Thin Films Process Development Engineer Jobs

Thin Films Process Development Engineer — Boise, ID - Main Site. Apply via Workday.

Experienced- R&D Thin Films Process Development Engineer Advanced DRAM (Evergreen) — Boise, ID - Main Site. Apply via Workday.

R&D Thin Films Process Development Engineer Advanced DRAM — Boise, ID - Main Site. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we are transforming how the world uses information to enrich life through innovative memory and storage solutions. The DRAM Thin Films Process Engineering team develops advanced materials and deposition processes that enable future memory scaling, improved device performance, and next-generation semiconductor technology. Our team works at the forefront of process development to support DRAM technologies that power artificial intelligence, cloud computing, and data-intensive applications. As a DRAM Thin Films Process Engineering Intern, you will work alongside experienced engineers on a high-impact summer project focused on semiconductor process development and optimization. This role provides hands-on experience with experimental design, process characterization, data analysis, and multi-functional collaboration. You will contribute to real engineering challenges and present your results to technical and leadership audiences at the conclusion of the internship. Responsibilities Research and develop innovative solutions that support next-generation memory technology and thin film process advancement. Develop, complete, and analyze experiments to improve thin films process performance, manufacturability, and product quality. Apply statistical analysis, data science techniques, and AI-enabled tools to identify process trends, optimize performance, and accelerate engineering decision-making. Partner with process, equipment, and integration engineering teams to solve complex technic

Intern - Process Development Engineer, Thin Films — Boise, ID - Main Site. Apply via Workday.

Principal Engineer, NAND Advanced Thin Films Process Development — Fab 10N/X, Singapore. Apply via Workday.

Job Details: Job Description: The Thin Films Senior Process Engineer will support PVD, CVD, and ALD technologies for dielectric and metal thin-film deposition in a high-volume manufacturing environment. Key Responsibilities Apply advanced expertise in thin-film deposition processes to drive continuous improvement in process performance, sustainment, and technology development. Collaborate with upstream and downstream partners to deliver manufacturing improvements through strong cross-functional engagement and stakeholder management. Own manufacturing processes and/or equipment, ensuring achievement of key performance indicators (KPIs) including safety, quality, cost, productivity, defect reduction, and yield improvement. Develop and execute strategic plans for complex projects, coordinating timelines and dependencies across multiple teams and initiatives. Support manufacturing capacity expansion and technology transfer activities to enable successful ramp-to-volume production. Partner with equipment vendors and cross-functional stakeholders to troubleshoot technical challenges, improve tool performance, and enhance operational efficiency. Lead process development initiatives that support current and next-generation high-volume manufacturing technologies. Design and optimize excursion prevention and detection systems to strengthen process control and minimize manufacturing risk. Lead equipment installation, conversion, qualification, and readiness activities during factory ramps, ensuring all tools are deployed safely, on schedule, and in compliance with quality and manufacturing standards. Drive root cause analysis and implement corrective actions to resolve process and equipment-related issues while improving overall manufacturing stability and performance. <p st

Senior Engineer – Process Development, Thin Films (CVD/Diffusion) NAND — Fab 10N/X, Singapore. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Chemistry Lab plays a critical role in advancing semiconductor technology by developing analytical methods that support materials understanding, process development, defect characterization, and next-generation memory innovation. The team applies advanced chemical, optical, and surface characterization techniques to solve complex materials challenges across semiconductor manufacturing and research. We are seeking a highly motivated summer intern to contribute to advanced spectroscopy and nanoscale characterization projects focused on semiconductor thin films, surfaces, interfaces, and process-induced material changes. Working alongside scientists and engineers in Corporate Labs, the intern will develop and apply spectroscopy-based characterization methods, analyze complex materials datasets, and gain experience in experimental design, data analytics, and semiconductor materials research within an industrial laboratory environment. Responsibilities Conduct experiments using advanced spectroscopy and microscopy techniques to characterize semiconductor thin films, surfaces, interfaces, and related materials. Collect, process, analyze, and interpret spectroscopy data, including photoluminescence, fluorescence lifetime, Raman, and AFM-IR datasets, and develop visualization workflows to communicate results. Correlate spectroscopic signatures with material properties, process conditions, surface states, and defect behavior while colla

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Thin Films Equipment Engineering team at Micron develops and enhances advanced semiconductor manufacturing equipment in a fast-paced research and development environment. The team works closely with Process Engineering, Facilities Engineering, and equipment suppliers to enable next-generation memory technologies and achieve world-class equipment performance. Through innovation, collaboration, and data-driven decision-making, the team plays a critical role in advancing semiconductor technology development. As a Thin Films Equipment Engineering Intern, you will gain hands-on experience working with groundbreaking semiconductor equipment and processes. You will support engineering projects focused on equipment optimization, data analysis, and technology development while collaborating with multi-functional teams. This role provides exposure to semiconductor manufacturing, experimental design, and the application of advanced analytics to solve complex engineering challenges. Responsibilities Collect, analyze, and interpret equipment and process data to find opportunities for performance optimization and continuous improvement. Support structured engineering experiments, document findings, and communicate results through technical reports and presentations. Collaborate with Equipment Engineering, Process Engineering, Facilities Engineering, and equipment suppliers to address technology-development challenges and improve equipment performance. Develop an understanding of equipment hardware,

Job Details: Job Description: As a Material Analysis (MA) Technician, you will be part of a Technology Development (TD) and High-Volume Manufacturing (HVM) lab responsible for performing material analysis and failure analysis in support of Intel's silicon process development and high-volume production. You will work on developing imaging, composition analysis and sample preparation techniques, and best-known methods (BKMs) to improve lab analysis quality, efficiency and output. You will directly interface with TD and HVM fab customers and quality/reliability engineers to develop solutions to problems by utilizing lab capabilities. The scope may include wafer and unit level, front-end modules and back-end/far back-end modules. Responsibilities may include but not be limited to: • Conducting hands-on analysis by effectively utilizing lab techniques, from sample prep micro-cleaver, ion mill etcher, mechanical polish to SEM/EDX, Dual beam FIB, TEM techniques to characterize Si fabricated structures at nanometer scales and integrated circuit device to improve process, performance and reliability; and to identify physical failure mode toward the root-cause identification. • Conducting hands-on data collection with various lab equipment’s, and assisting engineers to implement materials characterization techniques to determine fundamental thin film material structure/properties and to collaborate with process development engineers across functional areas and organizations to improve process performance and reliability. • Supporting and sustaining lab equipment. Ensuring that lab analytical capabilities needed to support advanced transistor and interconnect technology and/or product development are in place. Cooperating with other lab areas beyond local MA/FA (Failure Analysis) labs to achieve

Principal Engineer – Process Development, Thin Film (CVD/Diffusion), NAND — Fab 10N/X, Singapore. Apply via Workday.

Member of Technical Staff, NAND Advanced Thin Films Process Development — Fab 10N/X, Singapore. Apply via Workday.

Distinguished Member of Technical Staff, NAND Advanced Thin Films Process Development — Fab 10N/X, Singapore. Apply via Workday.

Senior Member of Technical Staff, NAND Advanced Thin Films Process Development — Fab 10N/X, Singapore. Apply via Workday.