Senior Chip Design Engineer in United States

About the Team OpenAI’s Forward Deployed Engineering team partners with leading semiconductor companies to deploy production-grade AI systems across the entire chip design lifecycle: design, verification, and physical design. We operate at the intersection of customer delivery and core platform development, embedding deeply with customers to translate frontier model capabilities into systems that materially improve engineering workflows and accelerate innovation. Our work turns early, high-touch deployments into repeatable solution patterns, reference architectures, and evaluation practices that scale across the semiconductor ecosystem. About the Role We are seeking a highly skilled Physical Design Engineer to join our semiconductor-focused Forward Deployed Engineering team. This is a senior IC role that will begin with a strong emphasis on physical design expertise, technical judgment, advisory leverage, and customer credibility, with the expectation that the person will grow into a broader Forward Deployed Engineering role over time. In the near term, you will serve as the team’s physical design SME across semiconductor deployments: helping FDEs, Product, and Research understand backend implementation workflows, pressure-test AI-assisted solution ideas against real physical design constraints, and raise the quality of our customer-facing technical work. You will help the broader team build fluency in implementation flows, EDA tooling, signoff methodology, and the trade-offs that shape physical design decisions in practice. Over time, we expect this role to expand beyond SME support into broader FDE ownership: partnering directly with customers, shaping deployment strategy, building and iterating production-grade AI systems, driving technical workstreams, and helping turn high-touch semiconductor deployments into repeatable solutions. This is a strong fit for someone who brings deep physical design expertise today and is excited to grow into a customer-facing, syst

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is seeking an exceptional Senior-level Physical Design Engineer to drive top-level implementation of our complex AI and CPU System-on-Chip designs. You'll orchestrate cross-disciplinary collaboration, implementing sophisticated floorplans, power grids, and clock networks while ensuring design closure at the chip level. If you excel at managing the complexity of full-chip physical design and want to deliver next-generation AI hardware, we need your expertise. This role is hybrid , based out of Santa Clara, CA or Austin, TX or Fort Collins, CO. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are A seasoned physical design engineer who thrives on complex, full-chip implementation challenges. Expert at collaborating across disciplines, working effectively with architecture, RTL, and packaging teams. Passionate about optimizing chip-level implementations for power, performance, and area. Detail-oriented professional who drives design closure while maintaining quality and meeting aggressive schedules. What We Need 8+ years of top-level SOC physical design experience on complex, multi-million gate designs. Deep expertise in hierarchic

Job Details: Job Description: About the Role Join a team developing next-generation CPU cores that power client, server, IoT, and AI platforms. As a Senior Physical Design Engineer (CPU), you will play a key role in delivering high-performance, power-efficient silicon solutions. You will take ownership of blocks within the CPU core design, driving implementation from RTL to GDS and contributing to advanced physical design methodologies. What You’ll Do Key responsibilities will include but not limited to: Own physical design and implementation of CPU core blocks or subsystems Execute synthesis, floorplanning, place and route, and design closure Perform static timing analysis (STA), power analysis, and physical verification Drive convergence of timing, power, and area (PPA) metrics Debug and resolve complex design issues across multiple design stages Develop and optimize design flows and automation scripts Collaborate cross-functionally with RTL design, verification, clocking, and full-chip teams Contribute to improving design methodologies and best practices Provide guidance to junior engineers where applicable Behavioral traits that we are looking for: Strong problem-solving and analytical thinking Takes ownership and accountability for deliverables Collaborates effectively across multidisciplinary teams Communicates technical concepts clearly and concisely Prioritizes work effectively in a fast-paced environment Continuously learns and applies new tools and methodologies Why Join Us Work on cutting-edge CPU core designs that power client, server, IoT, and AI platforms used worldwide Be part of

Are you ready to contribute to world-class innovation and push the boundaries of what's possible? At NVIDIA, you'll have the opportunity to be part of a team that is driving groundbreaking impacts across various markets. As a Thermal Solutions Development Engineer, you will play a pivotal role in our Silicon Codesign Group, transforming thermal solution concepts into lab-ready builds and beyond. What you will be doing: Build thermal solutions for engineering characterization and validation of next-gen GPU/SOC products, ensuring flawless delivery from concept to lab. Drive end-to-end development and deployment of thermal solutions, collaborating with internal teams and external vendors on build requirements, prototype evaluation, test system integration, and software automation. Improve thermal design processes by incorporating feedback and findings, developing workflow and maintaining our world-class standards. Work closely with system architects, chip and board designers, and software/firmware engineers in a dynamic and high-energy environment to bring industry-defining products to market. Apply AI-enabled approaches and AI tools to accelerate design iteration, test planning, and characterization/validation triage (e.g., requirements/spec summarization, experiment prioritization, log/telemetry summarization, anomaly/outlier detection), improving cycle time, coverage, and traceability while validating outputs against physics, specs, and lab measurements. Partner with AI/tooling teams as the thermal domain SME to define use-cases, success criteria, and evaluation methods; provide feedback to improve tool reliability and usability. What we need to see:

NVIDIA has continuously reinvented itself over two decades. Our invention of the GPU in 1999 sparked the growth of the PC gaming market, redefined modern computer graphics, and revolutionized parallel computing. More recently, GPU deep learning ignited modern AI — the next era of computing. NVIDIA is a “learning machine” that constantly evolves by adapting to new opportunities that are hard to solve, that only we can address, and that matter to the world. This is our life’s work, to amplify human creativity and intelligence. Make the choice to join us today. Design-for-X Engineering at NVIDIA works on groundbreaking innovations involving crafting creative solutions in AI for Chip Design and AI for Predictions in various use cases in manufacturing testing on some of the industry's most complex semiconductor chips. What you'll be doing: As a senior member in our team, you will work on innovating in the DFT Power, Thermal & Voltage Noise Methodology areas. This will include working on groundbreaking low power & thermal solutions for our manufacturing tests to be enabled at conditions that push the boundaries for our datacenter GPUs. You will work with multi-functional teams including Product Development & Power Architecture, implementing brand-new methodologies on hard-to-solve problems for improving our outgoing quality of chips. You will work on post-silicon data analysis for power to architect the next-gen solutions. In addition, you will help develop and deploy DFT methodologies for our next generation products using Applied ML & Gen AI solutions. You will also help mentor junior engineers on test designs and trade-offs including cost and quality. What we need to see: BSEE (or equ

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Principal ASIC Design Engineer About the Role At Micron, we transform how the world uses information to enrich life for all. As a global leader in memory and storage innovation, we develop technologies that accelerate intelligence and enable the next era of AI, ML, and advanced computing. Micron’s Interface Pathfinding team drives performance-scaling innovation across circuits, signaling, packaging, and interconnects with a 3–5 year technology horizon. A core part of that work is silicon-based validation of novel PHY solutions, and we are growing the team to execute. As the Principal ASIC Design Engineer , you will be the primary digital contributor on a deliberately small, senior team — united around the goal of carrying high-speed interface technologies from architecture to tape-out. The team’s analog and chip-level architecture is anchored by a deeply experienced analog custom design engineer; your role is to be the authoritative digital voice — owning RTL design and micro-architecture of the digital blocks, defining timing constraints, supporting verification, and serving as the key interface between the digital design and the analog and layout specialists who will carry the implementation through to silicon. On a test ASIC of this scope, the front-end digital work is the critical path, with contractor and layout support engaged as bandwidth demands warrant. What You’ll Own Digital Block Architecture & RTL Design Own the micro-architecture and RTL implement

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is looking for a mid- to senior-level Physical Design Engineer who will contribute to the physical design of high-performance chips for industry-leading AI/ML architectures, spanning implementation from synthesis through tapeout. You will partner with front-end and physical design engineers to optimize floorplanning, timing, power, performance, and area across multiple IPs. Along the way, you will build end-to-end ASIC expertise while learning from experienced engineers across the chip development process. This role is hybrid , based out of Austin, TX, Fort Collins, CO, or Santa Clara, CA . We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are An engineer excited to work on high-performance designs for industry-leading AI/ML architectures. A collaborative problem solver who enjoys working with experienced engineers across ASIC disciplines. Grounded in logic design fundamentals and gate- and transistor-level implementation. Curious about how early architectural and RTL decisions shape physical implementation and final chip quality. What We Need A BS, MS, or PhD in Electrical Engineering, Computer Engineering, Computer Science, or a relat

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. MTS, Interface Pathfinding Hardware Development Engineer About the Role At Micron, our vision is to transform how the world uses information to enrich life for all. As a global leader in memory and storage innovation, we develop technologies that accelerate intelligence and enable the next generation of high-speed interfaces. Micron’s Interface Pathfinding team drives performance-scaling innovation across circuits, signaling, packaging, and interconnects with a 3–5 year technology horizon. As the Interface Pathfinding Hardware Development Engineer , you will own characterization for a high-speed interface test-chip program: the characterization plan and its success criteria, development of the characterization bench hardware and its automation, the measurement-uncertainty budget, and the correlation report proving the silicon matches the models. You will join a small, senior team spanning analog design, layout, digital design, and verification, working closely with the Chip Lead and the Signal Integrity and Physical Design engineers — driving decisions independently while consulting heavily with other experts across Micron. This is a foundational hire for a growing program. Strong execution early is expected to lead to follow-on projects of increasing scope, team size, and characterization complexity — including an expanding mandate for AI-enabled engineering leadership across the organization. What You’ll Own Characterization Planning • Derive the electr

Build the infrastructure that keeps every NVIDIA chip aligned from first spec to final shipment. NVIDIA's Silicon Co-Design Group sits at the convergence of architecture, silicon, systems, and manufacturing. The System–Manufacturing Architecture (SMAC) team coordinates between system specifications and manufacturing test specifications from pre-silicon POR through production release across GPU, SoC, and CPU programs. When that alignment drifts, silicon faces the consequences: escapes, yield loss, and performance loss. We're hiring a Senior Manufacturing & System Co-Design Workflow Engineer to lead the methodology and infrastructure that maintains holistic, systematic alignment, at scale across the full portfolio. The strongest candidates in this role design the workflow before being asked to fix a program, and build the checks and automation that confirm alignment holds long after they've moved on to the next problem. What you’ll be doing: SMAC Workflow Methodology: Define manufacturing spec types, including schema and semantics, derived from system PORs and features. Own the methodology that governs how specification work gets structured, versioned, and validated across the program lifecycle. Production Python Pipelines & Automated Checks: Develop production-grade Python pipelines and automated checks that catch specification drift between system POR and manufacturing test programs ,ATE, SLT, BLT, L10+, before silicon exposes the discrepancy. The goal is that misalignments surface in the workflow, not on the tester. E2E Program Integration & TPM Attestation: Wire SMAC work into the end-to-end program spine, milestones, gates, and artifacts, and define explicit TPM-driven attestation when checks lag. Alignment can't be assumed; it must be proven at every stage. Agent-Ready Tooling & CI Infrastructure: Integrate tooling into an agent-ready

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role We are looking for a highly experienced RTL engineer to own critical on- and off-chip interconnect components for our custom AI accelerator platform. You will drive the microarchitecture and RTL implementation of scalable on-chip communication fabrics connecting high-bandwidth compute, memory, and I/O subsystems as well as purpose-built off-chip interfaces and protocols needed to enable custom computing at scale. This is a senior, hands-on engineering role with broad technical ownership. You will drive design from requirements through the full silicon lifecycle, from architecture definition and performance analysis through RTL implementation, verification closure, physical design convergence, bring-up, and production readiness. You will plan and oversee the work of junior engineers and help drive and develop productive engineering relationships with external partners and help manage partner execution. This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance to new employees. In this role, you will: Own the microarchitecture, RTL design, and delivery of major SoC interconnect components, including network-on-chip fabrics, switches, routers, bridges, protocol adapters, arbiters, and traffic-management logic as well as off-chip protocol bridges and interfaces. Drive third party engagements to develop novel networking and interface protocols and silicon IP while ensuring high quality and de

At NVIDIA, we push the boundaries of computing innovation. Our ASIC Verification Engineers focus on developing the world’s top SoCs and GPUs. Joining us as a Senior ASIC Verification Engineer - GPU means working on modern technology powering consumer graphics and AI applications. This position is ideal for those passionate about technology and eager to impact computing’s future. What you'll be doing: As a key member of our ASIC Verification team, you will verify the design and implementation of the industry's leading GPUs. You will be responsible for verifying the ASIC build, architecture, golden models, and micro-architecture using advanced verification methodologies such as UVM or equivalent. Understand the design and implementation of your unit/cluster/chip, define the verification scope, develop the verification infrastructure, and verify the correctness of the design. Collaborate with architects, designers, and pre- and post-silicon verification teams to accomplish your task. What we need to see: Bachelor's Degree in EE, CS, or CE or equivalent experience. 5+ years of relevant experience. Experience in verification using random stimulus along with functional coverage and assertion-based verification methodologies. Experience with design and verification tools (VCS or equivalent simulation tools, debug tools like Verdi, Indago, GDB). Expertise in System Verilog or similar HVL. Strong debugging and analytical skills. Perl and C/C++ programming language experience desirable. Strong communication skills and the ability & desire to work as a great teammate are huge pluses. Experience in crafting test bench environments for unit and system level verification. #LI-Hybrid Your base salary will be det

NVIDIA's GPUs and SOCs are the world leaders in power, performance and efficiency. We are continually innovating to deliver new and creative, unusual solutions to extraordinary problems in a wide range of sectors. To this purpose, we are now seeking a hard-working Senior Package Layout Engineer who is committed to making a difference in the world through their contributions! This position will collaborate with Technical Package Lead and different design teams in the design and development of sophisticated, detailed layout of IC substrates for NVIDIA products. In addition, work with design teams to plan schedules, resolve costs, manufacturing, and electrical design issues. What you'll be doing: As part of a Layout team, you will collaborate to implement high speed/density ASIC packages. Perform substrate breakout patterns for ASIC packages. Optimize package pinout incorporating system level trade-offs of pins assignment. Help perform package routing, placement, stack-up, reference plane and power distribution using Cadence APD or SiP tool suite. Propose layout design trade-offs to the Technical Package Lead for resolution and implementation. Conduct design feasibility studies to evaluate the Package design goals for size, cost, and system performance. Develop symbols and CAD library databases using Cadence APD design tools Develop methodologies to improve layout productivity What we need to see: Hold a B.S. Electrical Engineering or equivalent experience 5+ years experience in PCB Layout of graphics cards, motherboards, line cards or other related technology. Experience with HDI designs is a plus Proven experience in substrate layout of wire bond and flip chip packages, preferred Significant background with Cadence AP

NVIDIA has been transforming computer graphics, PC gaming, and accelerated computing for more than 25 years. It’s a unique legacy of innovation that’s fueled by great technology—and amazing people. Today, we’re tapping into the unlimited potential of AI to define the next era of computing. An era in which our GPU acts as the brain of computers, robots, and self-driving cars that can understand the world. Doing what’s never been done before takes vision, innovation, and the world’s best talent. As a NVIDIAN, you’ll be immersed in a diverse, supportive environment where everyone is inspired to do their best work. Come join the team and see how you can make a lasting impact on the world. NVIDIA Silicon Codesign Group is seeking a versatile engineer to join the HW bring-up methodology team. The SCG team is uniquely positioned to have an end-to-end view of the product development cycle - from early architecture definition, through bringup, to product release. What will you be doing: Led end-to-end planning and on-time execution of Nvidia's new chip bringup effort, from pre-silicon through production deployment. Coordinate multi-functional teams across Architecture, Build, Validation, DFT, SW, System, and Operations to drive shared bringup achievements. Improve cross-team communication, work, and handoffs. Develop and standardize methodologies, processes, and workflows for silicon bringup, creating reusable checklists and playbooks. Drive scheduling, equipment, and material logistics to support ambitious NPI and production schedules. Lead post-action reviews and convert learnings into concrete process improvements for future silicon and solution bringups. Contribute to post-silicon learnings that feed back into architecture, design, and pre-silicon

As one of the technology industry's most desirable employers, NVIDIA has been redefining accelerated computing, computer graphics and leading the Artificial Intelligence revolution. NVIDIA's innovation is fueled by its great technology—and amazing people. We are seeking a Senior Silicon and System Product Lead to influence, innovate and take our next generation products to the market. As part of the Silicon Solutions Team, we architect and deliver groundbreaking system solutions that integrate all aspects of the system from silicon design, software design to operations and final deployment in multiple market segments that NVIDIA serves. This position offers an unique opportunity to collaborate with multiple organizations in the company and grow your career in a high impact role. We need a passionate, hard-working and creative individual to lead the products all the way from market analysis to delivering the features on the final product. What you'll be doing: Drive product performance and power targets, trade-off features/configurations and provide innovative solutions to complex silicon and system level problems. Evaluate new market segments and use cases; translate market requirements to engineering problem statements and metrics. Innovate Performance, power, yield and quality optimizations and features for the world’s fastest power-shipping products in the GPU and SoC market segments spanning gaming, automotive, datacenter and DL/AI. Develop methodologies and requirements for multi-functional teams to drive silicon and system product features to production. Incorporate productization feedback to improve the next generation. Lead the team for feature requirements and schedule from architecture to silicon phase of projects. Work alongside system architects, designers, marketing teams, chip and board designers, software/firmware engineers, HW/S

About us Graphcore is one of the world’s leading innovators in Artificial Intelligence compute. It is developing hardware, software and systems infrastructure that will unlock the next generation of AI breakthroughs and power the widespread adoption of AI solutions across every industry. As part of the SoftBank Group, Graphcore is a member of an elite family of companies responsible for some of the world’s most transformative technologies. Together, they share a bold vision: to enable Artificial Super Intelligence and ensure its benefits are accessible to everyone. Graphcore’s teams are drawn from diverse backgrounds and bring a broad range of skills and perspectives. A melting pot of AI research specialists, silicon designers, software engineers and systems architects, Graphcore enjoys a culture of continuous learning and constant innovation. Job Summary Reporting to the Quality leadership within Manufacturing Operations, the Senior Reliability Scientist is responsible for leading reliability activities across complex, high-performance systems. Working closely with established reliability experts and cross-functional teams, this role uses experimental data and advanced modelling to inform design decisions, validate product reliability and optimise serviceability strategies, including spares provisioning. The Team The Quality team within Manufacturing Operations is responsible for ensuring product robustness, reliability and lifecycle performance across Graphcore’s hardware portfolio. The team includes experienced reliability specialists and works closely with technology research, chip, board, system design, platform and operations teams to translate reliability insights into actionable improvements across the product lifecycle. Responsibilities and Duties: · Define and refine reliability requirements across silicon, board and system levels, working in partnership with research and design teams · Apply ad