Td Media And Collaterals Development Engineer Jobs

Principal Engineer, TD Device Characterization — Hyderabad - Phoenix Aquila, India. Apply via Workday.

Staff/Principal Engineer, NAND TD, RDA — Fab 10N/X, Singapore. Apply via Workday.

Principal Engineer, NAND TD, RDA — Fab 10N/X, Singapore. Apply via Workday.

SHIFT ENGINEER, TD MFG DEV ENGG — Fab 10N/X, Singapore. Apply via Workday.

Staff Engineer, NAND TD, RDA — Fab 10N/X, Singapore. Apply via Workday.

SENIOR ENGINEER, F10 TD PLANNING SIC — Fab 10N/X, Singapore. Apply via Workday.

Senior/Staff Engineer, TD Device Characterization — Hyderabad - Phoenix Aquila, India. Apply via Workday.

Sr. Assembly TD Engineer: Advance PKG stacking — Taichung - Fab 16, Taiwan. Apply via Workday.

SNR/STAFF SHIFT ENGINEER LEAD, TD MFG DEV ENGG — Fab 10N/X, Singapore. Apply via Workday.

Sr Category Supplier Manager II, TD Procurement Die Level Packaging — Taichung - MTB, Taiwan. Apply via Workday.

Principal/Staff Engineer, PCVD Film Deposition, TD — Fab 10N/X, Singapore. Apply via Workday.

Job Details: Job Description: As a Material Analysis (MA) Technician, you will be part of a Technology Development (TD) and High-Volume Manufacturing (HVM) lab responsible for performing material analysis and failure analysis in support of Intel's silicon process development and high-volume production. You will work on developing imaging, composition analysis and sample preparation techniques, and best-known methods (BKMs) to improve lab analysis quality, efficiency and output. You will directly interface with TD and HVM fab customers and quality/reliability engineers to develop solutions to problems by utilizing lab capabilities. The scope may include wafer and unit level, front-end modules and back-end/far back-end modules. Responsibilities may include but not be limited to: • Conducting hands-on analysis by effectively utilizing lab techniques, from sample prep micro-cleaver, ion mill etcher, mechanical polish to SEM/EDX, Dual beam FIB, TEM techniques to characterize Si fabricated structures at nanometer scales and integrated circuit device to improve process, performance and reliability; and to identify physical failure mode toward the root-cause identification. • Conducting hands-on data collection with various lab equipment’s, and assisting engineers to implement materials characterization techniques to determine fundamental thin film material structure/properties and to collaborate with process development engineers across functional areas and organizations to improve process performance and reliability. • Supporting and sustaining lab equipment. Ensuring that lab analytical capabilities needed to support advanced transistor and interconnect technology and/or product development are in place. Cooperating with other lab areas beyond local MA/FA (Failure Analysis) labs to achieve

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The TD Electrical Device Characterization team pushes the boundaries of Micron’s memory technology. We explore device behavior, uncover insights through data, and collaborate across engineering teams to enable next-generation products. We are a hands-on team that values curiosity, precision, technical rigor, and collaboration. In this role, you will drive electrical characterization for advanced memory technologies and partner with device, process, and product teams to turn measurements into actionable technical insights. Your work will help guide technology development and shape the performance and reliability of future NAND, DRAM, and emerging memory products. Responsibilities: Lead electrical characterization for advanced memory devices Develop measurement methods, algorithms, and scalable characterization standards Automate data pipelines and analysis using Python, JSL, C/C&#43;&#43;, and dashboard tools Architect test setups and manage wafer probe and ATE test flows Investigate device behavior, identify root causes, and communicate technical findings Minimum Qualifications: <span style="color:#6

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Site Inventory Control (SIC) team is at the forefront of our ambitious expansion efforts. SIC plays a pivotal role in connecting wafer starts, inventory strategy, cycle time management, output delivery, and factory execution. As a Senior Engineer for Fab 4 HVM SIC, you will be the operational hub, driving alignment between Technology Development (TD), High Volume Manufacturing (HVM), Probe, Supply Chain, Planning, and Engineering organizations. This outstanding opportunity allows you to lead the charge in optimizing inventory and cycle time performance while ensuring flawless factory execution! We are looking for individuals who thrive on collaboration and tackling complex operational challenges. You'll have the chance to bring to bear data to drive decisions and implement AI-enabled solutions to improve speed, accuracy, and decision-making. Responsibilities: Lead multi-functional initiatives for wafer starts, inventory, cycle time, and output performance to support business commitments Develop and improve inventory control methodologies, business processes, and operational metrics and recommend corrective actions Develop and implement inventory, priority, and capacity strategies for New Product Introduction (NPI) programs Foster coordination between Technology Development, High Volume Manufacturing, Supply Chain, Planning, and Engineering teams to optimize inventory positions and factory flow Identify and mitigate constraints, risks, and op

Job Details: Job Description: Embark with us on a journey of growth and transformation as we create exceptionally engineered technology and bring AI everywhere. As a valued team member, your adaptability and attention to detail will contribute to our drive for results and relentless pursuit of quality, ensuring we meet our customers' needs with precision. Life at Intel: https://jobs.intel.com/en/life-at-intel As a Yield Development Engineer, you will be at the forefront of advancing Intel's cutting-edge process technologies within our Logic Technology Development (LTD) organization. This pivotal role involves identifying root cause yield limiters and driving solutions that enhance manufacturability and yield across technology nodes. You will work within a dynamic, fast-paced environment to ensure the successful introduction of new products, process improvements, and robust methodologies to meet manufacturing goals. Your expertise will directly contribute to Intel's ability to deliver world-class semiconductor solutions and advance the future of computing. About Intel Foundry At Intel, the Foundry Technology Development (TD) unit is the driving force behind Moore's Law, enabling us to create groundbreaking technology that enriches lives globally. With over 15,000 dedicated employees, Foundry TD spearheads innovative research, develops next-generation processes and packaging technologies, and manages high-volume manufacturing in state-of-the-art facilities. Within Intel Foundry TD, our Logic Technology Development (LTD) organization is at the forefront of creating and refining each process technology node, paving the way for tomorrow's computing solutions. Your responsibilities as a Product Yield Development Eng