Principal Chip Lead in Singapore

Principal Engineer – Process Development, Thin Film (CVD/Diffusion), NAND — Fab 10N/X, Singapore. Apply via Workday.

Principal / Staff Engineer, Embedded Security, Firmware Development (SSD) — MSB, Singapore. Apply via Workday.

Principal/Staff ML/AI Engineer, Product Engineering, STPG — Fab 10N/X, Singapore. Apply via Workday.

Principal Engineer – Process Development, Cell Film, NAND — Fab 10N/X, Singapore. Apply via Workday.

Principal Engineer – Process Development, Wet, NAND — Fab 10N/X, Singapore. Apply via Workday.

PRINCIPAL ENGINEER, SSD VALIDATION — MSB, Singapore. Apply via Workday.

Principal Engineer/MTS, Process Development, Photolithography, NAND — Fab 10N/X, Singapore. Apply via Workday.

Principal/Staff Engineer, Process Integration, NTI NAND — Fab 10N/X, Singapore. Apply via Workday.

Principal Engineer, NAND Advanced Thin Films Process Development — Fab 10N/X, Singapore. Apply via Workday.

Principal Engineer, NAND TD, RDA — Fab 10N/X, Singapore. Apply via Workday.

Principal Engineer Advanced Package Technology Development — Fab 10N/X, Singapore. Apply via Workday.

PRINCIPAL ENGINEER, SSD VALIDATION — MSB, Singapore. Apply via Workday.

Principal Business Intelligence Analyst, SMAI — Fab 10N/X, Singapore. Apply via Workday.

Principal Device Engineer, or MTS — Fab 10A, Singapore. Apply via Workday.

Principal Engineer, Product Engineering, Media Health Reliability, HIG-HBM — Fab 10A, Singapore. Apply via Workday.