Semiconductor Manufacturing Engineer Jobs

Semiconductor Principal Design Engineer — Tokyo, Japan. Apply via Workday.

Semiconductor Equipment Maintenance Technician — Manassas, VA - Fab 6. Apply via Workday.

Semiconductor Design Engineer, DRAM — Jalisco, Mexico. Apply via Workday.

Semiconductor Design Engineer, DRAM: Senior, Staff, or Principal — Boise, ID - Main Site. Apply via Workday.

New College Grad - Semiconductor Design Engineer, DRAM Products Group — Boise, ID - Main Site. Apply via Workday.

New College Grad - Semiconductor Design Engineer — Boise, ID - Main Site. Apply via Workday.

DOW SkillsBridge Intern – Semiconductor Equipment Technician — 2 Locations. Apply via Workday.

WHAT IS BOX? Box (NYSE:BOX) is the leader in Intelligent Content Management. Our platform enables organizations to fuel collaboration, manage the entire content lifecycle, secure critical content, and transform business workflows with enterprise AI. We help companies thrive in the new AI-first era of business. Founded in 2005, Box simplifies work for leading global organizations, including JLL, Morgan Stanley, and Nationwide. Box is headquartered in Redwood City, CA, with offices across the United States, Europe, and Asia. By joining Box, you will have the unique opportunity to continue driving our platform forward. Content powers how we work. It’s the billions of files and information flowing across teams, departments, and key business processes every single day: contracts, invoices, employee records, financials, product specs, marketing assets, and more. Our mission is to bring intelligence to the world of content management and empower our customers to completely transform workflows across their organizations. With the combination of AI and enterprise content, the opportunity has never been greater to transform how the world works together and at Box you will be on the front lines of this massive shift. WHY BOX NEEDS YOU As an Enterprise Sales Director, you will lead a team of Account Executives that focus on closing pivotal deals in accounts experiencing high growth within the High Tech and Semiconductor verticals. You will join a team of highly motivated sales professionals that take pride in landing new customers, running strategic sales cycles and delivering the Box message to a wide base of accounts across various industries. WHAT YOU'LL DO Hire, train, and manage a team of Enterprise Account Executives Develop Account Executives for career growth within the Box Sales organization Support team in customer on-sites, calls, and meetings Report on sales metrics and forecast to Senior Sales Management Motivate team to exceed objectives throug

半導体エンジニア（2026・2027年卒／既卒歓迎）｜Semiconductor Engineer – Class of 2026/2027 & Recent Graduates — Hiroshima - Fab 15, Japan. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities Analyze inline/param/probe/DOE data to identify yield detractors and drive continuous improvement. Apply semiconductor device physics, process knowledge, and statistical tools to troubleshoot yield issues. Collaborate with module engineering teams to diagnose process/tool‑related yield variation and ensure timely resolution. Lead or participate in cross‑functional task forces to solve complex yield, defect, or process integration challenges. Perform root‑cause analysis using FMEA, 8D, SPC, and other structured methodologies. Publish clear Pareto analyses and maintain dashboards for assigned product lines. Support new technology transfer, process baseline setup, and qualification activities. Partner with equipment engineering, shift engineering, and quality teams to address long‑term defect or excursion issues. Conduct material, process, and equipment evaluations and recommend optimization strategies. Ensure product performance meets design and reliability requirements and propose corrective actions when gaps exist. Leverage AI-Enabled and AI-Assisted solutions, including Copilot, YMS Genie, Agentic AI, AI Agents, and Large Language Models (LLMs), to accelerate yield analysis, automate engineering workflows, summarize insights, and enhance diagnostic efficiency. <spa

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is seeking an experienced Field Application Engineer to champion our revolutionary RISC-V CPU and AI accelerator IP products with customers worldwide. You will own end-to-end technical engagements, translating complex architectural advantages into customer wins while shaping our product roadmap through direct market feedback. If you combine deep technical expertise with exceptional customer engagement skills and want to drive the adoption of next-generation compute IP, join our team. This role is hybrid, based out of the United States or Canada near one of our main office locations. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are A customer-focused engineer with proven success in CPU/GPU/NPU IP sales engagements. Technical expert who can articulate complex architectural benefits and conduct deep-dive analyses. Self-driven professional who independently manages multiple customer relationships from discovery to win. Strategic thinker who identifies customer pain points and positions solutions effectively. What We Need 7+ years in the semiconductor industry with a degree in EE or related field including customer-facing roles i

NVIDIA is looking to hire a Test Engineer in Roskilde, Denmark for the development of silicon photonics and semiconductor devices that will link-up the datacenters of tomorrow. The successful candidate will work on electrical and optical device test program development, including technical management of development projects with multiple partners from across the organization. This role is an opportunity to work on NVIDIA core technology under development. What you'll be doing: Develop and implement electrical semiconductor test programs, collaborating closely with international teams to build solutions that ensure flawless execution. Perform device characterization and conduct data analysis to provide quality feedback to designers. Partner with internal teams to ramp new silicon from development to product and hand over to production teams. Improve yield and reduce test time through innovative solutions. What we need to see: A B.Sc/M.Sc in Electrical Engineering or Physics from a reputable university, or equivalent experience. Demonstrated experience in electrical engineering and programming. Over 2 years of experience in the semiconductor industry. Experience in photonic or semiconductor testing or validation, along with programming languages like Python and VBA. New outstanding graduates will also be considered. Ways to stand out from the crowd: Strong knowledge of probability and statistics tools, such as JMP. A new way of problem-solving that drives success. Experience leading cross-organizational activities with a high sense of responsibility. Join us in our mission to pioneer the next generation of computing and leave a lasting mark on the world. At NVIDIA, you will be part of a

About the Team OpenAI’s Forward Deployed Engineering team partners with leading semiconductor companies to deploy production-grade AI systems across the entire chip design lifecycle: design, verification, and physical design. We operate at the intersection of customer delivery and core platform development, embedding deeply with customers to translate frontier model capabilities into systems that materially improve engineering workflows and accelerate innovation. Our work turns early, high-touch deployments into repeatable solution patterns, reference architectures, and evaluation practices that scale across the semiconductor ecosystem. About the Role We are seeking a highly skilled Physical Design Engineer to join our semiconductor-focused Forward Deployed Engineering team. This is a senior IC role that will begin with a strong emphasis on physical design expertise, technical judgment, advisory leverage, and customer credibility, with the expectation that the person will grow into a broader Forward Deployed Engineering role over time. In the near term, you will serve as the team’s physical design SME across semiconductor deployments: helping FDEs, Product, and Research understand backend implementation workflows, pressure-test AI-assisted solution ideas against real physical design constraints, and raise the quality of our customer-facing technical work. You will help the broader team build fluency in implementation flows, EDA tooling, signoff methodology, and the trade-offs that shape physical design decisions in practice. Over time, we expect this role to expand beyond SME support into broader FDE ownership: partnering directly with customers, shaping deployment strategy, building and iterating production-grade AI systems, driving technical workstreams, and helping turn high-touch semiconductor deployments into repeatable solutions. This is a strong fit for someone who brings deep physical design expertise today and is excited to grow into a customer-facing, syst

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we are transforming how the world uses information to enrich life through innovative memory and storage solutions. The DRAM Thin Films Process Engineering team develops advanced materials and deposition processes that enable future memory scaling, improved device performance, and next-generation semiconductor technology. Our team works at the forefront of process development to support DRAM technologies that power artificial intelligence, cloud computing, and data-intensive applications. As a DRAM Thin Films Process Engineering Intern, you will work alongside experienced engineers on a high-impact summer project focused on semiconductor process development and optimization. This role provides hands-on experience with experimental design, process characterization, data analysis, and multi-functional collaboration. You will contribute to real engineering challenges and present your results to technical and leadership audiences at the conclusion of the internship. Responsibilities Research and develop innovative solutions that support next-generation memory technology and thin film process advancement. Develop, complete, and analyze experiments to improve thin films process performance, manufacturability, and product quality. Apply statistical analysis, data science techniques, and AI-enabled tools to identify process trends, optimize performance, and accelerate engineering decision-making. Partner with process, equipment, and integration engineering teams to solve complex technic

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in artificial intelligence possible! We do it all while committing to integrity, sustainability, and giving back to our communities, because doing so can fuel the very innovation we are pursuing. As a process integration engineer in the DRAM organization, you will be part of a team of world-class engineers who are working in an industry leading 300mm R&D facility on technology which enables future memory scaling. You will focus on the performance and manufacturability of Micron’s cutting-edge next-generation memories. Areas of concentration will include integration and circuit issues specific to DRAM technology. In addition to a broad basis of process integration knowledge, this position will require a strong background in semiconductor device physics. Role interacts significantly with the process development, simulation, modeling, characterization, and reliability groups. Responsibilities include, but not limited to: Lead technology integration activities in enabling manufacturability of state-of-the-art DRAM technology Engage with numerous cross-functional teams including process development, product engineering, design, yield improvement, advanced mask and probe to arrive at solutions to