Principal Program Manager, PMO – Graphics & Compute — Boise, ID - Main Site. Apply via Workday.
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Principal Chip Lead Jobs
1,140 active opportunities · Updated for October 2026
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Explore current principal chip lead jobs. Use filters to narrow by work mode, employment type, experience and date posted.
Principal/MTS, Analog Design Engineering — Boise, ID - Main Site. Apply via Workday.
PRINCIPAL ENGINEER - OCT FE PEE WET PROCESS — Taichung - Fab 16, Taiwan. Apply via Workday.
Principal Customer Validation Engineer — Longmont-MAX- Office, CO. Apply via Workday.
Principal Layout Designer, Next-generation HBM Architecture — 2 Locations. Apply via Workday.
Principal SSD Systems Design Engineer — Longmont-MAX- Office, CO. Apply via Workday.
Principal Engineer, Firmware — Longmont-MAX- Office, CO. Apply via Workday.
Principal Product Yield Analysis Engineer — Boise, ID - Main Site. Apply via Workday.
Principal Memory Design Engineer, HBM — Richardson, TX. Apply via Workday.
Principal Engineer, Firmware Security — 3 Locations. Apply via Workday.
Principal Engineer - Metals/Implant, Operations Central Teams - Advanced Development Team — Hiroshima - Fab 15, Japan. Apply via Workday.
Principal Engineer - FPT Validation — Bengaluru, India. Apply via Workday.
Principal/Staff/Senior Engineer, APTD CEM - Advanced Packaging Wafer Level Technology Engineering — Fab 10A, Singapore. Apply via Workday.
Principal Design Engineer — San Jose, CA. Apply via Workday.
Principal Engineer - Dry Etch, Operations Central Teams - Advanced Development Team — Hiroshima - Fab 15, Japan. Apply via Workday.
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