Product Manufacturing Engineer Jobs

Abbott is a global healthcare leader that helps people live more fully at all stages of life. Our portfolio of life-changing technologies spans the spectrum of healthcare, with leading businesses and products in diagnostics, medical devices, nutritionals and branded generic medicines. Our 122,000 colleagues serve people in more than 160 countries. JOB DESCRIPTION: Position Overview: The Automation Service Engineer I role is responsible for the installation, calibration, maintenance, and repair of both simple and complex laboratory automation equipment. The Automation Service Engineer I plays a crucial role in fostering positive interactions, providing technical support, and ensuring that customer needs are met in a timely and professional manner. The Engineer I will spend significant time (up to 65%) performing routine and complex tasks related to the calibration, maintenance, and repair of automation equipment. This encompasses automation across a range of laboratory settings, including clinical, research and development (R&D), manufacturing, and quality control laboratories. The automation used in these environments may include liquid handling robots, as well as custom and off-the-shelf automation such as 6-axis robots, work cells, and other specialized devices. Responsibilities also include operating within several regulated environments (e.g., clinical labs under CAP/CLIA and NYSDOH, production and manufacturing labs under cGMP, FDA, and ISO). The Engineer I partners with the Engineer IIs on the team to escalate concerns, present areas of team growth/development and report back on the day-to-day operations of the service team. This role requires strong communication skills to lead by example, ensuring customer satisfaction and smooth laboratory operations. Collaboration with team members is essential to address technical issues, maintain integrity, and deliver high-qual

Abbott is a global healthcare leader that helps people live more fully at all stages of life. Our portfolio of life-changing technologies spans the spectrum of healthcare, with leading businesses and products in diagnostics, medical devices, nutritionals and branded generic medicines. Our 122,000 colleagues serve people in more than 160 countries. JOB DESCRIPTION: Position Overview: The Automation Service Engineer I role is responsible for the installation, calibration, maintenance, and repair of both simple and complex laboratory automation equipment. The Automation Service Engineer I plays a crucial role in fostering positive interactions, providing technical support, and ensuring that customer needs are met in a timely and professional manner. The Engineer I will spend significant time (up to 65%) performing routine and complex tasks related to the calibration, maintenance, and repair of automation equipment. This encompasses automation across a range of laboratory settings, including clinical, research and development (R&D), manufacturing, and quality control laboratories. The automation used in these environments may include liquid handling robots, as well as custom and off-the-shelf automation such as 6-axis robots, work cells, and other specialized devices. Responsibilities also include operating within several regulated environments (e.g., clinical labs under CAP/CLIA and NYSDOH, production and manufacturing labs under cGMP, FDA, and ISO). The Engineer I partners with the Engineer IIs on the team to escalate concerns, present areas of team growth/development and report back on the day-to-day operations of the service team. This role requires strong communication skills to lead by example, ensuring customer satisfaction and smooth laboratory operations. Collaboration with team members is essential to address technical issues, maintain integrity, and deliver high-qual

Job Details: Job Description: The Role and Impact Are you ready to make a significant contribution to cutting-edge semiconductor designs? As a DFT Design Engineer, you will play a critical role in shaping the testability, debuggability and reliability of complex SoC (System-on-Chip) designs. You will work closely with cross-functional teams, influencing designs from concept to production, and ensuring our products meet the highest quality standards. In this role, you will develop innovative DFT/DFD methodologies, optimize workflow with AI, and enhance post silicon efficiency. Your work will directly impact Intel's ability to deliver world-class semiconductor solutions that advance technology across industries. Key Responsibilities : Develop and implement advanced DFT methodologies for complex SoC designs to maximize test coverage and efficiency. Collaborate with design, verification, and manufacturing teams to define and optimize post silicon strategies and requirements. Integrate DFT/DFD features into RTL and ensure verification of design for testability requirements. Collaborate with post-silicon teams to debug and validate DFT features. Stay current with emerging trends, AI adoption and technologies in DFT/DFD to ensure best practices are incorporated into workflows. Qualifications: Minimum Qualifications : Bachelor's degree in Electrical Engineering, Computer Engineering, or a related field. 5+ years of experience in DFT, SoC design, or related semiconductor design areas. Expertise in RTL design using hardware description languages like Verilog, VHDL, or SystemVerilog. Preferred Qualifications : Familiar with AI application. Familiarity w

Instawork is on a mission to create meaningful economic opportunities for skilled hourly professionals in communities around the globe. Our AI-powered labor marketplace helps local businesses scale, and enables global technology companies to push the frontiers of robotics and AI. Backed by world-class investors like Benchmark, Spark Capital, Craft Ventures, Greylock, Y Combinator, and others, we’re looking for exceptional talent to reimagine the way the world works. Senior Mechanical Engineer — Robotics Hardware Location - Bangalore Instawork Robotics Labs is building Instacore, our proprietary five-camera and IMU wearable capture rig. Hundreds of units operate across India every day, collecting real-world data used to train frontier Physical AI models. We are looking for a senior, mechanically focused engineer to own the complete hardware lifecycle for Instacore and future hardware products. This person will independently lead design, prototyping, manufacturing, testing, deployment, logistics, maintenance, and continuous improvement. What you’ll do - Own the mechanical design and development of Instacore and other robotics hardware from initial requirements through production and field deployment. - Create detailed CAD models, assemblies, engineering drawings, bills of materials, and manufacturing documentation. - Rapidly prototype and validate designs using 3D printing, machining, fabrication, and off-the-shelf components. - Design durable mounts, enclosures, fixtures, wearable components, packaging, and protective systems. - Own design for manufacturability, assembly, serviceability, reliability, and cost. - Improve cable routing, connector retention, strain relief, thermal management, ingress protection, and resistance to vibration and impact. - Design packaging and logistics processes that prevent damage during storage and transit. - Establish verification, stress-testing, quality-control, and acceptance-testing procedures. - Investigate field failures, d

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Senior Process Analysis Engineer As a Senior Process Analysis Engineer in Micron’s Automation Development group at Taiwan Taichung, you will play a critical role within the Process and Process Integration team to enhance inline defense line effectiveness, improve process control capability, and prevent yield-related excursions through data-driven and AI-enabled solutions. You will take ownership of issue investigation, root cause analysis, Design of Experiments (DOE), and Continuous Improvement Programs (CIP) for critical materials and manufacturing processes. In addition, you will collaborate with cross-functional teams to integrate advanced process control methodologies, AI-assisted analytics, and digital solutions into process flows supporting next-generation high-density memory products. Job Responsibilities Leverage AI-assisted and AI-enabled technologies to improve manufacturing intelligence and decision-making, including applications in Statistical Process Control (SPC), Fault Detection and Classification (FDC), Automated Defect Classification (ADC), Internet of Things (IoT), and Data Analytics (DA). Apply AI-supported analytical approaches to identify process variations, improve inline defense line effectiveness, and accelerate root cause investigation and yield learning. Collaborate with internal and external partners, including Process Engineering, Failure Analysis, Quality, and Manufacturing teams, to correlate Defense Line (DL) signa

Job Details: Job Description: As a Packaging Module Development Engineer, you will play a pivotal role in the development and optimization of Intel's assembly media and collaterals. Your daily work will involve designing innovative solutions to improve media and collateral reliability, manufacturability, and cost efficiency. Your contributions will directly support Intel's cutting-edge assembly packaging technology roadmap, driving advancements in semiconductor manufacturing processes. Business Group You will be part of Intel Corporation's Media Development organization, a team dedicated to advancing packaging technologies and manufacturing processes. This group operates at the forefront of innovation, enabling high-performance products and driving Intel's leadership in the semiconductor industry. By joining this collaborative environment, you will contribute to Intel's broader goals of delivering transformative technology solutions. Key Responsibilities Develop and optimize media and collaterals to meet quality, reliability, cost, yield, and productivity targets. Design and implement new media and collateral solutions, leveraging statistical methods like Design of Experiments (DOE) and Statistical Process Control (SPC). Conduct evaluations of media and collaterals under simulated field conditions, including tests for heat, humidity, temperature cycling, and dynamic forces. Lead initiatives to identify and mitigate media and collateral quality and reliability risks, utilizing innovative tools and methods. Provide technical consultation on media and collateral challenges and deliver solutions that align with operational and technology milestones. Document technical improvements and innovations through research papers and presentations. <p styl

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. About our Team: Micron’s Industrial and Physical AI team is driving the transformation of semiconductor manufacturing through Autonomous Operations, AI, robotics, and digital twin technologies! We develop and deploy innovative solutions across Micron’s global fabrication and assembly/test facilities, enabling smarter, safer, and more efficient operations at scale. Position Overview: We are seeking a hands-on Full-Stack AI Engineer to design, build, and deploy production-grade AI applications that support Micron's Autonomous Operations initiatives. This role owns the end-to-end development lifecycle, from data pipelines and AI models to APIs, web applications, digital twin integrations, and cloud/edge deployments, delivering impactful solutions for engineers, operators, and business leaders worldwide. Responsibilities: Design, architect, and deliver end-to-end AI products, including data ingestion pipelines, feature engineering, model training/inference, APIs, user interfaces, and application monitoring. Build and maintain modern front-end applications using React, Angular, or Streamlit, supported by backend services in Python and FastAPI. Develop scalable integrations between manufacturing systems, robotics platforms, AMRs, sensor networks, and enterprise applications to enable intelligent factory operations. Design and implement digital twin environments using platforms such as NVIDIA Omniverse, Gazebo, or Unity Robotics Hub to support simulation, validation, and o

Job Details: Job Description: The Role and Impact As a Development Tools Software Engineer, you will play a vital role in creating and optimizing cutting-edge software tools that support diverse engineering domains such as design, manufacturing, validation, silicon production, systems integration, and ecosystem enabling. On a day-to-day basis, you'll design, develop, debug, and validate algorithms, tools, and systems that empower internal and external engineering teams to deliver impactful products. Your contributions will directly enable the seamless integration of Intel silicon and software into innovative solutions, driving progress across industries. Business group You will join Intel Corporation, a leading global technology company dedicated to advancing semiconductor innovation and creating solutions that enrich the lives of people worldwide. The team focuses on developing robust software tools and methodologies that support Intel's engineering ecosystem, fostering excellence and driving high-quality results. This group plays a critical role in enabling Intel's broader mission of building world-class technologies and products that power the future of the digital world. Key Responsibilities - Design and implement software tools using modern software development methodologies and programming languages. - Debug, validate, and optimize algorithms and software systems for engineering applications, ensuring high performance and reliability. - Collaborate with cross-functional teams to create solutions that enable seamless integration of Intel silicon and software into impactful products. - Utilize secure coding practices to ensure the robustness and security of software tools across various engineering domains. - Continuously explore innovative solutions to enhance design, manufacturing, validation, and testing processes. <p st

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) team at Micron is shaping the future of memory and storage technologies that fuel the AI era. We collaborate with global R&D groups, suppliers, and manufacturing teams to turn bold ideas into production-ready solutions. We innovate fast, learn continuously, and work as one team! This position is intended to be part of Micron's Technical Leadership Program (TLP). This is a career path for individuals seeking to advance as technical leaders and industry innovators. TLP members are expected to influence, lead, and mentor others. Position Overview: We are seeking an experienced organizational leader who will l ead and influence methodology improvements, including best practices in process development, data-driven decision-making, and application of AI/advanced analytics to drive innovation. In this role, you will drive strategic process development for Micron’s most advanced memory products, including HBM, 3DS DRAM, and emerging 3D architectures. You will guide end‑to‑end technology execution, partner across organizations, and influence both internal roadmaps and the external ecosystem. This is a high-impact role for someone who thrives at the intersection of innovation, complexity, and collaboration. Responsibilities: Own advanced packaging process technologies across wafer‑level and die‑level modules from pathfinding through manufacturing readiness Develop

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. At Tenstorrent, we're building cutting-edge AI compute solutions. Developing diagnostics programs to validate the functionality and stress the performance of our solutions is a critical part of delivering exceptional products. We are looking for Engineers to join our Diagnostics Development team. These engineers will work closely with our firmware, software, board, ASIC design and verification teams to ensure that the ASICs, boards, and AI compute systems meet the highest standards of quality and performance. This role is hybrid, based out of Toronto, Canada. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are You're curious, hands-on, and excited by the challenge of building powerful systems that sit at the intersection of hardware and software. You enjoy working close to the metal, whether that’s writing code, debugging hardware, or exploring how systems perform under stress. You thrive in collaborative environments and love learning from teammates across disciplines like firmware, ASIC design, and manufacturing. You’re motivated by impact and want to contribute to technology that’s shaping the future of AI and computing. What We Need A

About the Team OpenAI is building the infrastructure foundation for the next generation of AI. The Data Center Engineering team defines the strategy, reference architectures, technical requirements, and delivery standards for the large-scale data centers that support OpenAI research, products, and infrastructure partners. As a Data Center Infrastructure Electrical Engineer, you will help define, validate, and scale the electrical power systems that support high-density AI compute. You will translate evolving compute requirements into practical facility and rack-power architectures, evaluate new technologies and vendor solutions, and drive technical decisions across design, manufacturing validation, construction, commissioning, deployment, and operations. This role is best suited for a senior hands-on engineer with deep experience in mission-critical power systems, strong judgment under ambiguity, and the ability to connect facility infrastructure, hardware requirements, controls, telemetry, reliability, and operations. About the Role We are seeking a senior electrical infrastructure engineer to lead the development of reliable, scalable, and efficient power architectures for high-density, liquid-cooled AI data centers. The ideal candidate has strong practical experience with critical electrical systems at data centers or comparable industrial scale, including medium-voltage and low-voltage distribution, utility interfaces, backup power, UPS and battery systems, rack power delivery, grounding, protection, controls, and monitoring systems. You should be comfortable moving between long-range architecture, detailed engineering review, lab validation, vendor qualification, field deployment, and operational troubleshooting. Key Responsibilities Design and optimize electrical topologies and equipment strategies that reduce cost, accelerate schedules, improve efficiency, increase scalability, and maintain high reliability and maintainability. Review and develop basis-of-des

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is advancing next-generation packaging technologies that enable the performance and scalability requirements of tomorrow’s AI and high-performance computing applications. Our team brings together experts in process integration, materials engineering, and semiconductor development to solve complex technical challenges and turn new ideas into production-ready solutions. Join us and help shape the future of advanced memory and packaging technology! Position Overview: As a Process Integration Engineer for Advanced Packaging, you will play a key role in developing and integrating advanced package architectures, including 2.5D, 3D stacking, HBM, and hybrid bonding technologies. You will work across engineering disciplines to develop new processes, improve performance and yield, and support the transfer of emerging technologies into manufacturing. This is an opportunity to contribute to innovative products while working on some of the industry's most advanced packaging solutions. Responsibilities: Develop and optimize advanced packaging technologies, including 2.5D/3D integration, HBM, hybrid bonding, and advanced interconnects Design and execute experiments to qualify materials, process flows, and design rules for new package architectures Analyze yield, performance, and defect data to identify process improvements using SPC and advanced analytics Drive

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Join Tenstorrent as a Staff Reliability Engineer and help define the reliability strategy behind the next generation of AI computing systems. In this highly visible technical leadership role, you'll drive reliability from architecture through production, partnering across hardware, software, and manufacturing teams to build high-performance AI platforms that set the standard for uptime, durability, and quality. If you're passionate about solving complex engineering challenges and influencing products at scale, you'll have the opportunity to shape technology powering the future of AI. This role is hybrid, based out of Toronto, Canada. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are You've spent 8+ years in reliability engineering, ideally in high-performance computing, AI hardware, or data center systems. You're comfortable with the statistical side of the job, HALT, HASS, ALT, MTBF, Weibull analysis, and FMEA are all familiar territory. You can work through a technical problem in a thermal lab and then explain the risks and trade-offs clearly to leadership. You're good at bringing people together, mechanical, electrical, thermal, softw

DR ASHWANI KUMAR VIJ : Have been retained by a Well Established, Fast Growing, Mid Size, Professionally Managed and Listed Organisation, manufacturing, marketing and exporting a range of High Quality light Engineering Products and having state of the art manufacturing facilities and ISO Certification for its Domestic and International customers to select 1 Chief Financial Officer ( CFO ) and Preferably for joining in December,2025. KRA for this Senior Management-Executive Leadership role : -Take responsibility (either directly or via staff and would be Supported by a Young Team of High Performing Professionals ) for all cash management, investments, insurance, budgeting, and financial reporting, and help drive the company’s financial strategy and hiring needs. -Coordinate development of annual operating, capital, and program budgets, as well as reporting for the same. -Ensure cash flow is compatible with operations by overseeing day-to-day accounting, recording, reporting, and internal-control activities of the organization. -Would understand and analyse the the current accounting Practices and Trends. -Develop and implement best practices and tools to ensure a well-controlled yet flexible organization that has strong fiscal management, project coordination, cross-team communications, and workflows. -Comply with national and local financial requirements by studying existing and new legislation and taking appropriate action. Job Responsibilities : -Work with senior managers to efficiently develop budget proposals, provide access to project finance information, and ensure contract/grant compliance and reporting. - Research revenue opportunities and economic trends, analyze internal operations, and identify areas for cost reduction and process enhancement. -Perform risk management through analysis of company liabilities and investments, and evaluate and manage capital structure and fundraising initiatives. -Monitor business performance with tracking tools

Job Details: Job Description: As one of the world's largest semiconductor manufacturers, Intel is committed to advancing every aspect of semiconductor technology, from process development and manufacturing to advanced packaging and reliability characterization. Employees within Intel Foundry are part of a global network spanning technology development, manufacturing, assembly, test, and quality organizations across both front-end silicon and advanced packaging facilities. You will join the Foundry Lab Network (FLN), a key organization within Foundry Quality, Reliability, and Labs (FQRL), located at Intel's growing Chandler, Arizona site. This site serves as the technology development hub for Intel's most advanced packaging technologies, including Hybrid Bond Interconnect (HBI), Embedded Multi-die Interconnect Bridge (EMIB-T), glass substrates, Foveros, and future advanced packaging innovations. FLN is actively expanding its laboratory capabilities and capacity to support Intel Foundry's roadmap, enabling faster technology qualification and accelerating development cycles through Quick Turn Monitoring (QTM) solutions that significantly reduce time-to-data. As the Stress Test and Reliability (STaR) Back-End Laboratory Manager, you will play a critical leadership role within FLN. You will partner closely with Packaging Technology Development, Quality and Reliability, and Failure Analysis teams to establish and enhance laboratory capabilities that support qualification and certification of next-generation packaging technologies and products. This position offers a unique combination of people leadership, technical problem solving, and organizational strategy. You will lead a team of 7-10 talented engineers, spearhead cross-functional efforts to resolve complex reliability and technology challenges, drive strong quality and operati