Staff Engineer Central Process Quality Engineering Deviation Management (Event Deviation) β Taichung - Fab 16, Taiwan. Apply via Workday.
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Staff Engineer Central Process Quality Engineering Deviation Management (Yield/Minor Deviation) β Taichung - Fab 16, Taiwan. Apply via Workday.
Senior Engineer β Process Development, Thin Films (CVD/Diffusion) NAND β Fab 10N/X, Singapore. Apply via Workday.
Fab Engineer Process Integration β Hiroshima - Fab 15, Japan. Apply via Workday.
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in artificial intelligence possible! We do it all while committing to integrity, sustainability, and giving back to our communities, because doing so can fuel the very innovation we are pursuing. As a process integration engineer in the DRAM organization, you will be part of a team of world-class engineers who are working in an industry leading 300mm R&D facility on technology which enables future memory scaling. You will focus on the performance and manufacturability of Micronβs cutting-edge next-generation memories. Areas of concentration will include integration and circuit issues specific to DRAM technology. In addition to a broad basis of process integration knowledge, this position will require a strong background in semiconductor device physics. Role interacts significantly with the process development, simulation, modeling, characterization, and reliability groups. Responsibilities include, but not limited to: Lead technology integration activities in enabling manufacturability of state-of-the-art DRAM technology Engage with numerous cross-functional teams including process development, product engineering, design, yield improvement, advanced mask and probe to arrive at solutions to
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is advancing next-generation packaging technologies that enable the performance and scalability requirements of tomorrowβs AI and high-performance computing applications. Our team brings together experts in process integration, materials engineering, and semiconductor development to solve complex technical challenges and turn new ideas into production-ready solutions. Join us and help shape the future of advanced memory and packaging technology! Position Overview: As a Process Integration Engineer for Advanced Packaging, you will play a key role in developing and integrating advanced package architectures, including 2.5D, 3D stacking, HBM, and hybrid bonding technologies. You will work across engineering disciplines to develop new processes, improve performance and yield, and support the transfer of emerging technologies into manufacturing. This is an opportunity to contribute to innovative products while working on some of the industry's most advanced packaging solutions. Responsibilities: Develop and optimize advanced packaging technologies, including 2.5D/3D integration, HBM, hybrid bonding, and advanced interconnects Design and execute experiments to qualify materials, process flows, and design rules for new package architectures Analyze yield, performance, and defect data to identify process improvements using SPC and advanced analytics Drive
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are transforming how the world uses information to enrich life for all. Within our DRAM organization, we develop next-generation memory technologies in an industry-leading 300mm R&D environment, bringing together expertise across process development, design, modeling, characterization, reliability, and manufacturing. Our team works collaboratively to advance memory scaling while improving performance and manufacturability. As a Process Integration Engineer, you will help enable state-of-the-art DRAM technologies and solve complex integration, device, yield, and circuit challenges. You will work closely with cross-functional engineering teams to optimize process flows, improve yield and margin, and translate technical data into solutions that enable future generations of memory technology. Responsibilities: Lead technology integration activities to enable manufacturability of advanced DRAM technologies Partner with process development, product engineering, design, yield, mask, and probe teams to resolve yield, performance, reliability, and margin challenges Design and implement R&D fab experiments and optimize process flows to meet product and technology requirements Analyze inline, defect, parametric
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) team at Micron is shaping the future of memory and storage technologies that fuel the AI era. We collaborate with global R&D groups, suppliers, and manufacturing teams to turn bold ideas into production-ready solutions. We innovate fast, learn continuously, and work as one team! This position is intended to be part of Micron's Technical Leadership Program (TLP). This is a career path for individuals seeking to advance as technical leaders and industry innovators. TLP members are expected to influence, lead, and mentor others. Position Overview: We are seeking an experienced organizational leader who will l ead and influence methodology improvements, including best practices in process development, data-driven decision-making, and application of AI/advanced analytics to drive innovation. In this role, you will drive strategic process development for Micronβs most advanced memory products, including HBM, 3DS DRAM, and emerging 3D architectures. You will guide endβtoβend technology execution, partner across organizations, and influence both internal roadmaps and the external ecosystem. This is a high-impact role for someone who thrives at the intersection of innovation, complexity, and collaboration. Responsibilities: Own advanced packaging process technologies across waferβlevel and dieβlevel modules from pathfinding through manufacturing readiness Develop
We anticipate the application window for this opening will close on - 6 Oct 2026 Careers that change lives start here. Medtronic is a global leader in healthcare technology with a Mission to alleviate pain, restore health, and extend life. Our 95,000 employees work across more than 150 countries to put patients first β developing innovative medical technologies that improve the lives of 72+ million patients each year. Your unique talents will help shape the future of healthcare while building a career grounded in purpose, growth, and impact. A Day in the Life At Medtronic, we bring bold ideas forward with speed and decisiveness to put patients first in everything we do. In-person exchanges are invaluable to our work. Weβre working onsite 5 days a week as part of our commitment to fostering a culture of professional growth and cross-functional collaboration as we work together to engineer the extraordinary. This Principal Process Development Engineer will be responsible for the development of laser based processes through release to manufacturing. The Engineer will lead process development and process improvement projects in laser joining and laser cutting of metal and glass materials. Process development work scope may span across multiple process areas with a primary focus in laser equipment. They will coordinate risk burn down and problem-solving experiments by utilizing DRM/DFSS (Design and Reliability for Manufacturing / Design For Six Sigma) and data driven methods. They will also be responsible for managing the validation activities for the development work including requirements flow down, effective control and monitoring strategies and ensuring compliance to regulations and safety for our patients. Responsibilities may include the following and other duties may be assigned.
We anticipate the application window for this opening will close on - 6 Oct 2026 Careers that change lives start here. Medtronic is a global leader in healthcare technology with a Mission to alleviate pain, restore health, and extend life. Our 95,000 employees work across more than 150 countries to put patients first β developing innovative medical technologies that improve the lives of 72+ million patients each year. Your unique talents will help shape the future of healthcare while building a career grounded in purpose, growth, and impact. A Day in the Life At Medtronic, we bring bold ideas forward with speed and decisiveness to put patients first in everything we do. In-person exchanges are invaluable to our work. Weβre working onsite 5 days a week as part of our commitment to fostering a culture of professional growth and cross-functional collaboration as we work together to engineer the extraordinary. This Principal Process Development Engineer will be responsible for the development of material finishing, material handling and automated handling systems and processes through release to manufacturing. The Engineer will lead equipment and system development and process improvement projects to support various component and device handling, finishing, and assembly needs in new and current manufacturing lines. Process development work scope often spans across multiple process areas including wafer processing functional areas, component assembly, laser processes, and device test and finishing processes. They will coordinate risk burn down and problem-solving experiments by utilizing DRM/DFSS (Design and Reliability for Manufacturing / Design For Six Sigma) and data driven methods. They will also be responsible for managing the validation activities for the development work including requirements flow down, effective control
Senior/Staff Engineer Central Process Quality Engineering Deviation Management Event Deviation β Hiroshima - Fab 15, Japan. Apply via Workday.
Metrology Process Development Engineer (Open) β Hiroshima - Fab 15, Japan. Apply via Workday.
Photolithography Process Development Engineer β Boise, ID - Main Site. Apply via Workday.
Wet Process Shift Engineer β Taoyuan - Fab 11, Taiwan. Apply via Workday.
Films Process Development Engineer β Boise, ID - Main Site. Apply via Workday.
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