Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is seeking a Signal Integrity Engineer to join our growing team. The ideal candidate will have a wealth of exposure designing high speed interconnects, breakout design, material trade-offs and verification. A background in electrical engineering, electronics or relevant fields is required. Must love all things high speed! This role is hybrid, based out of Santa Clara, CA or Austin, TX or Toronto, ON. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are You have a Bachelor’s degree in Electrical Engineering (or equivalent) and 5+ years working in high-speed digital design with a focus in high-speed PCB or package design at 10Gbps and above (e.g. 100GbE, GDDR6, PCIe Gen5+). You’re comfortable working with high-speed performance metrics such as ICR, ERL, COM, NEXT, and FEXT as well as knowledge of high-speed connector technologies, including NPO, CPO, and emerging standards. You are proficient with PCB ECAD tools (ideally Cadence Allegro). You communicate clearly (written and verbal), think critically, and love solving complex signal integrity problems. You’re enthusiastic about all things high speed and enjoy collaborating acro
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About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role We’re looking for signal integrity (SI) system design engineers who have a deep expertise in the SI area, and hold strong system level design knowledge This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance to new employees. In this role, you will: Lead system signal integrity (SI) design for AI supercomputer product in the data center application. Collaborate with chip, package, boards, rack and system engineers, design partners to drive system SI design and develop innovative interconnect and high-speed technologies Identify and evaluate new technologies and methodologies to improve signal and power integrity in product design, and contribute to the development of new products and technology by providing expertise in signal integrity Perform simulation and modeling to identify and troubleshoot signal integrity issues Lead system interconnect design, bring up and qualification As the scope of the role and team grows, understand and influence roadmaps for hardware partners for our datacenter networks, racks, and buildings. You might thrive in this role if you: Have at least 10 years of industry experience, including experience design hardware system and SerDes testing for data center applications Have a strong bias toward action, and won’t take no for an answer. Have experience and good knowledge of system design experience in the SI areas, from chip, SerDes, board, rack level Have ex
1671 About the Role We are seeking a Senior Signal Integrity Engineer to develop, validate, and optimize high-speed signaling solutions across blade- and rack-level architectures for advanced compute platforms. This role sits at the intersection of silicon, package, interconnect, board, and system design , with a strong emphasis on hands-on measurement, simulation correlation, and cross-functional technical communication. Key Responsibilities End-to-end signal integrity analysis for blade- and rack-level system architectures. Analyze and optimize high-speed and low-speed I/O interfaces, including PCIe Gen4/5/6, Ethernet, DDR, SerDes, SPI , I2C, etc . and related interconnects. Perform time-domain and frequency-domain simulations using tools such as Ansys HFSS, Keysight ADS, Cadence Sigrity, CST, SPICE , or similar. Support hands-on lab validation using VNA, TDR, BERT, and high-speed oscilloscopes . Correlate simulation results with lab measurements to identify margin gaps, debug issues, and improve design methodology. Collaborate with silicon, package, board, connector, cable, and system design teams to optimize I/O channel performance. Work with interconnect vendors and ODMs to guide board layout, stack-ups, routing rules, and system design decisions. Review schematics, layouts, simulation results, and validation data for blade, backplane, and rack-level hardware. Prepare and communicate clear validation reports, measurement summaries, debug findings, and technical recommendations to internal teams, vendors, and senior technical stakeholders. Required Qualifications Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field . Strong experience in signal integrity for high-speed digital systems. Hands-on measurement expertise using VNAs, TDRs, BERTs, and high-speed oscilloscopes . Experience measuring and analyzing S-parameters, impedance profiles, eye diagrams, jitter, timing margins, insertion loss, return loss, and cro
Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is seeking a senior High Speed Interconnect / Signal Integrity Engineer to design and validate high-bandwidth links for large-scale AI systems. You will define, model, and qualify interconnect solutions across copper and optical technologies for next-generation AI inference and training clusters. This role is on-site in Santa Clara, CA, Austin, TX, or Toronto, Canada. We welcome candidates at various experience levels. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting Who You Are An experienced electrical engineer with a Bachelor’s or Master’s in Electrical Engineering. 5+ years working on high-speed communications (100G–1.6T), including signal integrity, channels, and links. Comfortable building and owning link and channel budgets and making clear tradeoffs between reach, loss, BER, and margin. Hands-on with SI tools and lab equipment such as Keysight ADS, VNAs, TDRs, BERTs, and protocol analyzers. Familiar with cable specification and testing, as well as accelerated life testing, mating life, and failure analysis. Able to collaborate across hardware, systems, and manufacturing teams; manufacturing/DFM/DTM experience is a plus. What We Need Define and specify high-speed interconnect architectures
About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. Role Overview We are seeking an experienced ASIC Package Signal Integrity / Power Integrity Engineer to drive electrical architecture, modeling, optimization, and validation for the most advanced AI/HPC silicon and package design. This role focuses on high-speed SerDes and memory channel architecture, advanced 2.5D/3D package SI/PI, substrate to package co-design, power-delivery-network optimization, electromagnetic modeling, and simulation-to-measurement correlation. The ideal candidate has strong hands-on experience with high-speed channel and PDN analysis across ASIC packages, interposers, substrates, and power-delivery structures, and can translate simulation results into practical design requirements for interposers and package substrate design optimization. The engineer will work closely with ASIC, package, system, mechanical, thermal, power, and silicon validation teams from early architecture and feasibility studies through production bring-up. In this role you will Own SI/PI architecture and analysis for advanced AI ASIC packages from early feasibility studies through production. Develop and optimize high-speed electrical channels for 200G/400G SerDes, PCIe, HBM, DDR, and chiplet/die-to-die interfaces. Perform package, interposer and substrate modeling using 2D/3D electromagnetic solvers. Define and optimize package stack-ups, transmission-line structures, via transitions, breakout structures, return paths, ground shielding, bump maps, and ball maps based on SI/PI re
Signal and Power Integrity Lab Engineer — Boise, ID - Main Site. Apply via Workday.
What you’ll do Act as the in-house electrical lead for Midjourney Medical: own the electrical architecture of the scanner and the technical direction for all board-level design. Own complex board design end-to-end: architecture, schematic capture, layout (high-speed digital, analog/mixed-signal, power), DFM/DFT, fabrication and assembly vendor management, bring-up, and revision control. Write firmware for embedded targets (MCU/SoC): drivers, real-time control loops, safety-relevant logic, bootloaders, and field update paths. Audit and update HDL (FPGA) code for high-throughput data acquisition, timing/synchronization, triggering, and pre-processing of ultrasound and sensor data streams. Define electrical interfaces and data contracts with software, recon/ML and mechanical teams: timing budgets, clocking/sync, signal integrity, connectors/harnessing, and failure modes. Establish electrical engineering rigor: design reviews, schematic/layout review checklists, bring-up procedures, test fixtures, and documentation suitable for a regulated medical device program (DHF, traceability, change control). Mentor and grow the electrical function; select and manage external design partners where leverage is high. What we’re looking for Deep experience designing complex boards from blank page to stable revision, including high-speed digital and analog/mixed-signal domains. Strong schematic and layout skills (Altium/KiCad or equivalent) with real signal integrity, power integrity, grounding, and EMI/EMC instincts. Solid embedded firmware background in C/C++ (and Python for tooling): peripherals, DMA, interrupts, real-time constraints, and debugging on hardware. Practical HDL experience (VHDL/Verilog/SystemVerilog) for data acquisition, timing, and streaming interfaces. Track record of owning bring-up and debug on real hardware: scopes, logic analyzers, and disciplined root-cause analysis. Technical leadership: clear trade-offs, strong written documentation, and the ability to set
About Us: Samara Aerospace is revolutionizing satellite design by addressing the challenges of deploying and managing large satellite constellations. Our innovative Hummingbird spacecraft bus offers a modular and scalable platform that streamlines satellite production and deployment, significantly reducing launch costs. Hummingbird's compact architecture maximizes launch capacity, making it the most efficient and agile spacecraft in the industry. At the core of our technology is the patented Multifunctional Structures for Attitude Control (MSAC) system. Unlike traditional wheel-based pointing control systems, MSAC utilizes actuators embedded in the hinges of deployable solar panels to provide 3-axis attitude control and active jitter cancellation. This design eliminates the need for spinning wheels, reducing mass and potential points of failure, while enhancing pointing precision. Role: The Electrical Engineering team at Samara is seeking an Electrical Engineer to lead the design, layout, and testing of printed circuit boards for spacecraft electronics at our headquarters in San Francisco. This is a startup environment where you will own designs end-to-end, from early concept through production. A strong problem-solving background, hands-on testing skills, and experience with high-density PCB design and electronics integration. You'll work closely with experienced electrical, mechanical, and embedded software engineers to ensure the Hummingbird satellite's electronics are robust, manufacturable, and ready for the space environment. Responsibilities: Own PCB Design from circuit design, schematic capture, and PCB layout through bring up testing. Conduct trade studies that balance electrical performance, signal integrity, thermal management, manufacturability, cost, and schedule. Collaborate with embedded software engineers during board bring-up, debugging, and hardware-software integration. Support spacecraft and board-level integration, including hands-on assi
Job Details: Job Description: The Role and Impact As a GPU Platform Hardware Design Engineer, you will play a pivotal role in designing and developing high-quality GPU hardware platforms that drive innovation in high-performance computing, graphics, and visualization technologies. You will lead the design process from initial feasibility studies through board layout, tapeout, and platform power-on, ensuring robust functionality and compatibility with industry standards. Your expertise in platform-level requirements, electrical engineering applications, and system bring-up will directly contribute to delivering cutting-edge GPU systems that accelerate Intel's leadership in computing. Business group The Data Center Group (DCG) is dedicated to advancing Intel's role in powering the digital world with leading-edge technologies. Focused on delivering innovative solutions for data center and cloud environments, DCG supports high-performance computing and graphics to enable capabilities such as AI, machine learning, and advanced visualizations. As part of the GPU IP Engineering team within DCG, you'll contribute to developing GPU systems that meet the evolving demands of the industry while supporting Intel's broader mission to create world-changing technology. Key Responsibilities - Design, develop, and evaluate electronic components, PCBs, and integrated circuits for GPU hardware platforms. - Translate platform-level requirements into detailed specifications and ensure adherence throughout the design process. - Define component placement and trace routing rules to optimize board layouts for performance, power, and signal integrity. - Conduct feasibility studies, board layout, tapeout, and platform power-on activities. - Perform functionality tests and utilize tools to verify platform configurations and compatibility. - Research, develop, and validate firmware, hardwa
1743 - This position is in Austin, Texas. Position Summary We are seeking an experienced Board-Level Hardware Validation Engineer to define and execute the validation and verification of complex electronic systems throughout the product lifecycle. This role is responsible for defining validation strategies, developing test plans, executing hands-on testing, analyzing failures, and working directly with ODM partners to ensure products meet performance, reliability, quality, and compliance requirements before mass production. The ideal candidate combines strong electrical engineering fundamentals with practical lab expertise and is comfortable personally performing validation activities while coordinating with cross-functional teams and manufacturing partners. Key Responsibilities Validation Strategy & Planning Define comprehensive board-level and inter-board validation plans based on product requirements, design specifications, and customer use cases. Develop validation methodologies covering functional, electrical, thermal, power, signal integrity, reliability, and stress testing. Establish test coverage, acceptance criteria, qualification requirements, and release gates. Review hardware architecture, schematics, component specifications, and interface topologies to identify validation risks early in the design cycle. Define incremental validation and regression coverage for component substitutions, design changes, and firmware updates. Hands-On Validation Execution Develop, automate, and execute validation tests on prototype and production-intent hardware. Perform board bring-up, functional verification, electrical characterization, and system-level integration testing. Validate communication interfaces, control signals, and timing requirements. Verify power sequencing, reset behavior, leakage current, and recovery across operating states. Execute temperature and voltage corner testing against approved operating limits. Use oscilloscopes, logic an
About the Team: OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. In this role you will: As a Hardware Test Engineer, you will work on Machine Learning/AI hardware system projects to craft the solutions for current and future data center deployments. You will bring a strong understanding of hardware system testing, excellent project management skills, and the ability to collaborate across multiple teams to ensure efficient lab operations. You will be responsible for designing, implementing, and executing comprehensive test plans that ensure the reliability, performance, and scalability of our supercomputing hardware systems. You will develop detailed test plans and methodologies tailored to hardware components, including processors, memory modules, custom accelerators and interconnects. You will collaborate with hardware design, manufacturing, firmware teams and vendors to identify, analyze, and resolve issues affecting hardware, power, thermal and high-speed interconnects. You will perform in-depth debugging on the hardware system Excellent analytical skills to diagnose hardware issues, troubleshoot problems, and propose solutions. Ability to interpret complex test data, identify trends, and draw meaningful conclusions. High-speed links, with a focus on SerDes (Serializer/Deserializer) technology to assess signal integrity, error rates, and overall link performance. You will collaborate with the lab manager to maintain the equipment and hardware systems, including oscilloscopes, thermal test chambers, liquid cooling systems, and other mea
Job Summary Reporting to the Memory Validation leadership team, the Senior Silicon DDR/HBM Validation Engineer will be responsible for the bring-up, validation, characterization and debug of advanced memory subsystems used in next-generation AI compute platforms. The role will focus on DDR and HBM technologies, working closely with silicon design, firmware, characterization, platform and systems teams to ensure robust memory subsystem functionality, performance and reliability. The successful candidate will take ownership of significant validation activities, contribute to debug and root-cause analysis efforts, and help improve validation methodologies, automation and infrastructure. The Team The Memory Validation team sits within the Validation organisation and is responsible for the bring-up, validation, characterization and debug of memory subsystems across Graphcore silicon and platform products. The team supports DDR and HBM validation activities throughout the product lifecycle, from first silicon through production readiness. Engineers work closely with architecture, RTL, firmware, characterization, systems and platform teams to ensure memory technologies meet functionality, performance, reliability and performance objectives. Responsibilities and Duties Execute validation and bring-up activities for DDR and HBM memory subsystems Verify memory bring-up software, firmware and scripts against defined project requirements Debug firmware, hardware and system-level issues and contribute to root-cause analysis activities Analyse system logs, validation data and characterization results to identify failures and performance issues Perform PHY characterization and analog-level analysis during stress testing and validation activities Develop and execute functional, stress, performance and corner-case validation tests Perform signal integrity, voltage, frequency and timing measurements using laboratory instrumentation Char
About the Team OpenAI’s Hardware organization develops silicon and system-level solutions designed for the unique demands of advanced AI workloads. The team builds next-generation AI-native silicon and systems while working closely with software, research, and manufacturing partners to co-design hardware tightly integrated with AI models. In addition to delivering systems for OpenAI’s supercomputing infrastructure, the team develops the tools, methodologies, and strategic partnerships needed to accelerate hardware innovation. About the Role We’re seeking an experienced Hardware Strategic Sourcing Manager to own sourcing strategy and supplier partnerships for fiber and optical interconnect components across OpenAI’s next-generation AI infrastructure. Reporting to the Head of Partnerships & Strategic Sourcing, you will lead sourcing across fiber cable assemblies, internal optical harnesses, fiber shuffles, optical backplane assemblies, connectorized and standalone passive optical assemblies, fiber-array units (FAUs), fiber-to-chip and coupling interfaces, detachable connectors, optical routing, and assigned optical packaging, assembly, and test services. You will work closely with electrical engineering, optical engineering, systems engineering, mechanical and packaging engineering, quality, rack integration, data-center deployment,manufacturing, supply chain, finance, legal, and program management teams to translate demanding bandwidth, signal integrity, reliability, and scale requirements into resilient supplier partnerships and scalable commercial strategies. Your work will directly support the performance, reliability, manufacturability, and scale of the high-speed optical connectivity required for OpenAI’s next-generation AI systems. In this role, you will: Develop and execute a comprehensive sourcing strategy for fiber and optical interconnect components supporting high-bandwidth AI systems and infrastructure. Own sourcing across optical fiber cable assembli
About the Team OpenAI’s mission is to ensure the responsible and widespread adoption of artificial intelligence. In support of that mission, the Ads Solutions team partners closely with advertisers to deeply understand their businesses and needs, helping inform the development of products and solutions that drive meaningful revenue growth and long-term success on the platform—while maintaining strong standards for user trust and platform integrity. About the Role We’re looking for an Ads Solutions Engineer to partner with advertisers and agencies throughout the pre-sales and growth lifecycle, helping them successfully evaluate, launch, and scale on OpenAI’s advertising platform. You will serve as the technical expert in the sales process, translating advertiser objectives into scalable technical solutions across measurement, integrations, data activation, and campaign execution. This role sits at the intersection of sales, product, and engineering. You’ll work closely with Client Partners, Customer Success Managers, Product, Engineering, Policy, and Operations teams to remove technical blockers, accelerate revenue growth, and shape the future of OpenAI’s ads platform. This role is based in our San Francisco HQ and we offer generous relocation support for new hires. In this role, you will: Partner with Client Partners during the sales cycle to provide technical expertise that unlocks new business and accelerates deal closure. Lead technical discovery with advertisers and agencies to understand data flows, martech stack, measurement requirements, and activation goals. Design and recommend implementation approaches for pixels, APIs, server-to-server integrations, identity solutions, offline conversions, and measurement frameworks. Guide advertisers through onboarding and launch readiness, ensuring successful setup of tracking, attribution, audience signals, and reporting. Troubleshoot technical issues related to implementation, signal quality, delivery, and measurement
About the Team OpenAI’s mission is to ensure the responsible and widespread adoption of artificial intelligence. In support of that mission, the Ads Solutions team partners closely with advertisers to deeply understand their businesses and needs, helping inform the development of products and solutions that drive meaningful revenue growth and long-term success on the platform—while maintaining strong standards for user trust and platform integrity. About the Role We’re looking for an Ads Solutions Engineer to partner with advertisers and agencies throughout the pre-sales and growth lifecycle, helping them successfully evaluate, launch, and scale on OpenAI’s advertising platform. You will serve as the technical expert in the sales process, translating advertiser objectives into scalable technical solutions across measurement, integrations, data activation, and campaign execution. This role sits at the intersection of sales, product, and engineering. You’ll work closely with Client Partners, Customer Success Managers, Product, Engineering, Policy, and Operations teams to remove technical blockers, accelerate revenue growth, and shape the future of OpenAI’s ads platform. This role is based in our San Francisco HQ and we offer generous relocation support for new hires. In this role, you will: Partner with Client Partners during the sales cycle to provide technical expertise that unlocks new business and accelerates deal closure. Lead technical discovery with advertisers and agencies to understand data flows, martech stack, measurement requirements, and activation goals. Design and recommend implementation approaches for pixels, APIs, server-to-server integrations, identity solutions, offline conversions, and measurement frameworks. Guide advertisers through onboarding and launch readiness, ensuring successful setup of tracking, attribution, audience signals, and reporting. Troubleshoot technical issues related to implementation, signal quality, delivery, and measurement
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