Soc Power And Performance Engineer Jobs

NVIDIA is now looking for a Senior Memory System Engineer to join our ASIC Memory Subsystem team! As a Senior Systems Engineer at NVIDIA, you'll join a group of hardworking engineers to develop and architect innovative Memory Solution for Tegra SoCs. In this position, you'll make a real impact in a multifaceted, technology-focused company. You will work with memory controller/PHY and Platform / System architect, Firmware, SI/PI, Memory suppliers to design and architect cutting edge, high speed and lower power memory technology for NVIDIA CPUs and SOCs. What You Will Be Doing: Analyze future DDR/LPDDR/HBM technologies to determine optimum performance, power, function and RAS in memory for Next generation SOC and Systems. Collaborate with ASIC Architects, Designers, Software and Firmware SW/FW teams to drive memory technology and associated requirements for memory controllers. Define Memory module, Package, and PCB layouts appropriate to the system workloads Debug and bring up memory evaluation / validation and failure issues on memory technology. Collaborate with DRAM suppliers and industry partners on to develop memory and memory related component technology. What We need to see: Bachelor's degree or master’s degree in Electrical Engineering, Computer Engineering (CE), or a related field (or equivalent experience) 10 years of proven track record in DRAM design, module design, or memory sub system design. Deep understanding and strong fundamental of memory design, features, ECC algorithm, SI and PI (Training algorithm) in DDR, LPDDR, and HBM. Strong understanding of memory sub system level interaction with Cache, Memory controller and PHY. Experience in the design, bring-up and validation for memory failure analysis Experience with Python, C/C

Graphcore Director-Post Silicon Validation (Functional) Graphcore is a globally recognised leader in Artificial Intelligence computing systems. The company designs advanced semiconductors and data centre hardware that provide the specialised processing power needed to drive AI innovation, while delivering the efficiency required to support its broader adoption. As part of the SoftBank Group, Graphcore is a member of an elite family of companies responsible for some of the world’s most transformative technologies. We are opening a new AI Engineering Campus in Austin, Texas which will play a central role in Graphcore's work building the future of AI computing. We are developing the next generation of AI compute, a large-scale system-on-chip (SoC) designed to power future high-performance AI systems. Job Summary We have an exciting opportunity to be part of a collaborative, cross-functional development team validating cutting-edge, high-performance AI chips and platforms. You will play a key role in supporting new product introductions and validation. You will lead a team delivering post-silicon validation across the full AI SoC, working across silicon, firmware, and platform levels. The role requires a deep technical understanding, strong hands-on debug experience, and the ability to collaborate effectively with hardware, software, and systems engineering teams. Working within the Validation team, you will be involved with bringing first silicon to life, functionally validating it and working closely with many other teams to help it become a fully characterised and working product, reporting project status/progress to program management on a regular basis. You will have the opportunity to provide technical guidance to other engineering team members. In this role, you can leverage our experience and industry knowledge to architect and drive implementation of continuous improvements to test infrastructure and processes. Th

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is seeking a SoC Design Verification Engineer to lead pre-silicon verification of the Beowulf SoC, with focus on the Compute Subsystem (CSS), DDR memory subsystem, and Fabric NoC. This role will drive coverage, coherency, memory traffic, connectivity, error handling, and bring-up features critical to silicon success. This role is hybrid, based out of Boston, MA; Toronto, ON; or Santa Clara, CA. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are Deeply curious about SoC architecture, compute systems, DDR behavior, and Fabric NoC/interconnect verification. Expert in UVM, SystemVerilog, coverage-driven verification, assertions, and subsystem-level debug. Experienced in verifying compute subsystems, DDR controllers and PHY-facing logic, NoC/interconnect protocols, coherency, ordering, and data movement. Comfortable with reset, power management, error handling, performance, and high-concurrency system scenarios. Proactive, detail-oriented, and effective in cross-functional technical discussions. Familiar with Python, C/C++, Tcl, CocoTB, or similar verification automation tools. What We Need Develop and own scalable verification environmen

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a SoC Design Engineer, you will be part of the Heterogeneous Integration Group (HIG), contributing to the design, development, and integration of next‑generation HBM SoC logic die. You will work closely with architecture, verification, physical design, firmware, and product teams to implement robust, high‑performance SoC solutions that meet ambitious power, performance, area, and schedule targets. You will also work to enable and integrate AI-driven tools and AI-enabled workflows into the team's methodologies. Key Responsibilities Design and implement RTL for SoC‑level blocks and subsystems used in HBM logic die. Integrate internal and third‑party IP (e.g., controllers, microcontrollers, NOC, RAS, MBIST, interfaces, adapters, buffers, PHY‑adjacent logic). Collaborate with SoC architects to translate architectural and micro‑architectural specifications into high‑quality RTL implementations. Participate in SoC‑level integration activities, including clocking, reset, power intent, and configuration infrastructure. Assist with pre‑silicon validation and post‑silicon bring‑up, including root‑cause analysis of silicon issues. Contribute to design documentation, block specifications, and design reviews. Collaborate multi-functionally with Product Engineering, Test, Probe, Process Integration, and Manufacturing to ensure robust and manufacturable builds. Minimum Qualifications Bachelor’s or master’s degree in electrical engineering, Computer Engin

NVIDIA is searching for a highly motivated, creative engineer with experience in system and AI software to join the GPU System Software team. As someone who is hardworking and passionate about their work, you will design key aspects of our production GPU kernel drivers, embedded SW and SOC platforms. You should demonstrate the ability to excel in an environment with complex software and hardware designs. What you'll be doing: Define, design, develop and verify features for our new SoCs platforms, collaborating with hardware engineers and fellow software engineers. Follow the new SOC platforms all the way through the development process to the customer products that are used throughout the world. Be heavily involved with the early firmware, performance, power management, and all of system software required to produce our world-class products. Have multiple opportunities to collaborate and communicate effectively with teams across the globe. What we need to see: BS, MS or PhD degree in Computer Engineering, Computer Science, or related degree, or equivalent experience. Strong C programming, C++, low-level driver, SOC system platform experience , and AI software design, arch and optimization. Familiarity with computer system architecture, microprocessor, and microcontroller fundamentals. Kernel experience with Linux, Android, Chrome, or Windows systems. Experience with complex

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role We are seeking an experienced SoC Architect to lead the definition and development of next-generation custom AI silicon for edge deployments. This role will be responsible for shaping the architecture of highly efficient, high-performance SoCs optimized for machine learning inference and on-device intelligence. You will work cross-functionally with internal engineering teams and external ecosystem partners to translate product requirements into scalable silicon solutions, driving execution from concept through delivery. In this role you will: Define the architecture and technical roadmap for custom SoCs targeted for edge applications. Drive system-level tradeoff analysis across compute, memory, interconnect, power, thermal, and cost constraints. Architect energy-efficient ML compute subsystems optimized for inference workloads and real-world deployment environments. Collaborate with internal hardware, software, systems, and product teams to align architecture with platform needs. Partner with external silicon vendors, IP providers, and manufacturing partners to execute development plans. Lead hardware/software co-design efforts to maximize performance per watt and end-to-end system efficiency. Guide implementation teams through microarchitecture, RTL development, validation, and bring-up phases. Operate effectively in agile development environments and help teams deliver against aggressive schedules and milestones. You might thrive in this role if: Proven exper

EnCharge AI is a leader in advanced AI hardware and software systems for edge-to-cloud computing. EnCharge’s robust and scalable next-generation in-memory computing technology provides orders-of-magnitude higher compute efficiency and density compared to today’s best-in-class solutions. The high-performance architecture is coupled with seamless software integration and will enable the immense potential of AI to be accessible in power, energy, and space constrained applications. EnCharge AI launched in 2022 and is led by veteran technologists with backgrounds in semiconductor design and AI systems. Senior Emulation Engineer Location: India - Remote Job Description: At EnCharge AI, we are building the next generation of AI compute silicon — purpose-built for high-performance, low-power, and scalable AI inference. As an Emulation Engineer, you will play a critical role in validating complex AI accelerator architectures on emulation platforms before tape-out. This position is ideal for someone passionate about bridging the gap between hardware and software in fast-paced, deep tech environments. Responsibilities: • Set up and maintain Siemens Veloce emulation and prototyping platforms • Adapt SoC designs for Emulation and Prototyping • Develop and debug emulation testbenches and system-level environments • Support pre-silicon validation, power/performance analysis, and early software bring-up. Participate in silicon bring-up and validation. • Collaborate with design and verification teams to isolate design issues and accelerate debug. • Optimize performance of the emulation workloads and reduce turnaround time. • Work with firmware/software teams to enable use of emulators for OS and driver testing. Required Background: • BS/MS/Ph.D. in EE, CS, or related field with 7+ years of SoC design experience. • Experience with emulation platforms (Veloce, Palladium, or ZeBu) and FPGA-based prototyping systems (proFPGA, HAPS, or Protium) • Experience with emula

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is seeking an exceptional Senior-level Physical Design Engineer to drive top-level implementation of our complex AI and CPU System-on-Chip designs. You'll orchestrate cross-disciplinary collaboration, implementing sophisticated floorplans, power grids, and clock networks while ensuring design closure at the chip level. If you excel at managing the complexity of full-chip physical design and want to deliver next-generation AI hardware, we need your expertise. This role is hybrid , based out of Santa Clara, CA or Austin, TX or Fort Collins, CO. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are A seasoned physical design engineer who thrives on complex, full-chip implementation challenges. Expert at collaborating across disciplines, working effectively with architecture, RTL, and packaging teams. Passionate about optimizing chip-level implementations for power, performance, and area. Detail-oriented professional who drives design closure while maintaining quality and meeting aggressive schedules. What We Need 8+ years of top-level SOC physical design experience on complex, multi-million gate designs. Deep expertise in hierarchic

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is seeking talented Physical Design Engineers to implement high-performance partitions for an industry-leading AI SOC. You'll own the complete implementation flow from synthesis to tapeout, working alongside world-class engineers to push the boundaries of performance, power, and area. If you're passionate about crafting silicon that powers the future of AI computing and thrive on solving complex design challenges, we want you on our team. This role is hybrid, based out of Austin,TX or Santa Clara, CA or Fort Collins, CO. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who you are Experienced with synthesis and place-and-route flows, especially using Synopsys Design Compiler / Fusion Compiler and IC Compiler II. Comfortable in a small, cross-functional physical design team, owning a block or subsystem and partnering on tapeout milestones with clear communication and accountability. Ideally bring extra depth in areas such as UPF/multi-voltage power domains, SoC interface IP integration (e.g. I3C, UART), signoff breadth (DRC/LVS, EM/IR, LEC/Formality), multi-clock/CDC-aware implementation, PLL/DLL integration, and DFT-aware physical implementati

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is seeking talented Physical Design Engineers to implement high-performance blocks for our industry-leading CPU and AI/ML architectures. You'll own the complete implementation flow from synthesis to tapeout, working alongside world-class engineers to push the boundaries of performance, power, and area. If you're passionate about crafting silicon that powers the future of AI computing and thrive on solving complex design challenges, we want you on our team. This role is hybrid , based out of Austin, TX, Santa Clara, CA or Fort Collins, CO. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are A hands-on engineer with deep expertise in SOC/ASIC physical design and a track record of successful tapeouts. Passionate about optimizing PPA through innovative implementation techniques and close RTL collaboration. Strong problem solver who excels at debugging complex issues across design hierarchies. Collaborative team player who thrives in fast-paced, technically challenging environments. What We Need BS/MS/PhD in EE/ECE/CE/CS with proven experience in synthesis, PnR, and timing closure on taped-out designs. Expertise with industry-

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is seeking a talented Physical Design Engineer to implement high-performance blocks for our industry-leading CPU and AI/ML architectures. You'll own the complete implementation flow from synthesis to tapeout, working alongside world-class engineers to push the boundaries of performance, power, and area. If you're passionate about crafting silicon that powers the future of AI computing and thrive on solving complex design challenges, we want you on our team. This role is hybrid, based out of Austin, TX or Santa Clara, CA or Fort Collins, CO. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are A hands-on engineer with deep expertise in SOC/ASIC physical design and a track record of successful tapeouts. Passionate about optimizing PPA through innovative implementation techniques and close RTL collaboration. Strong problem solver who excels at debugging complex issues across design hierarchies. Collaborative team player who thrives in fast-paced, technically challenging environments. What We Need BS/MS/PhD in EE/ECE/CE/CS with proven experience in synthesis, PnR, and timing closure on taped-out designs. Expertise with industry-stan

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Firmware Test Engineer at Micron Technology, Inc., you will build groundbreaking high-performance controller firmware test framework for volatile and non-volatile memory systems. You will assist in the evaluation, creation, build, bench testing, debugging, and failure analyzes of firmware for new high-performance memory controllers and Solid State Drives (SSD) that will improve performance, while reducing power, latency and SoC (System on Chip) complexity for the target sectors. You can expect to partner multi-disciplinary Engineers seek multi-functional product development issues. You will triage failures, file bug reports, and help the development teams with isolating issues. Experience / Skills: 8 to 12 years of experience in managing the test development team within the storage domain. In depth knowledge and extensive experience with embedded firmware development Expertise in the use of scripting languages, programming tools and environments Extensive experience programming in Python Technical Expertise in the storage industry in SSD, HDD, storage systems, or a related technology Understanding of storage interfaces including ideally PCIe/NVMe, SATA, or SAS Experience with NAND flash and other non-volatile storage Ability to work independently with a minimum of day-to-day supervision Experience with team leadership and/or supervising junior engineers and technicians Ability to work in a multi-functional team and under

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Firmware Engineer at Micron Technology, Inc., you will build groundbreaking high-performance controller firmware for volatile and non-volatile memory systems. You will assist in the evaluation, creation, build, bench testing, debugging, and failure analyzes of firmware for new high-performance memory controllers and Solid State Drives (SSD) that will improve performance, while reducing power, latency and SoC (System on Chip) complexity for the target sectors. You can expect to partner multi-disciplinary Engineers seek multi-functional product development issues. You will triage failures, file bug reports, and help the development teams with isolating issues. Experience / Skills: 4+ Years of experience in managing the test development team within the storage domain. In depth knowledge and extensive experience with embedded firmware development Expertise in the use of scripting languages, programming tools and environments Extensive experience programming in Python Experience in the storage industry in SSD, HDD, storage systems, or a related technology Understanding of storage interfaces including ideally PCIe/NVMe, SATA, or SAS Experience with NAND flash and other non-volatile storage Ability to work independently with a minimum of day-to-day supervision Experience with team leadership and/or supervising junior engineers and technicians Ability to work in a multi-functional team and under the pressure of multiple priorit

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. This Notice is provided as a result of the filing of applications for permanent alien labor certification for the positions noted below. Any person may provide documentary evidence bearing on an application to the Certifying Officer, U.S. Department of Labor, Employment and Training Administration, Office of Foreign Labor Certification, 200 Constitution Avenue NW, Room N–5311, Washington, DC 20210. Employer: Micron Technology, Inc. Job Title: Firmware Engineer Job Requisition: JR42883 Job Location: Longmont, Colorado Job Type: Full Time Rate of Pay: $100,000 to $254,000 Duties: Develop high-performance controller firmware for innovative volatile and non-volatile memory systems. Assist in evaluating, designing, building, bench testing, debugging, and failure analyzing firmware for new high-performance memory controllers and Solid State Drives that will increase performance, while reducing power, latency and SoC (System on Chip) complexity for the target markets. Work closely with system test engineers, system failure analysis engineers, firmware engineers, firmware test engineers, system hardware design engineers, product engineers, memory design engineers, firmware tools developers, and production engineers to solve cross-functional product development issues. Validate customer requirements and perform failure analysis on FW related issues. Develop structure

NVIDIA’s Silicon Co-Design Group is the team that gets every GPU, SoC, and CPU silicon program from first power-on to high-volume production. We are hiring a Senior Manager to lead our Test, Manufacturability, Reliability & Quality (TMRQ) organization. This is not a coordination role . Your work decides if a product can be built at scale and trusted in the field. These include production test development (SLT, BLT), control run flow, system reliability stress (HTOL), platform- and board-level manufacturing issue closure, and field diagnostic test development. You lead a team of individual contributors and a first-line manager at the layer where silicon, platform, and software collide with manufacturing reality. Decisions you make show up in yield curves, production ramp , and customer escapes. You are the leader the program turns to when a build is stuck, a control run is fallout-heavy, or a field return points back at silicon . The exceptional hire also uses AI deliberately — with demonstrated workflow impact and the judgment to know where it compresses real work and where it introduces risk. What you will be doing: Keep programs moving. Own the technical execution and velocity of SLT, BLT, Board/Chip/Rack CR, and system reliability stress (HTOL) across every GPU, SoC, and CPU silicon program. Close the hardest multi-functional failures. Resolve Vmin and binning escapes, performance shortfalls, and power anomalies by driving root-cause across design, methodology, DFT, ATE, package, software/firmware, and manufacturing — and own the WARs and productized fixes through to confirmation. Give leadership the clarity to act. Convert raw integration signals — CR fallout, BLT/SLT yield, SHTOL/CHTOL data, RMA trends, customer escalations — into decision-ready options that enable executive leadership to act with confidence on POR, QS/PS gates, a