MT
📍 Singapore· Full-time
Principal/Staff Advanced Packaging Development Process Engineer — Fab 10A, Singapore. Apply via Workday.
Jobs in Singapore
Advance Backend Tech in Singapore
94 active opportunities · Updated October 2026
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15 jobs
Explore current advance backend tech jobs across Singapore. Filter by work mode, employment type, experience, department, date posted and distance.
M
📍 Singapore· Full-time
Dry Etch Staff/Principal Engineer - Advanced NAND — Fab 10N/X, Singapore. Apply via Workday.
M
📍 Singapore· Full-time
Metro RDA Senior Manager (Package Development for Advanced Packaging) — Fab 10A, Singapore. Apply via Workday.
M
📍 Singapore· Full-time
Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering — Fab 10A, Singapore. Apply via Workday.
M
📍 Singapore· Full-time
Engineer, APTD CEM - Advanced Packaging Equipment Engineering — Fab 10A, Singapore. Apply via Workday.
M
📍 Singapore· Full-time
Engineer, APTD CEM - Advanced Packaging Integration Engineering — Fab 10A, Singapore. Apply via Workday.
M
📍 Singapore· Full-time
Engineer, APTD CEM – Advanced Packaging Wafer Level Technology Engineering — Fab 10A, Singapore. Apply via Workday.
M
📍 Singapore· Full-time
Principal Engineer, NAND Advanced Thin Films Process Development — Fab 10N/X, Singapore. Apply via Workday.
M
📍 Singapore· Full-time
Principal/Senior Engineer, Advanced Package Metrology-Real-Time Defect Analysis (MRDA) — Fab 10A, Singapore. Apply via Workday.
MT
1mo ago
📍 Singapore· Full-time
Principal/Staff, APTD - Advanced Packaging Wafer Level Technology Process Engineer — Fab 10A, Singapore. Apply via Workday.
M
📍 Singapore· Full-time
Member of Technical Staff, NAND Advanced Thin Films Process Development — Fab 10N/X, Singapore. Apply via Workday.
M
📍 Singapore· Full-time
Distinguished Member of Technical Staff, NAND Advanced Thin Films Process Development — Fab 10N/X, Singapore. Apply via Workday.
M
📍 Singapore· Full-time
Senior Member of Technical Staff, NAND Advanced Thin Films Process Development — Fab 10N/X, Singapore. Apply via Workday.
M
Principal/Staff Engineer Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering
Micron📍 Singapore· Full-time
Principal/Staff Engineer Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering — Fab 10A, Singapore. Apply via Workday.
M
Principal/Staff/Senior Engineer, APTD CEM - Advanced Packaging Wafer Level Technology Engineering
Micron📍 Singapore· Full-time
Principal/Staff/Senior Engineer, APTD CEM - Advanced Packaging Wafer Level Technology Engineering — Fab 10A, Singapore. Apply via Workday.
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