposition to the right audiences—positioning our products for growth, adoption, and long-term success. As we continue evolving into a multi-solution platform, how we price and package our offerings is foundational to customer trust, perception, and long-term differentiation. We are seeking a strategic and analytically strong Senior Product Marketing Manager, Pricing & Packaging to help execute Justworks’ multi-year Pricing & Packaging (P&P) strategy. This role will report to the Head of Pricing & Packaging and will play a critical role in driving monetization initiatives, packaging evolution, and pricing experimentation across the business. Pricing & Packaging is a key growth lever at Justworks. In this role, you will help translate pricing principles into actionable recommendations, conduct rigorous analysis to inform pricing decisions, and partner cross-functionally with Product, Finance, Revenue, Strategy, and Marketing to bring pricing strategies to life. This role is ideal for a highly analytical PMM w

Principal Wet Process Engineer, Advanced Packaging — Boise, ID - Main Site. Apply via Workday.

Define the physical limits of what a chip can do, then break them! NVIDIA's Silicon Co-Design Group sits at the crossroads of architecture, silicon, systems, and manufacturing, where first principles thinking translates directly into product outcomes at scale. As GPU power density and thermal limits approach physical boundaries, the gap between system architecture needs and manufacturable, testable capabilities widens with every generation, and this role exists to close it. You wouldn't be maintaining existing solutions, you'd be identifying where physical constraints will erode NVIDIA's competitive edge before anyone else sees it coming, then building the cross-domain responses that ensure the next generation leapfrogs those limits entirely. The problems here don't have known answers yet: Every generation of NVIDIA silicon pushes closer to the limits of physics. The Co-Design Architect role isn't about optimizing within known bounds; it's about redrawing those bounds entirely. If you want your work to shape what's physically possible in the world's most demanding computing products, this is where that work happens. What you'll be doing: Power, Thermal & Packaging Limits Analysis: Gather and analyze the hard constraints of packaging, power delivery, and thermal dissipation against roadmap demands, predicting when those constraints will reduce competitiveness and acting before they do. Cross-Domain Solution Development: Develop solutions that span silicon features, packaging innovation, firmware and hardware co-design, and DFX updates, ensuring future products are not only performant but testable to the highest quality and reliability standards. Packaging Technology Evaluation: Assess emerging packaging technologies for their voltage/frequency, noise, reliability, and testability implications, determining which are worth adopting an