Staff Principal Product Engineer Jobs

Traditional engineering roles hand you a task and ask you to implement it. This one hands you a problem and a fleet of AI agents and asks you to ship the solution. The Product Engineer / Builder is a Staff/Principal level individual contributor role , for someone who takes a defined problem and owns the solution end to end. You understand the customer and the problem, then design, build, and ship working software, using AI agents as your primary means of turning direction into product. You combine deep engineering craft with genuine product instinct, and act as a force multiplier rather than a single pair of hands. How You’ll Work Given a problem to solve, you shape the approach and use AI to bring it to life by directing several AI agents in parallel and rigorously reviewing what they produce. An idea sketched in the morning can be a functional prototype by lunch and a working product by the end of the week . You think like a product manager, care like a designer, and build like an engineer. This is not a role for someone who waits to be told exactly what to type. You bring taste and judgment to every decision. It’s your responsibility to know what to build, what not to build, and to prove — through evals, testing, and review — that AI-generated work is reliable enough to ship. You measure success in customer and business outcomes, not tasks completed. Build on What Works, Invent Where It Counts Build rapidly by composing solutions from the best available tools, whether internal or external, and apply your own innovation where it matters most. That means drawing on proven platforms, components, services, and models instead of building everything from scratch, then adding original thinking where there are gaps to close, experiences to elevate, or clear opportunities to differentiate. You know when to leverage what already works, when to extend it, and wh

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Description Summary The Probe Product Engineer in STPG Product Engineering owns probe strategy and silicon learning at wafer test, spanning pre‑silicon design‑to‑probe staging, first‑silicon bring‑up, qualification, and high‑volume manufacturing (HVM). This role is accountable for defining probe coverage intent, establishing limits and guard‑bands grounded in silicon behavior, and driving yield, quality, and test‑cost outcomes. The focus is on interpreting design intent, device operation, and process interactions, and translating product risk into robust, manufacturable probe strategies aligned with downstream test and customer requirements. The engineer works closely with Design, DFT, Design Validation (DV), Process Integration, Backend Test, and Reliability teams to ensure probe solutions are technically sound, scalable, and product‑centric across the lifecycle. Key Responsibilities Probe Coverage Strategy & Ownership Define and own probe coverage intent by mapping design features, device behavior, and process risks into probe observability, screening mechanisms, trims, and guard‑bands. Define, release, and sustain probe test flows from first silicon through qualification and HVM, ensuring coverage objectives

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key leader within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving Media Health Manufacturing and activities for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. You will lead a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. This include lead the manufacturing test flow development and validation, improve the device/stacked yield with most optimized extrinsic and intrinsic reliability through in depth circuit debug, test coverage optimization and strategy innovation, test time improvement for manufacturing flow and drive the DFT (design for test) strategy to stage new ideas to improve cost, cycle time and quality. You will also collaborate with cross functional team (Fab, Product Leads, Design, Technology Development, Design, Test Solution Engineering etc) with diverse expertise to achieve both strategic and tactical objectives and stay ahead on technology and product leadership. The future of HBM are exciting and dynamics. Micron is seeking experienced individuals that find technical challenges engaging and invigorating. Responsibilities: Optimized Test Coverage: The resp

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key talent within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving both intrinsic and extrinsic reliability test development and execution for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. Your responsibility is to drive extrinsic DPM reduction (Time 0 and Field DPM) and lead the intrinsic reliability charter, along with optimized Manufacturing Test Flow to meet critical KPI’s Quality, Cost and Cycle Time. You will be leading the team to characterize the products from reliability aspect, identify the reliability gaps, working on root cause and resolution of qual and RMA failures pertaining to defectivity and intrinsic reliability margin and drive fab process improvement driven by the qual failures. Additionally, your team will also be the key person in frontend process conversion, where you will work with Fab, TD, GQ teams to establish robust business process for process conversions to facilitate yield improvements, DPM and Cost Reduction. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. The future of HBM are exciting and dynamics

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate, and advance faster than ever. As a Product Engineer working directly in support of the NAND Product Development Team Leader, your role involves collaborating with cross-functional teams to propel new product development and spearhead the integration of AI solutions into actionable strategies and plans. In this capacity, you represent the NAND engineering team, engaging with strategic partners such as business units, quality assurance, fabrication, testing, and supply chain to ensure a competitive time-to-market for the newest technology nodes, from silicon to system. This role is highly impactful, offering broad scope and high visibility. It presents an opportunity to contribute to Micron’s next generation of technology and product enablement alongside a dedicated and highly skilled cross-functional team. Key Responsibilities: Negotiate and align NAND requirements with business units and SSD development leads, transforming these requirements into qualification specs that guide NAND develop

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is the fastest growing semiconductor company in India offering a wide & attractive range of career opportunities. One of the rapidly growing functions within Micron India is the Micron SDV (Silicon Design Validation) team in Hyderabad and the team is looking to hire for the position of NAND Silicon Design Validation Product where you will be responsible in the development, validation, characterization, and qualification of new pioneering NAND Flash memory products. There is a tremendous scope for individual learning and career growth in this role. In addition to the SDV responsibilities, you will also work multi-functionally with NAND R&D, Design, and other various engineering teams towards new product startup , define, validate & deliver product specifications and requirements. Also, Product Engineers are the key product-specific point of contact with high visibility for critical issues and act as the main interface between Research and Development, Manufacturing, Business Units, and Quality Assurance departments. Job Responsibilities Responsibilities include, but not limited to: Characterization, debug, and validation of NAND including digital and analog circuitry from ONFI performance perspective . Partnering with fabric

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is the fastest growing semiconductor company in India offering a wide & attractive range of career opportunities. One of the rapidly growing functions within Micron India is the Micron SDV (Silicon Design Validation) team in Hyderabad and the team is looking to hire for the position of NAND Silicon Design Validation Product where you will be responsible in the development, validation, characterization, and qualification of new state-of-the-art NAND Flash memory products. There is a tremendous scope for individual learning and career growth in this role. In addition to the SDV responsibilities, you will also work multi-functionally with NAND R&D, Design, and other various engineering teams towards new product startup , define, validate & deliver product specifications and requirements. Also, Product Engineers are the key product-specific point of contact with high visibility for critical issues and act as the main interface between Research and Development, Manufacturing, Business Units, and Quality Assurance departments. Responsibilities include, but not limited to: Leading validation projects from start to finish - bringing up overall coverage plan during post-silicon phase, planning development timeline, planning and implementing test development before silicon availability, taking

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Lead and drive global Product Integration initiatives to improve yield, quality, and benchmark performance across technology nodes and products. Centralize and synthesize project information (design requirements, test challenges, yield learning) from multiple global teams and drive execution to closure. Drive yield breakthroughs by understanding the end‑to‑end test flow , product design and operation, packaging interactions, and manufacturing processes while balancing yield vs. reliability requirements. Foster technical innovation by characterizing device failure modes using deep knowledge of device architecture, physics, packaging interaction, and available test/process knobs . Define and drive strategies to ensure Packaging Technology and Chip‑Package Interaction are developed and qualified ahead of product qualification . Lead cross‑functional and cross‑site taskforces (Product, Test, Yield, Design, Fab, Packaging, Quality, TD) to resolve yield and quality challenges in a timely manner. Promote network Best‑Known‑Method (BKM) development, standardization, and business process creation or re‑engineering to improve productivity and efficiency. Maintain strong working relationships with stakeholders in Fab, Technology Development, Product Engineering, Test Engineering, Quality, and Packaging teams . Communicate project status, risks, an

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We’re building the next generation of DRAM technology and pushing what’s possible at the intersection of device physics and circuit design. Our team thrives on solving deep technical challenges and turning innovative ideas into high-performance, manufacturable memory solutions. If you’re excited about influencing future technology nodes and working on designs that ship at scale, you’ll feel right at home with us! As a Staff/Principal DRAM Design Engineer, you’ll play a critical role in shaping memory architectures and circuit innovations that directly impact product performance, power, and reliability. This is a hands-on design role where your expertise will drive key decisions from concept through silicon validation, while collaborating with cross-functional teams to deliver meaningful results. Responsibilities: Lead design and optimization of DRAM circuits including memory array, control logic, datapath, and test logic Perform and analyze circuit simulations using tools such as SPICE and Verilog Evaluate architectural trade-offs impacting power, performance, and die size Integrate layout parasitics into simulations and drive design for manufacturability Define validation strategies including test chip development and silicon bring-up Minimum Qualifications: Bachelor’s degree in Electrical Engineering or related field 5+ years of circuit design experience or product engineering experience Strong understanding of analog and digital

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Additional Responsibilities Align TDT CMOS Device development and transfer objectives with Technology Development sites. Drive and ensure close collaboration with Design, TCAD, Modeling, and Product Engineering groups across Micron sites. Collaborate with process integration module owners and process owners to drive electrical characterization of CMOS devices and CMOS circuits and identify device improvement opportunities. Utilize technology development and transfer knowledge to develop new technology nodes to mature manufacturing capability while achieving key program metrics. Ensure CMOS devices meet electrical, performance, power, variability, and reliability targets required for product success. Drive close collaboration with device and process integration development groups at other Technology Development sites. Collaborate closely with manufacturing fabs to facilitate successful technology transfer and production ramp. Contribute to the fundamental understanding of CMOS technology and its impact on overall product figures of merit. Lead cross-functional exploration and development of future CMOS device architectures, including non-planar transistor technologies, by partnering with Device, TCAD, Process Integration, Design, and Manufacturing teams to enable future DRAM technology roadmaps. Drive adoption of AI, machine learning, advanced analytics, and engineering automation solutions to accelerate technology development, r

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is the fastest growing semiconductor company in India offering a wide & attractive range of career opportunities. One of the rapidly growing functions within Micron India is the Non-Volatile Engineering (NVE) System Integration (Solution) Product Engineering team in Hyderabad which is responsible for the integration of new non-volatile products into various system solutions (SSD, UFS, uSD ), end- to-end product challenges being solved for maximum value and streamlin ing of overall development effort, complexity, and risk. We enable parallel NAND and System development through feature optimization and innovative solutions, demonstrating technical expertise o n both sides. Responsibilities: System triage activities through failure analysis on both NAND Component and System-level to identify sources of failure, drive issue-based taskforces to establish solutions & unblock critical system development. Innovations in system triage methodology <span

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Staff/Principal NAND CMOS Module Process Integration Engineer in the Singapore R&D department at Micron Technology Inc., you will be responsible for designing, developing, integrating, and implementing innovative and effective process solutions to improve next-generation 3D NAND Product Yield and Quality with competitive cost and performance within the required timeline. Your responsibilities will include, but are not limited to, the following: Identify and quantify key module deficiencies and technology gaps. Lead cross-functional teams to address these issues. Improve current process flows and develop innovative solutions to meet product requirements and manufacturability Develop or redefine CSPEC criteria for optimal product performance and drive activities to ensure manufacturing process capability Coordinate activities at the manufacturing site to secure funding for experiments, and conversions, and effectively communicate decisions to relevant R&D, Product Engineering, and Manufacturing partners Undertake development projects to evaluate and implement new integration schemes for alpha and derivative part types. Establish proof of concept for future tech nodes at the manufacturing facility Take on a leadership role at quar

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Responsibilities: Reliability Test Flow Development: Define and develop reliability stress, test flows and test plans to cover all Product Reliability aspects. Reliability Test Plan and Execution: Work closely with Global Quality team to define qualification plan, review and manage the qualification execution progress, and drive for qualification gating issue resolution. DPM reduction : Drive down and achieving Extrinsic Reliability (Time 0 and Field DPM) and Intrinsic Reliability through Optimized Manufacturing Test Flows and Test Strategy to meet critical KPI’s Quality, Cost and Cycle Time Root Cause and Resolution of Qual and RMA Device Issues pertaining to defectivity and intrinsic reliability: Debug and identify root cause and failures in reliability tests by electric failure analysis(EFA) and Physical Failure Analysis (PFA) and drive for resolution and improvements through cross functional team collaboration. Process Conversions and HVM: The role involves providing recommendation to fab teams for new process conversions to reduce cost, increase yields. This is critical as it directly impacts the yield, quality, reliability, and performance of HBM products, which are key components in many modern technologies.</li

Senior/Staff/Principal Engineer, HIG-HBM Product System & Engineering (Media Health Reliability Coding) — Fab 10A, Singapore. Apply via Workday.

Senior/Staff/Principal Engineer, HIG-HBM Product System & Engineering (Media Health Manufacturing) — Fab 10A, Singapore. Apply via Workday.