Principal Substation Engineer in Tokyo

Semiconductor Principal Design Engineer — Tokyo, Japan. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Position Overview The Principal Design Engineer in Micron’s NVEG organization contributes to the development of new memory products by assisting with the overall design, layout, and optimization of datapath circuits for NAND flash memory. This position will drive task forces and make strategic decisions on major datapath architectural changes influenced by new design specs such as higher speed/lower power. They will assess pros and cons of new architecture and drive all activities pertaining its implementation. The role will be expected to lead technical datapath design projects, directing the design planning, layout, and validation activities according to project timelines. Responsibilities Design and optimize TSV(Through-Silicon Via) interface circuits connecting memory die to logic die including Rx/Tx circuit for internal TSV channels, impedance matching and timing margin analysis. Develop and characterize TSV electrical models and define circuit design constraints for datapath inte

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Principal Design Engineer in Micron’s NVEG (Non‑Volatile Engineering Group) organization will own and evolve the timing-critical circuitry between the NAND array and page buffer. This role is for a designer who is equally strong in architecture, transistor-level implementation, and physical aware timing closure – and who can lead technical direction across teams to deliver robust, scalable datapath solutions. You will drive designs that directly impact throughput, timing margin, power and yield, partnering closely with page buffer, array device, clocking, physical design, test, and product teams. Responsibilities Own internal NAND datapath circuits including array redundancy circuits, wave pipeline / pulse based datapath arctitechture and data line sensing circuits. Define scalable datapath architecture supporting multi-plane and high-parallelism operation. Define and analyse clock/data timing schemes for long interconnects and large-array topologies. Lead timing adjustment and skew manag